公开(公告)号：US20050014313A1

公开(公告)日：2005-01-20

申请号：US10397605

申请日：2003-07-17

Applicant: Derek Workman ,  Arun Chaudhuri ,  Eric Berg

Inventor： Derek Workman ,  Arun Chaudhuri ,  Eric Berg

IPC: H01L21/56 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L24/27 ,  H01L21/563 ,  H01L24/29 ,  H01L2224/16225 ,  H01L2224/29036 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01075 ,  H01L2924/12042 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49176 ,  Y10T29/49179 ,  H01L2924/00 ,  H01L2924/3512

Abstract: A process for selectively depositing a filled underfill material onto a die surface without covering solder bumps present on the die. The process entails microjetting a polymer matrix material, a filler material, and optionally a fluxing material onto the die surface. Together, the polymer matrix and filler materials define the filled underfill material in which the filler material is dispersed to reduce the coefficient of thermal expansion of the underfill material. The resulting underfill material surrounds but does not cover the solder bumps. The die is then placed on a substrate on which a second underfill material is present, forming a composite underfill layer that completely fills the space between the die and substrate and forms a fillet on a peripheral wall of the die.

Abstract translation: 用于将填充的底部填充材料选择性地沉积到模具表面上而不覆盖存在于管芯上的焊料凸块的工艺。 该方法需要将聚合物基质材料，填充材料以及任选的助熔材料微粒喷射到模具表面上。 聚合物基质和填料材料一起限定了填充材料分散在其中的填充的底部填充材料，以降低底部填充材料的热膨胀系数。 产生的底部填充材料围绕但不覆盖焊料凸块。 然后将模具放置在其上存在第二底部填充材料的基底上，形成完全填充模具和基底之间的空间的复合底部填充层，并在模具的周壁上形成圆角。

公开(公告)号：US20050122697A1

公开(公告)日：2005-06-09

申请号：US10730608

申请日：2003-12-08

Applicant: Derek Workman ,  Arun Chaudhuri ,  David Ihms

Inventor： Derek Workman ,  Arun Chaudhuri ,  David Ihms

IPC: C09K19/54 ,  H01L23/29 ,  H05K1/18

CPC classification number: C09K19/544 ,  H01L23/293 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An electrical component having improved impact resistance and improved tolerance for thermal cycling, without sacrificing high-temperature performance, and without requiring unconventional and expensive manufacturing techniques includes an electric device mounted on a substrate circuit board, and a composite material underfilling, overmolding or encapsulating the electronic device, wherein the composite material includes a thermoset matrix phase and a discontinuous liquid crystal polymer phase dispersed throughout the thermoset matrix phase.

Abstract translation: 具有改善的耐冲击性和改善的耐热循环性的电气部件，而不牺牲高温性能，并且不需要非常规和昂贵的制造技术包括安装在基板电路板上的电气装置，以及填充，包覆成型或封装 电子器件，其中复合材料包括分散在整个热固性基体相中的热固性基质相和不连续的液晶聚合物相。

公开(公告)号：US20060252892A1

公开(公告)日：2006-11-09

申请号：US11121206

申请日：2005-05-03

Applicant: Rafil Basheer ,  Derek Workman ,  Arun Chaudhuri ,  Mohamed Bouguettaya

Inventor： Rafil Basheer ,  Derek Workman ,  Arun Chaudhuri ,  Mohamed Bouguettaya

IPC: C08L63/00

CPC classification number: C08L101/005 ,  C08L63/00 ,  C08L67/04 ,  C08L2666/14

Abstract: The present invention relates to rigid and clear thermosetting compositions formed from dendritic or hyperbranched polymers and cylcoaliphatic epoxy resins. The compositions may be used for coatings such as electronic device packaging, adhesives, wire coatings, and finishes.

Abstract translation: 本发明涉及由树枝状或超支化聚合物和环脂肪族环氧树脂形成的刚性和透明的热固性组合物。 组合物可以用于涂层，例如电子器件包装，粘合剂，线涂和表面处理。

公开(公告)号：US20060033195A1

公开(公告)日：2006-02-16

申请号：US10919157

申请日：2004-08-16

Applicant: Brian Thompson ,  Charles Delheimer ,  Derek Workman ,  Jeenhuei Tsai ,  Matthew Walsh ,  Scott Brandenburg

Inventor： Brian Thompson ,  Charles Delheimer ,  Derek Workman ,  Jeenhuei Tsai ,  Matthew Walsh ,  Scott Brandenburg

IPC: H01L23/24 ,  H01L23/48

CPC classification number: H05K3/303 ,  H01L21/563 ,  H01L23/3121 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1433 ,  H01L2924/19041 ,  H05K3/284 ,  H05K2201/10674 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/0401

Abstract: An electronic module includes a substrate, at least one surface mounted integrated circuit (IC) component and an underfill material. The substrate includes a plurality of electrically conductive traces, formed on at least one surface of the substrate, and the component is electrically coupled to at least one of the conductive traces. The underfill material is positioned between the component and the substrate and provides at least one pedestal that supports the component during encapsulation. The underfill material, when cured, maintains the integrity of the electrical connections between the component and the conductive traces.

