公开(公告)号：US20240271313A1

公开(公告)日：2024-08-15

申请号：US18017613

申请日：2022-06-17

Applicant: EBARA CORPORATION

Inventor： Masaki TOMITA ,  Kentaro YAMAMOTO

IPC: C25D21/08 ,  C25D17/02 ,  C25D17/06 ,  C25D21/12

CPC classification number: C25D21/08 ,  C25D17/02 ,  C25D17/06 ,  C25D21/12

Abstract: Provided is a plating apparatus that allows cleaning a contact cleaning member.
The plating apparatus includes: a plating tank configured to house a plating solution; a substrate holder configured to hold a substrate with a surface to be plated facing downward, the substrate holder including a contact member for feeding power to the substrate; a contact cleaning member 482 for discharging a cleaning liquid to the contact member while the contact cleaning member is at a cleaning position between the plating tank and the substrate holder; a driving mechanism 476 configured to move the contact cleaning member 482 between the cleaning position and a retracted position retracted from between the plating tank and the substrate holder; and a nozzle cleaning cover 489 configured to cover an upper portion of the contact cleaning member 482 while the contact cleaning member 482 is at the retracted position.

公开(公告)号：US20250075363A1

公开(公告)日：2025-03-06

申请号：US17923558

申请日：2021-11-04

Applicant: EBARA CORPORATION

Inventor： Kazuhito TSUJI ,  Kentaro YAMAMOTO

IPC: C25D17/06 ,  B05B13/02 ,  B08B3/02 ,  B08B13/00 ,  H01L21/02

Abstract: A substrate is efficiently cleaned.
A plating module 400 includes: a plating tank 410 configured to accommodate a plating solution; a substrate holder 440 configured to hold a substrate Wf with a surface to be plated Wf-a facing downward; a rotation mechanism 446 configured to rotate the substrate holder 440; an inclination mechanism 447 configured to incline the substrate holder 440; and a substrate cleaning member 472 for cleaning the surface to be plated Wf-a of the substrate Wf held by the substrate holder 440. The substrate cleaning member 472 is configured to discharge a cleaning liquid to the surface to be plated Wf-a of the substrate Wf rotated by the rotation mechanism 446 from a position corresponding to a lower end toward a position corresponding to an upper end of the substrate Wf inclined by the inclination mechanism 447.

公开(公告)号：US20250011966A1

公开(公告)日：2025-01-09

申请号：US18275879

申请日：2022-08-02

Applicant: EBARA CORPORATION

Inventor： Kazuhito TSUJI ,  Kentaro YAMAMOTO

IPC: C25D21/10 ,  C25D5/34 ,  C25D17/06 ,  C25D21/08 ,  C25D21/12

Abstract: A plating method is a plating method for performing a plating process of a substrate with a plating apparatus including a substrate holder including a contact member that conductively contacts the substrate, and includes a step of rotating the substrate holder at a first rotation speed while the substrate holder is tilted, a step of performing discharging of liquid toward the substrate holder rotating at the first rotation speed to supply the liquid to the contact member, a step of stopping the discharging of the liquid, a step of starting decrease of tilt of the substrate holder to a horizontal position concurrently with or within a predetermined time before or after stopping the discharging of the liquid, a step of rotating the substrate holder at a second rotation speed higher than the first rotation speed while the substrate holder is at the horizontal position, and a step of performing the plating process on the substrate after the substrate is attached to the substrate holder.

公开(公告)号：US20240318346A1

公开(公告)日：2024-09-26

申请号：US18026774

申请日：2022-04-21

Applicant: EBARA CORPORATION

Inventor： Shinji OMATA ,  Masaki TOMITA ,  Kentaro YAMAMOTO ,  Yasuyuki MASUDA

IPC: C25D17/00 ,  C25D17/02 ,  C25D17/06 ,  C25D21/04

CPC classification number: C25D17/002 ,  C25D17/02 ,  C25D17/06 ,  C25D21/04

Abstract: Provided is a technique that ensures suppressing deterioration of plating quality of a substrate due to gas bubbles at an anode.
A plating module 400 includes a plating tank 10 configured to house a plating solution, an anode 13 arranged in the plating tank 10, a substrate holder 20 configured to hold a substrate WF with a surface to be plated facing downward so as to be opposed to the anode 13, a membrane module 40 that includes a first membrane 41 partitioning an inside of the plating tank 10 into an anode chamber 11 and a cathode chamber 12 and a second membrane 42 arranged between the first membrane 41 and the anode 13, and a pipe member 31 communicating between a first region R1 below the anode 13 in the plating tank 10 and a second region R2 between the first membrane 41 and the second membrane 42.

