公开(公告)号：US20240165675A1

公开(公告)日：2024-05-23

申请号：US18514511

申请日：2023-11-20

Applicant: EBARA CORPORATION

Inventor： Yosuke HIMORI ,  Koichi FUKAYA

IPC: B08B1/40 ,  B08B1/36

CPC classification number: B08B1/40 ,  B08B1/36

Abstract: According to one embodiment, provided is a substrate cleaning apparatus including: a cleaning member configured to clean a substrate; a plate having a horizontal plane provided with a hole; and a pressing mechanism configured to press the cleaning member vertically downward against the plate, wherein the hole penetrates the plate, and a liquid discharged from the cleaning member is discharged below via the hole, whereby absorption of the liquid discharged from the cleaning member into the cleaning member is suppressed.

公开(公告)号：US20140259728A1

公开(公告)日：2014-09-18

申请号：US14287616

申请日：2014-05-27

Applicant: EBARA CORPORATION

Inventor： Tomoatsu ISHIBASHI ,  Takahiro OGAWA ,  Kenichi SUGITA ,  Shinji KAJITA ,  Koichi FUKAYA ,  Akira NAKAMURA

IPC: H01L21/02

CPC classification number: H01L21/02054 ,  H01L21/02074 ,  H01L21/67034

Abstract: A substrate drying apparatus includes a drying gas nozzle configured so that, assuming that a surface WA of the substrate W is a projection plane, regarding the drying gas flow Gf in the nozzle moving direction Dr, a collision position Gfw with the substrate W is located downstream of a projected discharge position Gfv′, the projected discharge position Gfv′ being a discharge position from the drying gas nozzle projected on the projection plane. In a three-dimensional space, the drying gas flow Gf is inclined, such that an angle α formed by an axis Ga of the drying gas flow Gf and a vertical line Wp of the substrate W is in a range from a half contact angle θ/2 to an angle determined by deducting the half contact angle θ/2 from 90°, the half contact angle θ/2 being a half of the contact angle θ.

Abstract translation: 基板干燥装置包括干燥气体喷嘴，其构成为，假设基板W的表面WA为投影面，关于喷嘴移动方向Dr的干燥气体流量Gf，与基板W的碰撞位置Gfw位于 在喷出位置Gfv'的下游，喷出位置Gfv'是从投影在投影面上的干燥气体喷嘴的排出位置。 在三维空间中，干燥气体流Gf倾斜，使得由干燥气体流Gf的轴线Ga和基板W的垂直线Wp形成的角度α在半接触角度 ; / 2通过减去半接触角和角度确定的角度; / 2从90°，半接触角和角度; / 2是接触角的一半。

公开(公告)号：US20210111018A1

公开(公告)日：2021-04-15

申请号：US17068114

申请日：2020-10-12

Applicant: EBARA CORPORATION

Inventor： Fumitoshi OIKAWA ,  Tomoaki FUJIMOTO ,  Mitsuru MIYAZAKI ,  Koichi FUKAYA

IPC: H01L21/02 ,  B08B3/10 ,  B08B1/04 ,  B08B13/00 ,  B08B7/04

Abstract: A substrate cleaning apparatus has: a substrate rotating part that rotates a substrate; an edge cleaning member for cleaning an edge part of the substrate; an edge rotating part that rotates the edge cleaning member around an edge rotary shaft that extends in a direction orthogonal to a substrate rotary shaft; a moving part that moves a position of the edge cleaning member with respect to the edge part of the substrate; and a control part that controls the moving part to move the position of the edge cleaning member with respect to the edge part of the substrate, and causes the edge cleaning member to clean a one-side edge area including a face on one side, a side face area including a side face, and an another-side edge area including a face on another side in the edge part of the substrate.

