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公开(公告)号:US10094686B2
公开(公告)日:2018-10-09
申请号:US14821367
申请日:2015-08-07
Applicant: DunAn Sensing LLC
Inventor: Tom T. Nguyen
IPC: G01D11/24 , H01L23/10 , G01L19/14 , G01L19/06 , G12B9/06 , B81C3/00 , B81B7/00 , G01L5/16 , G01D11/26 , B23P11/00 , B81C1/00
Abstract: Apparatus and Methods for fabricating apparatus having a hermetic seal to seal a portion of an apparatus, for example and without limitation, a portion having a MEMS sensor. One such method uses crimping devices to compress a seal in a cavity formed in a housing that includes a MEMS sensor attached to a stress isolator. Under such compression, the seal deforms to hermetically seal surfaces around the inside, outside and bottom of the stress isolator.
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公开(公告)号:US09625342B2
公开(公告)日:2017-04-18
申请号:US14170387
申请日:2014-01-31
Applicant: DunAn Sensing LLC
Inventor: Tom T. Nguyen
IPC: G01L19/14
CPC classification number: G01L19/143 , G01L19/142 , G01L19/145
Abstract: Apparatus having a hermetic seal that seals a portion of the apparatus, for example and without limitation, a portion having a MEMS sensor.
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3.
公开(公告)号:US09581468B2
公开(公告)日:2017-02-28
申请号:US14170355
申请日:2014-01-31
Applicant: DunAn Sensing LLC
Inventor: Tom T. Nguyen
IPC: G01D11/24 , H01L23/10 , G01L19/14 , G01L19/06 , G01L5/16 , B23P11/00 , G01D11/26 , B81B7/00 , B81C1/00
CPC classification number: G01D11/245 , B23P11/005 , B81B7/0032 , B81B2201/0264 , B81C1/00261 , B81C3/00 , B81C2203/019 , G01D11/26 , G01L5/165 , G01L19/0672 , G01L19/14 , G01L19/145 , G12B9/06 , H01L23/10 , Y10T29/49872 , Y10T29/49874 , Y10T29/49913 , Y10T29/49915
Abstract: Methods for fabricating a hermetic seal to seal a portion of an apparatus, for example and without limitation, a portion having a MEMS sensor. One such method uses crimping devices to compress a seal in a cavity formed in a housing that includes a MEMS sensor attached to a stress isolator. Under such compression, the seal deforms to hermetically seal surfaces around the inside, outside and bottom of the stress isolator.
Abstract translation: 用于制造气密密封件以密封装置的一部分的方法,例如但不限于具有MEMS传感器的部分。 一种这样的方法使用压接装置来压缩形成在壳体中的空腔中的密封件,该密封件包括附接到应力隔离器的MEMS传感器。 在这种压缩状态下,密封件变形成密封密封应力隔离器内部,外部和底部的表面。
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公开(公告)号:US09593994B2
公开(公告)日:2017-03-14
申请号:US14516462
申请日:2014-10-16
Applicant: DunAn Sensing LLC
Inventor: Tom T. Nguyen , Cuong D. Nguyen
CPC classification number: G01L13/025 , G01L9/045 , G01L9/065
Abstract: Compensated pressure sensor includes a MEMS pressure sensor die having resistors RA and RD connected in series in a first leg of a Wheatstone bridge and resistors RB and RC connected in series in a second leg of the Wheatstone bridge; a first and second fuse; and a first, second third, fourth, fifth and sixth resistor; wherein: a first end of the first resistor is connected in series with the first leg of the bridge and a first end of the second resistor is connected in series with the second leg of the bridge; the first fuse is connected, at a first end, to a first output of the bridge, and at a second end, to a second end of the third resistor and to a first end of the second fuse; the second fuse is connected, at a second end, to a second output of the bridge; a first end of the third resistor is connected to an input to the bridge and to a first end of the fourth resistor; a second end of the fourth resistor is connected to a second end of the first resistor, a second end of the second resistor and a first end of the sixth resistor; and the fifth resistor is connected, at a first end, to the input to the bridge.
Abstract translation: 补偿压力传感器包括具有在惠斯通电桥的第一段中串联连接的电阻器RA和RD的MEMS压力传感器管芯,以及串联连接在惠斯通电桥的第二段中的电阻器RB和RC; 第一和第二保险丝; 以及第一,第二,第三,第四,第五和第六电阻器; 其中:所述第一电阻器的第一端与所述桥的第一支路串联连接,并且所述第二电阻器的第一端与所述桥的第二支路串联连接; 第一保险丝在第一端处连接到桥的第一输出端,并且在第二端连接到第三电阻器的第二端并连接到第二保险丝的第一端; 第二保险丝在第二端连接到桥的第二输出; 第三电阻器的第一端连接到桥的输入端和第四电阻器的第一端; 第四电阻器的第二端连接到第一电阻器的第二端,第二电阻器的第二端和第六电阻器的第一端; 并且第五电阻器在第一端连接到桥的输入端。
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公开(公告)号:US20160109315A1
公开(公告)日:2016-04-21
申请号:US14516462
申请日:2014-10-16
Applicant: DunAn Sensing LLC
Inventor: Tom T. Nguyen , Cuong D. Nguyen
CPC classification number: G01L13/025 , G01L9/045 , G01L9/065
Abstract: Compensated pressure sensor includes a MEMS pressure sensor die having resistors RA and RD connected in series in a first leg of a Wheatstone bridge and resistors RB and RC connected in series in a second leg of the Wheatstone bridge; a first and second fuse; and a first, second third, fourth, fifth and sixth resistor; wherein: a first end of the first resistor is connected in series with the first leg of the bridge and a first end of the second resistor is connected in series with the second leg of the bridge; the first fuse is connected, at a first end, to a first output of the bridge, and at a second end, to a second end of the third resistor and to a first end of the second fuse; the second fuse is connected, at a second end, to a second output of the bridge; a first end of the third resistor is connected to an input to the bridge and to a first end of the fourth resistor; a second end of the fourth resistor is connected to a second end of the first resistor, a second end of the second resistor and a first end of the sixth resistor; and the fifth resistor is connected, at a first end, to the input to the bridge.
