公开(公告)号：US4574879A

公开(公告)日：1986-03-11

申请号：US584897

申请日：1984-02-29

Applicant: David C. DeGree ,  Herbert J. Fick ,  Bruce H. Juenger

Inventor： David C. DeGree ,  Herbert J. Fick ,  Bruce H. Juenger

IPC: H01L23/32 ,  B32B27/34 ,  F28F3/00 ,  B32B25/20 ,  B32B33/00 ,  H05K7/20

CPC classification number: B32B27/34 ,  Y10T428/31663 ,  Y10T428/31721

Abstract: A thermally conductive electrically insulative laminate for use as chassis barriers in combination with solid-state electronic devices, the laminate comprising at least three layers and including a pair of outer layers disposed on opposite sides of a center layer. The center layer comprises a film of a polyimide (amide) filled with a quantity of either aluminum oxide or boron nitride particulate solids and included in an amount ranging from between about 10% to about 50% by volume. The outer layers consist essentially of silicone base rubber, and are preferably filled with a quantity of aluminum oxide or boron nitride particulate solids in an amount ranging from between about 25% and 50% by volume.

Abstract translation: 一种导热电绝缘层压板，用作与固态电子器件组合的底盘屏障，该层压体包括至少三层并且包括设置在中心层的相对侧上的一对外层。 中心层包括填充有一定数量的氧化铝或氮化硼颗粒固体的聚酰亚胺（酰胺）的膜，其含量范围为约10体积％至约50体积％。 外层基本上由硅酮基橡胶组成，并且优选地以一定量的约25体积％至50体积％的量填充一定数量的氧化铝或氮化硼颗粒固体。

公开(公告)号：US4666545A

公开(公告)日：1987-05-19

申请号：US625140

申请日：1984-06-27

Applicant: David C. DeGree ,  Carl R. Bergquist ,  Dallas R. Humphrey ,  Roger A. West

Inventor： David C. DeGree ,  Carl R. Bergquist ,  Dallas R. Humphrey ,  Roger A. West

IPC: H01L21/48 ,  H01L23/373 ,  H01L23/40 ,  H05K3/30 ,  H05K13/02 ,  B32B31/18 ,  F28F7/00 ,  H01B19/04

CPC classification number: H01L21/4803 ,  H01L23/3735 ,  H01L23/4006 ,  H05K13/02 ,  H05K3/301 ,  H01L2023/405 ,  H01L2924/0002 ,  Y10T156/1056 ,  Y10T156/1064 ,  Y10T156/1089

Abstract: A mounting pad means for use in combination with solid-state semiconductive translating devices and including a base pad with flange walls extending from said base pad, and with device mounting pad means being secured to the surface of the base pad and comprising a thin layer of silicone base rubber. The base pad and flange walls are formed of a generally rigid laminate with a core having outer metal foil layers disposed on opposite surfaces thereof, and wherein the core is composed of a thin layer of silicone base rubber.

Abstract translation: 一种用于与固态半导体平移装置组合使用的安装垫装置，并且包括具有从所述基座延伸的凸缘壁的基座，并且装置安装垫装置被固定到基座的表面，并且包括薄层 硅胶基橡胶。 基垫和凸缘壁由具有设置在其相对表面上的外金属箔层的芯的大致刚性的层压体形成，并且其中芯由硅树脂基底橡胶的薄层构成。

公开(公告)号：US4602125A

公开(公告)日：1986-07-22

申请号：US732582

申请日：1985-05-10

Applicant: Roger A. West ,  Dallas R Humphrey ,  Carl R. Bergquist ,  David C. DeGree

Inventor： Roger A. West ,  Dallas R Humphrey ,  Carl R. Bergquist ,  David C. DeGree

IPC: H01L23/373 ,  H01L23/40 ,  H01B17/56 ,  H01L23/14 ,  H05K7/00

CPC classification number: H01L23/3737 ,  H01L23/4006 ,  H01L2023/4031 ,  H01L2023/405 ,  H01L2023/4087 ,  H01L2924/0002 ,  H01L2924/3011 ,  Y10S277/919

