公开(公告)号：US12087659B2

公开(公告)日：2024-09-10

申请号：US17005376

申请日：2020-08-28

Applicant: DELPHI TECHNOLOGIES IP LIMITED

Inventor： Binghua Pan ,  Wai Kwan Wong ,  David W. Ihms

IPC: H01L23/373 ,  B22D19/04 ,  H01L23/367

CPC classification number: H01L23/3735 ,  B22D19/04 ,  H01L23/3677 ,  H01L23/3736 ,  H01L23/3738

Abstract: An automotive power package includes a heat sink layer fabricated onto at least one surface of the automotive power package. The heat sink layer includes a material having a thermal conductivity higher than 130 W/m-K and a coefficient of thermal expansion between 5 and 15 ppm/° C.

公开(公告)号：US12063739B2

公开(公告)日：2024-08-13

申请号：US17765773

申请日：2020-12-07

Applicant: Delphi Technologies IP Limited

Inventor： Kok Wee Yeo ,  Wai Kwan Wong ,  Andreas Aye

IPC: H05K1/11 ,  H05K3/00 ,  H05K3/32

CPC classification number: H05K1/11 ,  H05K3/0011 ,  H05K3/32 ,  H05K2201/09045

Abstract: A printed circuit board (PCB) (4) including an upper surface having one or more electrical terminals (9) thereon, said terminal adapted for connection to corresponding terminal of one or more electrical components, and further including one or more platforms (10) fabricated thereon, said platforms being located adjacent to corresponding component terminals, said platforms being adapted to support an electrical component thereupon, such that a portion of the component overhangs said platform above said corresponding PCB terminal.