Abstract translation: 电子模块包括基板，至少一个表面安装集成电路（IC）部件和底部填充材料。 衬底包括形成在衬底的至少一个表面上的多个导电迹线，并且该元件电耦合到至少一个导电迹线。 底部填充材料位于组件和衬底之间，并提供在封装期间支撑组件的至少一个底座。 底部填充材料固化时，保持组件和导电迹线之间的电连接的完整性。

公开(公告)号：US20060214299A1

公开(公告)日：2006-09-28

申请号：US11088101

申请日：2005-03-23

Applicant: M. Ray Fairchild ,  Dwadasi Sarma ,  Derek Workman ,  Daniel Harshbarger

Inventor： M. Ray Fairchild ,  Dwadasi Sarma ,  Derek Workman ,  Daniel Harshbarger

IPC: H01L23/52

CPC classification number: H01L23/142 ,  H01L21/563 ,  H01L23/5385 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15311 ,  H01L2924/30107 ,  H05K1/0306 ,  H05K1/053 ,  H05K1/141 ,  H05K3/284 ,  H05K3/3436 ,  H05K2201/0212 ,  H05K2201/10977 ,  H01L2924/00 ,  H01L2224/0401

Abstract: An electronic assembly includes a first substrate and a second substrate. The first substrate includes a first surface having a first plurality of conductive traces formed on an electrically non-conductive layer. The second substrate includes a first surface having a second plurality of conductive traces formed thereon and a second surface having a third plurality of conductive traces formed thereon. A first electronic component is electrically coupled to one or more of the plurality of conductive traces on the first surface of the second substrate. At least one of a plurality of conductive interconnects is incorporated within each solder joint that electrically couples one or more of the conductive traces formed on the second surface of the second substrate to one or more of the conductive traces formed on the first substrate.

Abstract translation: 电子组件包括第一基板和第二基板。 第一衬底包括具有形成在非导电层上的第一多个导电迹线的第一表面。 第二基板包括具有形成在其上的第二多个导电迹线的第一表面和形成有第三多个导电迹线的第二表面。 第一电子部件电耦合到第二基板的第一表面上的多个导电迹线中的一个或多个。 多个导电互连件中的至少一个结合在每个焊接接头内，将形成在第二衬底的第二表面上的一个或多个导电迹线电耦合到形成在第一衬底上的一个或多个导电迹线。

公开(公告)号：US20060199301A1

公开(公告)日：2006-09-07

申请号：US11317661

申请日：2005-12-23

Applicant: Rafil Basheer ,  Derek Workman ,  Arun Chaudhuri ,  Mohamed Bouguettaya

Inventor： Rafil Basheer ,  Derek Workman ,  Arun Chaudhuri ,  Mohamed Bouguettaya

IPC: H01L21/00

CPC classification number: H01L21/563 ,  B82Y30/00 ,  C08K2201/011 ,  H01L23/293 ,  H01L23/295 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01063 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322

Abstract: Disclosed is a method for making a low CTE curable composition. In one embodiment, the method comprises mixing together (i) from 0.1 to 60.0% by weight of a nanoparticle composition and (ii) from 20.0 to 90.0% by weight of a curable binder to provide a premixture, based on the total weight of the premixture, and subjecting the premixture to high shear forces until the nanoparticle composition (i) is sufficiently dispersed in the curable binder (ii) to provide a curable composition. It has been found that the nanoparticle composition (i) must be at least one of (a) a strongly functionalized nanoparticle composition having no more than 25 mole % functionalization, (b) a weakly functionalized nanoparticle composition having from 1 to 100 mole % functionalization, (c) a nonfunctionalized nanoparticle composition, or (d) mixtures thereof.