Abstract: A thermally conductive electrically insulative laminate for use as a mounting pad and electrical chassis barrier for use with solid-state electronic devices. The pad includes a number of bores with tubular projections extending outwardly therefrom for insulatively protecting the shanks of the mounting screws, bolts or other conductive materials from contact with the substrate. Additionally, the tubular projections are provided with radially extending retention burrs for mechanically holding the mounting pad in place on a substrate pending actual mounting of a semiconductor device thereon.

Abstract translation: 用作固体电子器件的安装焊盘和电气底板屏障的导热电绝缘层压板。 该垫包括多个孔，其具有向外延伸的管状突起，用于绝缘地保护安装螺钉，螺栓或其他导电材料的柄与基底接触。 此外，管状突起设置有径向延伸的保持毛刺，用于将安装垫机械地保持在衬底上的适当位置，等待半导体器件在其上的实际安装。

公开(公告)号：US5463530A

公开(公告)日：1995-10-31

申请号：US203709

申请日：1994-02-28

Applicant: David C. DeGree

Inventor： David C. DeGree

IPC: H01L23/367 ,  H01L23/40 ,  H05K1/02 ,  H05K7/20

CPC classification number: H05K1/0209 ,  H01L23/367 ,  H01L23/4006 ,  H01L2023/4062 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K2201/09781 ,  H05K2201/10166 ,  H05K2201/10416 ,  H05K2203/1572

Abstract: An apparatus for carrying semiconductor mounting devices in back-to-back arrangement is disclosed in which a central substantially planar thermally conductive support member is provided with recesses in its top and bottom surfaces of an interlocking congruent shape with the semiconductor devices to be received such that each semiconductor mounting device assembled therein is positively positioned and locked in place and fixed in a manner such that the semiconductor elements mounted on the layered or laminar elements connect directly to circuitry carried on the surfaces of the support member.

Abstract translation: 公开了一种背对背布置半导体安装装置的装置，其中中央的基本平坦的导热支撑构件在其互锁全等形状的顶表面和底表面上设有凹槽，半导体装置将被接收，使得 组装在其中的每个半导体安装装置被正确地定位并锁定在适当位置并且以使得安装在分层或层状元件上的半导体元件直接连接到承载在支撑构件的表面上的电路的方式固定。

公开(公告)号：US4853763A

公开(公告)日：1989-08-01

申请号：US944947

申请日：1986-12-22

Applicant: David C. DeGree ,  Dallas R. Humphrey ,  Carl R. Bergquist ,  Roger A. West

Inventor： David C. DeGree ,  Dallas R. Humphrey ,  Carl R. Bergquist ,  Roger A. West

IPC: H01L21/48 ,  H01L23/373 ,  H01L23/40 ,  H05K3/30 ,  H05K13/02

CPC classification number: H05K13/02 ,  H01L21/4803 ,  H01L23/3735 ,  H01L23/4006 ,  H05K3/301 ,  H01L2023/405 ,  H01L2924/0002

Abstract: A mounting pad means for use in combination with solid-state semiconductive translating devices and including a base pad with flange walls extending from said base pad, and with device mounting pad means being secured to the surface of the base pad and comprising a thin layer of silicone base rubber. The base pad an flange walls are formed of a generally rigid laminate with a core having outer metal foil layers disposed on opposite surfaces thereof, and wherein the core is composed of a thin layer of silicone base rubber.