公开(公告)号：US20190164769A1

公开(公告)日：2019-05-30

申请号：US16313442

申请日：2017-06-26

Applicant: EBARA CORPORATION

Inventor： Shinji KAJITA ,  Hisajiro NAKANO ,  Tomoatsu ISHIBASHI ,  Koichi FUKAYA ,  Yasuyuki MOTOSHIMA ,  Yohei ETO ,  Fumitoshi OIKAWA

IPC: H01L21/304 ,  H01L21/02 ,  H01L21/67 ,  H01L21/687

Abstract: An apparatus for cleaning a substrate has a holding unit 60 that holds a substrate W; a rotated unit 30 connected to the holding unit 60; a rotating unit 35 that is provided on a peripheral outer side of the rotated unit 30 and rotates the rotated unit 30; and a cleaning unit 10, 20 that physically cleans the substrate W held by the holding unit 60.

公开(公告)号：US20170323809A1

公开(公告)日：2017-11-09

申请号：US15589695

申请日：2017-05-08

Applicant: EBARA CORPORATION

Inventor： Koichi FUKAYA ,  Tomoatsu ISHIBASHI ,  Hisajiro NAKANO

IPC: H01L21/67 ,  H01L21/02 ,  B08B3/02

CPC classification number: H01L21/67051 ,  B08B3/02 ,  B08B3/024 ,  H01L21/02052 ,  H01L21/67017 ,  H01L21/6708

Abstract: A substrate washing device includes a substrate holding mechanism 70 that holds a substrate W, a substrate rotating mechanism 72 that rotates the substrate W held by the substrate holding mechanism 70, and a two-fluid nozzle 46 that ejects a two-fluid jet toward a surface of the rotating substrate W. The two-fluid nozzle 46 is formed of a conductive material. Accordingly, the electrification amount of droplets ejected as the two-fluid jet from the two-fluid nozzle 46 can be suppressed.

公开(公告)号：US20240075503A1

公开(公告)日：2024-03-07

申请号：US18261697

申请日：2021-12-14

Applicant: EBARA CORPORATION

Inventor： Fumitoshi OIKAWA ,  Koichi FUKAYA ,  Mitsuru MIYAZAKI

IPC: B08B1/04 ,  B08B1/02 ,  B08B3/04

CPC classification number: B08B1/04 ,  B08B1/02 ,  B08B3/041 ,  H01L21/67046

Abstract: A substrate cleaning apparatus includes a substrate rotation supporting section that supports and rotates a substrate; a roll holding section that rotatably holds a first roll cleaning member and a second roll cleaning member each having a length almost equal to a radius of the substrate; a roll rotation drive section that rotates the first roll cleaning member and the second roll cleaning member about respective axes of rotation parallel to a front surface of the substrate; and a roll pressing section that brings the first roll cleaning member and the second roll cleaning member that are rotating into sliding contact with the front surface of the substrate. The first roll cleaning member and the second roll cleaning member are disposed so as to cover different radial parts of the front surface of the substrate.

公开(公告)号：US20230023260A1

公开(公告)日：2023-01-26

申请号：US17783069

申请日：2020-11-25

Applicant: EBARA CORPORATION

Inventor： Hiroki TAKAHASHI ,  Kohei SATO ,  Koichi FUKAYA

IPC: B08B3/08 ,  H01L21/02 ,  H01L21/67 ,  B08B3/02 ,  B08B3/14 ,  B08B1/00 ,  B08B1/02 ,  B08B13/00

Abstract: The present invention relates to a substrate cleaning system and a substrate cleaning method for cleaning a substrate. The substrate cleaning system (50) includes a heater (51), a chemical-liquid diluting module (52), and a cleaning module. A temperature of the diluted-chemical-liquid mixed by the chemical-liquid diluting module (52) is determined to be higher than normal a temperature and lower than a glass transition point of a cleaning member. The cleaning member scrubs the substrate (W) with the diluted chemical liquid having the determined temperature supplied to the substrate (W).