公开(公告)号：US20240247396A1

公开(公告)日：2024-07-25

申请号：US18017645

申请日：2022-06-17

Applicant: EBARA CORPORATION

Inventor： Masaki TOMITA ,  Masaya SEKI ,  Kentaro YAMAMOTO

IPC: C25D21/12 ,  C25D5/48 ,  C25D17/00 ,  C25D17/02 ,  C25D17/06 ,  G01M3/16

CPC classification number: C25D21/12 ,  C25D5/48 ,  C25D17/001 ,  C25D17/02 ,  C25D17/06 ,  G01M3/16

Abstract: Provided is a technique that determines presence of a leakage of a plating solution to an arranged region of a contact member.
A leakage determination method includes: discharging step 120 of discharging a cleaning liquid to the contact member of a substrate holder after immersing a substrate held by the substrate holder in the plating solution and performing a plating process; a measuring step 122 of measuring a conductivity of the cleaning liquid after cleaning the contact member; and determining step 128 of determining presence or absence of a leakage of the plating solution to the arranged region of the contact member based on comparison between a first conductivity of a cleaning liquid measured in advance for a substrate holder serving as a reference and a second conductivity of the cleaning liquid measured in the measuring step 122.

公开(公告)号：US20240218552A1

公开(公告)日：2024-07-04

申请号：US17923412

申请日：2021-11-04

Applicant: EBARA CORPORATION

Inventor： Kentaro YAMAMOTO ,  Masaki TOMITA ,  Kazuhito TSUJI

IPC: C25D21/08 ,  C25D17/00 ,  C25D17/02 ,  C25D17/06

CPC classification number: C25D21/08 ,  C25D17/005 ,  C25D17/02 ,  C25D17/06

Abstract: A plating module includes: a plating tank configured to accommodate a plating solution; a substrate holder configured to hold a substrate with a surface to be plated facing downward; a rotation mechanism configured to rotate the substrate holder; a contact member 494-4 having a substrate contact point 494-4a for contacting an outer peripheral portion of the surface to be plated of the substrate held by the substrate holder and a main body 494-4b extending above with respect to the substrate contact point 494-4a, and attached to the substrate holder; and a contact cleaning member 482 for discharging a cleaning liquid toward the main body 494-4b of the contact member 494-4 from a lower side of the substrate holder.

公开(公告)号：US20240209538A1

公开(公告)日：2024-06-27

申请号：US17802400

申请日：2021-11-04

Applicant: EBARA CORPORATION

Inventor： Kentaro YAMAMOTO ,  Masaki TOMITA ,  Kazuhito TSUJI

IPC: C25D17/06 ,  C25D17/00 ,  C25D17/02 ,  C25D21/08

CPC classification number: C25D17/06 ,  C25D17/004 ,  C25D17/02 ,  C25D21/08

Abstract: A plating module includes: a plating tank configured to accommodate a plating solution; a substrate holder configured to hold a substrate with a surface to be plated facing downward; an elevating mechanism configured to elevate the substrate holder; a cover member arranged above the plating tank and having a side wall surrounding an elevating path of the substrate holder; an opening/closing mechanism configured to open and close an opening formed in the side wall of the cover member; a substrate cleaning member for discharging a cleaning liquid toward a surface to be plated of a substrate held by the substrate holder; and a driving mechanism configured to move the substrate cleaning member between a cleaning position between the plating tank and the substrate holder and a retracted position retracted from between the plating tank and the substrate holder, through the opening.