公开(公告)号：US20030111714A1

公开(公告)日：2003-06-19

申请号：US10005703

申请日：2001-12-03

Applicant: Dover Capital Formation Group

Inventor： David A. Bates ,  Stephen J. Oot ,  Robert J. Street ,  Brian L. Rowden

IPC: H01L023/02

CPC classification number: H05K1/0243 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15313 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/182 ,  H05K3/0061 ,  H05K2201/10727 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A surface mount ceramic package, e.g. for a microwave or millimeter wave integrated circuit device, has outer conductive pads that are available for direct connection with traces on the printed circuit board. A metal core or base has spaces at one or more sides, e.g., voids or cutouts, where the outer pads are located. There is a first ceramic layer disposed on the core, with a central cavity for the die, and an upper or second ceramic layer. Printed traces are buried between the two layers, and vias connect the traces with the outer pads. Inner pads are located on a ledge of the first layer adjacent the cavity for connection with electrodes of the die. Each of the first and second ceramic layers may be stacked ceramic tape. The package may be LTCC or HTCC. This construction avoids inductive losses, especially at higher frequencies.

Abstract translation: 表面贴装陶瓷封装，例如 对于微波或毫米波集成电路器件，具有可用于与印刷电路板上的迹线直接连接的外部导电焊盘。 金属芯或基座在一个或多个侧面具有空间，例如空隙或切口，其中外垫位于其中。 存在设置在芯上的第一陶瓷层，具有用于管芯的中心腔和上或第二陶瓷层。 印刷迹线被埋在两层之间，并且通孔将迹线与外部焊盘连接。 内部衬垫位于与腔体相邻的第一层的凸缘上，用于与模具的电极连接。 第一和第二陶瓷层中的每一个可以是层叠的陶瓷带。 包装可能是LTCC或HTCC。 这种结构避免了电感损耗，特别是在较高的频率下。