公开(公告)号：US20200335394A1

公开(公告)日：2020-10-22

申请号：US16090059

申请日：2017-03-29

Applicant: EBARA CORPORATION

Inventor： Keiichi KURASHINA ,  Taiki ISHITSUKA ,  Shinji OMATA ,  Mitsuhiro SHAMOTO ,  Makoto KUBOTA

IPC: H01L21/768 ,  H01L21/02 ,  H01L23/532 ,  H01L23/00

Abstract: To prevent a tin alloy from coming into contact with a copper wiring layer when a tin alloy bump layer is reflowed. According to an aspect of the present invention, a method of manufacturing a substrate having a bump at a resist opening is provided. The method of manufacturing a substrate includes a step of forming a copper wiring layer on the substrate by plating at a first temperature, a step of forming a barrier layer on the copper wiring layer by plating at a second temperature that is approximately equal to the first temperature, and a step of forming a tin alloy bump layer on the barrier layer by plating.

公开(公告)号：US20240318346A1

公开(公告)日：2024-09-26

申请号：US18026774

申请日：2022-04-21

Applicant: EBARA CORPORATION

Inventor： Shinji OMATA ,  Masaki TOMITA ,  Kentaro YAMAMOTO ,  Yasuyuki MASUDA

IPC: C25D17/00 ,  C25D17/02 ,  C25D17/06 ,  C25D21/04

CPC classification number: C25D17/002 ,  C25D17/02 ,  C25D17/06 ,  C25D21/04

Abstract: Provided is a technique that ensures suppressing deterioration of plating quality of a substrate due to gas bubbles at an anode.
A plating module 400 includes a plating tank 10 configured to house a plating solution, an anode 13 arranged in the plating tank 10, a substrate holder 20 configured to hold a substrate WF with a surface to be plated facing downward so as to be opposed to the anode 13, a membrane module 40 that includes a first membrane 41 partitioning an inside of the plating tank 10 into an anode chamber 11 and a cathode chamber 12 and a second membrane 42 arranged between the first membrane 41 and the anode 13, and a pipe member 31 communicating between a first region R1 below the anode 13 in the plating tank 10 and a second region R2 between the first membrane 41 and the second membrane 42.