公开(公告)号：US20190371538A1

公开(公告)日：2019-12-05

申请号：US16208657

申请日：2018-12-04

Applicant: Darfon Electronics Corp.

Inventor： Heng-Yi HUANG ,  Hsin-Cheng HO ,  Tsai-Yu CHEN ,  Hung-Chuan CHENG

IPC: H01H3/12 ,  F21V8/00 ,  H01H13/83

Abstract: A light source board includes a substrate, a composite circuit layer on the substrate, a first protective layer on the composite circuit layer, and a plurality of light sources on the pad portions, respectively. The substrate has a long side, a first short side, and a second short side. The composite circuit layer includes a first conductive trace layer and a second conductive trace layer stacked on the first conductive trace layer. A conductivity of the second conductive trace layer is higher than a conductivity of the first conductive trace layer. The composite circuit layer has a wire portion formed of at least the first conductive trace layer and a plurality of pad portions each formed of at least the first conductive trace layer and the second conductive trace layer. The wire portion is electrically coupled to the pad portions. The first protective layer exposes the pad portions.

公开(公告)号：US20190371537A1

公开(公告)日：2019-12-05

申请号：US16208645

申请日：2018-12-04

Applicant: Darfon Electronics Corp.

Inventor： Heng-Yi HUANG ,  Hsin-Cheng HO ,  Tsai-Yu CHEN ,  Hung-Chuan CHENG

IPC: H01H3/12 ,  F21V8/00 ,  H01H13/83

Abstract: A light source board includes a substrate, a composite circuit layer on the substrate, a first protective layer on the composite circuit layer, and a plurality of light sources on the pad portions, respectively. The substrate has a long side, a first short side, and a second short side. The composite circuit layer includes a first conductive trace layer and a second conductive trace layer stacked on the first conductive trace layer. A conductivity of the second conductive trace layer is higher than a conductivity of the first conductive trace layer. The composite circuit layer has a wire portion formed of at least the first conductive trace layer and a plurality of pad portions each formed of at least the first conductive trace layer and the second conductive trace layer. The wire portion is electrically coupled to the pad portions. The first protective layer exposes the pad portions.