公开(公告)号：US20130219740A1

公开(公告)日：2013-08-29

申请号：US13860787

申请日：2013-04-11

Applicant: EBARA CORPORATION

Inventor： Tomoatsu ISHIBASHI ,  Takahiro OGAWA ,  Kenichi SUGITA ,  Shinji KAJITA ,  Koichi FUKAYA ,  Akira NAKAMURA

IPC: H01L21/67

CPC classification number: H01L21/02054 ,  H01L21/02074 ,  H01L21/67034

Abstract: A substrate drying apparatus includes a drying gas nozzle configured so that, assuming that a surface WA of the substrate W is a projection plane, regarding the drying gas flow Gf in the nozzle moving direction Dr, a collision position Gfw with the substrate W is located downstream of a projected discharge position Gfv′, the projected discharge position Gfv′ being a discharge position from the drying gas nozzle projected on the projection plane. In a three-dimensional space, the drying gas flow Gf is inclined, such that an angle α formed by an axis Ga of the drying gas flow Gf and a vertical line Wp of the substrate W is in a range from a half contact angle θ/2 to an angle determined by deducting the half contact angle θ/2 from 90°, the half contact angle θ/2 being a half of the contact angle θ.

Abstract translation: 基板干燥装置包括干燥气体喷嘴，其构成为，假设基板W的表面WA为投影面，关于喷嘴移动方向Dr的干燥气体流量Gf，与基板W的碰撞位置Gfw位于 在喷出位置Gfv'的下游，喷出位置Gfv'是从投影在投影面上的干燥气体喷嘴的排出位置。 在三维空间中，干燥气体流Gf倾斜，使得由干燥气体流Gf的轴线Ga和基板W的垂直线Wp形成的角度α在半接触角θ / 2相对于从90°减去半接触角θ/ 2确定的角度，半接触角θ/ 2是接触角θ的一半。

公开(公告)号：US20130167947A1

公开(公告)日：2013-07-04

申请号：US13727726

申请日：2012-12-27

Applicant: EBARA CORPORATION

Inventor： Hisajiro NAKANO ,  Koichi FUKAYA

IPC: F16M1/00

CPC classification number: H01L21/67034 ,  B08B3/10 ,  B08B2203/0264 ,  B24B37/34 ,  F16M1/00 ,  H01L21/02057 ,  H01L21/0206 ,  H01L21/02068 ,  H01L21/02074 ,  H01L21/67051

Abstract: There is provided a liquid scattering prevention cup which has a relatively simple construction and is easy to manufacture, has excellent durability, and can effectively prevent liquid droplets from bouncing off the inner peripheral surface of the cup. The liquid scattering prevention cup is disposed such that it surrounds a periphery of a substrate held and rotated by a substrate holding mechanism for preventing scattering of liquid droplets coming out of the rotating substrate. The liquid scattering prevention cup has a hydrophilic coating formed on at least part of the inner peripheral surface thereof and facing the substrate held and rotated by the substrate holding mechanism. The at least part of the inner peripheral surface has been subjected to surface roughening.

Abstract translation: 提供了一种液体散射防止杯，其具有相对简单的结构并且易于制造，具有优异的耐久性，并且可以有效地防止液滴从杯的内周表面跳出。 液体散射防止杯被设置成使得其包围由基板保持机构保持和旋转的基板的周边，用于防止从旋转基板出来的液滴的飞散。 液体散射防止杯具有在其内周表面的至少一部分上形成的亲水涂层，并且面对由基板保持机构保持和旋转的基板。 内周面的至少一部分已经受到表面粗糙化。

公开(公告)号：US20240321601A1

公开(公告)日：2024-09-26

申请号：US18611156

申请日：2024-03-20

Applicant: EBARA CORPORATION

Inventor： Fumitoshi OIKAWA ,  Koichi FUKAYA ,  Hiroki TAKAHASHI ,  Akira IMAMURA

IPC: H01L21/67 ,  B08B1/34 ,  B08B3/02 ,  B08B3/04 ,  H01L21/02

CPC classification number: H01L21/67051 ,  B08B1/34 ,  B08B3/022 ,  B08B3/041 ,  H01L21/02057 ,  H01L21/67034

Abstract: A cleaning apparatus includes: a rotation support section that supports and rotates a substrate; a chemical liquid supply section that supplies a chemical liquid other than an organic solvent to a surface of the substrate; an organic solvent supply section that supplies an organic solvent to a surface of the substrate; and cleaning means that cleans a surface of the substrate supported by the rotation support section using a chemical liquid from the chemical liquid supply section, and then cleans a surface of the substrate using an organic solvent from the organic solvent supply section with the substrate being kept supported by the rotation support section.