Abstract translation: 一种用于与固态半导体平移装置组合使用的安装垫装置，并且包括具有从所述基座延伸的凸缘壁的基座，并且装置安装垫装置被固定到基座的表面，并且包括薄层 硅胶基橡胶。 基座的凸缘壁由具有设置在其相对表面上的外部金属箔层的芯的大致刚性的层压体形成，并且其中芯由硅酮基橡胶的薄层构成。

公开(公告)号：US4810563A

公开(公告)日：1989-03-07

申请号：US114855

申请日：1987-10-30

Applicant: David C. DeGree ,  Herbert J. Fick ,  Bruce H. Juenger

Inventor： David C. DeGree ,  Herbert J. Fick ,  Bruce H. Juenger

IPC: B32B15/08 ,  H05K1/00 ,  H05K1/03 ,  H05K1/05 ,  H05K3/24 ,  H05K3/38 ,  H05K3/46

CPC classification number: H05K1/056 ,  B32B15/08 ,  H05K1/0373 ,  H05K1/0346 ,  H05K1/0393 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2201/068 ,  H05K3/244 ,  H05K3/384 ,  H05K3/386 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/256 ,  Y10T428/257 ,  Y10T428/269 ,  Y10T428/31681

Abstract: A thermally conductive laminate structure for use as a mounting base and/or chassis attachment member in combination with solid-state electronic devices, the laminate preferably comprising up to five layers including a pair of outer metallic layers disposed on opposite sides of center composite layers of electrically insulative layers separated by an interposed metallic layer. The center insulative layers are films of polyimide(amide) material, with the polyimide(amide) film being filled with a quantity of aluminum oxide, boron nitride, or other suitable particulate solid in an amount ranging from between about 30% and 100% by weight of polyimide(amide) solids. The outer layers are metallic, with the base member being a metallic pad of copper or aluminum, and with the opposed metallic layer being copper and arranged in a printed circuitry pattern or array.

Abstract translation: 一种导热层叠结构，用作与固态电子器件组合的安装基座和/或底座附接构件，该层压体优选地包括多达五层，包括一对外金属层，其设置在中心复合层的相对侧上 由绝缘层隔开的电绝缘层。 中心绝缘层是聚酰亚胺（酰胺）材料的膜，其中聚酰亚胺（酰胺）膜用一定量的氧化铝，氮化硼或其它合适的颗粒固体填充量为约30％至100％ 聚酰亚胺（酰胺）固体的重量。 外层是金属的，底座是铜或铝的金属垫，相对的金属层是铜并以印刷电路图案或阵列布置。

公开(公告)号：US4755249A

公开(公告)日：1988-07-05

申请号：US944979

申请日：1986-12-22

Applicant: David C. DeGree ,  Carl R. Bergquist ,  Dallas R. Humphrey ,  Roger A. West

Inventor： David C. DeGree ,  Carl R. Bergquist ,  Dallas R. Humphrey ,  Roger A. West

IPC: H01L21/48 ,  H01L23/373 ,  H01L23/40 ,  H05K3/30 ,  H05K13/02 ,  B32B31/18 ,  F28F7/00 ,  H01B19/04

CPC classification number: H01L21/4803 ,  H01L23/3735 ,  H01L23/4006 ,  H05K13/02 ,  H05K3/301 ,  H01L2023/405 ,  H01L2924/0002 ,  Y10T156/1056 ,  Y10T156/1064 ,  Y10T156/1089

Abstract: A mounting pad means for use in combination with solid-state semiconductive translating devices and including a base pad with flange walls extending from said base pad, and with device mounting pad means being secured to the surface of the base pad and comprising a thin layer of silicone base rubber. The base pad an flange walls are formed of a generally rigid laminate with a core having outer metal foil layers disposed on opposite surfaces thereof, and wherein the core is composed of a thin layer of silicone base rubber.

Abstract translation: 一种用于与固态半导体平移装置组合使用的安装垫装置，并且包括具有从所述基座延伸的凸缘壁的基座，并且装置安装垫装置被固定到基座的表面，并且包括薄层 硅胶基橡胶。 基座的凸缘壁由具有设置在其相对表面上的外部金属箔层的芯的大致刚性的层压体形成，并且其中芯由硅酮基橡胶的薄层构成。