公开(公告)号：US5066545A

公开(公告)日：1991-11-19

申请号：US464230

申请日：1990-01-12

Applicant: Daniel R. Walsh

Inventor： Daniel R. Walsh

IPC: C23C18/22 ,  H05K3/02 ,  H05K3/18 ,  H05K3/38 ,  B32B15/08

CPC classification number: C23C18/22 ,  H05K3/181 ,  H05K3/38 ,  H05K3/381 ,  H05K2201/0154 ,  H05K2201/0344 ,  H05K2203/122 ,  H05K3/022 ,  Y10T428/12569 ,  Y10T428/1291

Abstract: Polyimide-metal laminates are formed by etching the surfaces of a polyimide web with a glycol-containing etchant followed by electroless nickel or cobalt deposition and then by copper deposition. The glycol-containing etchant can be utilized to form through holes through the web.

Abstract translation: 通过用含二醇的蚀刻剂蚀刻聚酰亚胺网的表面，然后通过无电镀镍或钴沉积，然后通过铜沉积来形成聚酰亚胺金属层压体。 可以使用含二醇的蚀刻剂来形成穿过网的通孔。