Abstract translation: 公开了一种制备低CTE可固化组合物的方法。 在一个实施方案中，该方法包括将（i）0.1至60.0重量％的纳米颗粒组合物和（ii）20.0至90.0重量％的可固化粘合剂混合在一起，以提供预混合物，基于 预混合物，并使预混合物经受高剪切力，直到纳米颗粒组合物（i）充分分散在可固化粘合剂（ii）中以提供可固化组合物。 已经发现，纳米颗粒组合物（i）必须是（a）具有不超过25摩尔％官能化的强官能化纳米颗粒组合物中的至少一种，（b）具有1至100摩尔％官能度的弱官能化纳米颗粒组合物 ，（c）非官能化纳米颗粒组合物，或（d）其混合物。

公开(公告)号：US20070235217A1

公开(公告)日：2007-10-11

申请号：US11392019

申请日：2006-03-29

Applicant: Derek Workman

Inventor： Derek Workman

IPC: H05K1/16

CPC classification number: H05K3/303 ,  H01L21/563 ,  H01L23/315 ,  H01L24/29 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/10165 ,  H01L2224/11334 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/8114 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K3/3436 ,  H05K2201/09909 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2201/2036 ,  H05K2203/013 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/05599

Abstract: An electronic package having a controlled standoff height between a surface mount electronic device and a substrate includes a plurality of polymeric standoffs adhered to at least one of the underside of the surface mount electronic device or an upper surface of the substrate. The polymeric standoffs prevent collapse of the surface mount electronic device during overmolding or encapsulation of the surface mount electronic device.

Abstract translation: 具有在表面贴装电子器件和衬底之间具有受控的间隔高度的电子封装包括粘附到表面贴装电子器件的下侧中的至少一个或衬底的上表面的多个聚合物支座。 聚合物隔板防止表面贴装电子器件在表面贴装电子器件的过模制或封装期间的塌陷。

公开(公告)号：US20060222860A1

公开(公告)日：2006-10-05

申请号：US11099399

申请日：2005-04-05

Applicant: Rafil Basheer ,  Derek Workman

Inventor： Rafil Basheer ,  Derek Workman

IPC: B32B27/38 ,  C08L63/00 ,  B32B37/00

CPC classification number: C08G59/24 ,  C08G59/4215 ,  C08G59/5033 ,  C08G59/62 ,  Y10T428/31515

Abstract: The thermosetable composition incorporating organo-iodine compounds that provide improved x-ray contrast are prepared by reacting an epoxy resin with crosslinking agents, wherein the crosslinking agents include compounds having iodo-phenyl functionalities, and wherein the iodine atoms include iodine-127 isotope. The resulting thermoset material includes sufficient iodine-127 isotope covalently bound to the polymer matrix to impart excellent x-ray contrast. The cured polymer materials of this invention may be utilized as underfill material for electrical components, thereby facilitating use of x-ray analysis to detect problematic voids in the underfill.

Abstract translation: 包含提供改善的x射线对比度的有机碘化合物的热固性组合物通过使环氧树脂与交联剂反应制备，其中交联剂包括具有碘 - 苯基官能团的化合物，其中碘原子包括碘-127同位素。 所得热固性材料包括与聚合物基质共价结合的足够的碘-127同位素以赋予优异的x射线对比度。 本发明的固化聚合物材料可以用作电气部件的底部填充材料，从而便于使用x射线分析来检测底部填充物中的有问题的空隙。

公开(公告)号：US20060200985A1

公开(公告)日：2006-09-14

申请号：US11435211

申请日：2006-05-15

Applicant: Derek Workman ,  Arun Chaudhuri ,  Eric Berg

Inventor： Derek Workman ,  Arun Chaudhuri ,  Eric Berg

IPC: H01R43/02 ,  H05K3/30

CPC classification number: H01L24/27 ,  H01L21/563 ,  H01L24/29 ,  H01L2224/16225 ,  H01L2224/29036 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01075 ,  H01L2924/12042 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49176 ,  Y10T29/49179 ,  H01L2924/00 ,  H01L2924/3512

Abstract: A process for selectively depositing a filled underfill material onto a die surface without covering solder bumps present on the die. The process entails microjetting a polymer matrix material, a filler material, and optionally a fluxing material onto the die surface. Together, the polymer matrix and filler materials define the filled underfill material in which the filler material is dispersed to reduce the coefficient of thermal expansion of the underfill material. The resulting underfill material surrounds but does not cover the solder bumps. The die is then placed on a substrate on which a second underfill material is present, forming a composite underfill layer that completely fills the space between the die and substrate and forms a fillet on a peripheral wall of the die.

Abstract translation: 用于将填充的底部填充材料选择性地沉积到模具表面上而不覆盖存在于管芯上的焊料凸块的工艺。 该方法需要将聚合物基质材料，填充材料以及任选的助熔材料微粒喷射到模具表面上。 聚合物基质和填料材料一起限定了填充材料分散在其中的填充的底部填充材料，以降低底部填充材料的热膨胀系数。 产生的底部填充材料围绕但不覆盖焊料凸块。 然后将模具放置在其上存在第二底部填充材料的基底上，形成完全填充模具和基底之间的空间的复合底部填充层，并在模具的周壁上形成圆角。