公开(公告)号：US11506621B2

公开(公告)日：2022-11-22

申请号：US16290171

申请日：2019-03-01

Applicant: DELPHI TECHNOLOGIES IP LIMITED

Inventor： Gregg N. Francisco ,  Kevin M. Gertiser ,  Jack L. Glenn ,  Narendra J. Mane ,  Thomas E. Pritchett ,  Soumyajit Routh ,  Kok Wee Yeo

IPC: G01N25/18 ,  G01N25/00

Abstract: A method for assessing a thermal path associated with an integrated circuit includes identifying a heat application mode based on a design type of the integrated circuit. The method also includes measuring a first temperature of at least one thermal sensing device associated with the integrated circuit. The method also includes applying heat to at least a portion of the integrated circuit according to the heat application mode. The method also includes measuring a second temperature of the at least one thermal sensing device. The method also includes determining a difference between the first temperature and the second temperature. The method also includes determining whether a thermal path between the integrated circuit and an associated substrate is sufficient based on a comparison of the difference between the first temperature and the second temperature with a predetermined difference between an initial temperature and a subsequent temperature of the at least one thermal sensing device.

公开(公告)号：US12063739B2

公开(公告)日：2024-08-13

申请号：US17765773

申请日：2020-12-07

Applicant: Delphi Technologies IP Limited

Inventor： Kok Wee Yeo ,  Wai Kwan Wong ,  Andreas Aye

IPC: H05K1/11 ,  H05K3/00 ,  H05K3/32

CPC classification number: H05K1/11 ,  H05K3/0011 ,  H05K3/32 ,  H05K2201/09045

Abstract: A printed circuit board (PCB) (4) including an upper surface having one or more electrical terminals (9) thereon, said terminal adapted for connection to corresponding terminal of one or more electrical components, and further including one or more platforms (10) fabricated thereon, said platforms being located adjacent to corresponding component terminals, said platforms being adapted to support an electrical component thereupon, such that a portion of the component overhangs said platform above said corresponding PCB terminal.

公开(公告)号：US20200278309A1

公开(公告)日：2020-09-03

申请号：US16290171

申请日：2019-03-01

Applicant: DELPHI TECHNOLOGIES IP LIMITED

Inventor： Gregg N. Francisco ,  Kevin M. Gertiser ,  Jack L. Glenn ,  Narendra J. Mane ,  Thomas E. Pritchett ,  Soumyajit Routh ,  Kok Wee Yeo

IPC: G01N25/18

Abstract: A method for assessing a thermal path associated with an integrated circuit includes identifying a heat application mode based on a design type of the integrated circuit. The method also includes measuring a first temperature of at least one thermal sensing device associated with the integrated circuit. The method also includes applying heat to at least a portion of the integrated circuit according to the heat application mode. The method also includes measuring a second temperature of the at least one thermal sensing device. The method also includes determining a difference between the first temperature and the second temperature. The method also includes determining whether a thermal path between the integrated circuit and an associated substrate is sufficient based on a comparison of the difference between the first temperature and the second temperature with a predetermined difference between an initial temperature and a subsequent temperature of the at least one thermal sensing device.