Abstract translation: 补偿压力传感器包括具有在惠斯通电桥的第一段中串联连接的电阻器RA和RD的MEMS压力传感器管芯,以及串联连接在惠斯通电桥的第二段中的电阻器RB和RC; 第一和第二保险丝; 以及第一,第二,第三,第四,第五和第六电阻器; 其中:所述第一电阻器的第一端与所述桥的第一支路串联连接,并且所述第二电阻器的第一端与所述桥的第二支路串联连接; 第一保险丝在第一端处连接到桥的第一输出端,并且在第二端连接到第三电阻器的第二端并连接到第二保险丝的第一端; 第二保险丝在第二端连接到桥的第二输出; 第三电阻器的第一端连接到桥的输入端和第四电阻器的第一端; 第四电阻器的第二端连接到第一电阻器的第二端,第二电阻器的第二端和第六电阻器的第一端; 并且第五电阻器在第一端连接到桥的输入端。
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公开(公告)号:US10168191B2
公开(公告)日:2019-01-01
申请号:US14821459
申请日:2015-08-07
Applicant: DunAn Sensing LLC
Inventor: Tom T. Nguyen
IPC: G01D11/24 , B81C3/00 , B81C1/00 , H01L23/10 , G01L19/14 , G01L19/06 , B23P11/00 , G12B9/06 , B81B7/00 , G01L5/16 , G01D11/26
Abstract: Apparatus and Methods for fabricating apparatus having a hermetic seal to seal a portion of an apparatus, for example and without limitation, a portion having a MEMS sensor. One such method uses crimping devices to compress a seal in a cavity formed in a housing that includes a MEMS sensor attached to a stress isolator. Under such compression, the seal deforms to hermetically seal surfaces around the inside, outside and bottom of the stress isolator.
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公开(公告)号:US10031039B2
公开(公告)日:2018-07-24
申请号:US15434019
申请日:2017-02-15
Applicant: DUNAN SENSING, LLC
Inventor: Tom T. Nguyen , Cuong D. Nguyen
Abstract: Compensated pressure sensor includes a MEMS pressure sensor die having resistors RA and RD connected in series in a first leg of a Wheatstone bridge and resistors RB and RC connected in series in a second leg of the Wheatstone bridge; a first and second fuse; and a first, second, third, fourth, fifth and sixth resistor; wherein: a first end of the first resistor is connected in series with the first leg of the bridge and a first end of the second resistor is connected in series with the second leg of the bridge; the first fuse is connected, at a first end, to a first output of the bridge, and at a second end, to a second end of the third resistor and to a first end of the second fuse; the second fuse is connected, at a second end, to a second output of the bridge; a first end of the third resistor is connected to an input to the bridge and to a first end of the fourth resistor; a second end of the fourth resistor is connected to a second end of the first resistor, a second end of the second resistor and a first end of the sixth resistor; and the fifth resistor is connected, at a first end, to the input to the bridge.
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8.
公开(公告)号:US09506829B2
公开(公告)日:2016-11-29
申请号:US14310881
申请日:2014-06-20
Applicant: DunAn Sensing LLC
Inventor: Tom T. Nguyen , Cuong D. Nguyen
CPC classification number: G01L19/0084 , G01L19/142
Abstract: Pressure sensor package that includes: a pressure sensor support attached to an interconnect housing which is attached to a compensation support; wherein: (a) a pressure sensor device is attached to the pressure sensor support and is electrically connected to pads disposed on the pressure sensor support; (b) compensation circuitry is attached to the compensation support and is electrically connected to pads disposed on the compensation support; (c) connectors disposed in through holes in a wall of the interconnect housing are electrically connected to the pads on the pressure sensor support and to the pads on the compensation support; and (d) a pressure port is disposed in the pressure sensor support.
Abstract translation: 压力传感器封装,其包括:附接到连接到补偿支撑件的互连壳体的压力传感器支架; 其中:(a)压力传感器装置附接到所述压力传感器支撑件并且电连接到设置在所述压力传感器支撑件上的焊盘; (b)补偿电路连接到补偿支撑件,并且电连接到设置在补偿支撑件上的焊盘; (c)设置在互连壳体的壁中的通孔中的连接器电连接到压力传感器支撑件上的焊盘和补偿支撑件上的焊盘; 和(d)压力端口设置在压力传感器支架中。
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