公开(公告)号：US20250046628A1

公开(公告)日：2025-02-06

申请号：US18924089

申请日：2024-10-23

Applicant: EBARA CORPORATION

Inventor： Itsuki KOBATA ,  Yosuke HIMORI

IPC: H01L21/67 ,  H01L21/677

Abstract: A substrate processing method capable of suppressing corrosion of a conductive material on a surface of a substrate by supplying a liquid having a reduced concentration of dissolved oxygen onto the substrate. The substrate processing method includes: dissolving an inert gas in a liquid at not less than a saturation solubility to replace oxygen dissolved in the liquid with the inert gas; generating bubbles of the inert gas in the liquid by depressurizing the liquid in which the inert gas is dissolved; and processing the substrate while supplying the liquid containing the bubbles to the surface of the substrate.

公开(公告)号：US20240217050A1

公开(公告)日：2024-07-04

申请号：US18396359

申请日：2023-12-26

Applicant: EBARA CORPORATION

Inventor： Toshio MIZUNO ,  Yosuke HIMORI

IPC: B24B5/16 ,  B24B7/04 ,  B24B27/00 ,  B24B27/04

CPC classification number: B24B5/162 ,  B24B7/04 ,  B24B27/003 ,  B24B27/04 ,  B24B5/26

Abstract: Provided is a technique allowing an effective process of a bevel portion of a workpiece. A processing apparatus 1 includes a workpiece table 10 configured to hold a workpiece Wf, and a processing head 30 configured to hold a processing pad Pd. The processing pad includes a pad surface 120 provided with at least one groove 130 having an inner circumferential groove wall 131 and an outer circumferential groove wall 132. The processing apparatus 1 is configured to rotate the workpiece table and the processing head, and bring an edge 133 of the inner circumferential groove wall and an edge 134 of the outer circumferential groove wall in contact with a bevel portion 100 of the workpiece during a process of the workpiece.

公开(公告)号：US20240165675A1

公开(公告)日：2024-05-23

申请号：US18514511

申请日：2023-11-20

Applicant: EBARA CORPORATION

Inventor： Yosuke HIMORI ,  Koichi FUKAYA

IPC: B08B1/40 ,  B08B1/36

CPC classification number: B08B1/40 ,  B08B1/36

Abstract: According to one embodiment, provided is a substrate cleaning apparatus including: a cleaning member configured to clean a substrate; a plate having a horizontal plane provided with a hole; and a pressing mechanism configured to press the cleaning member vertically downward against the plate, wherein the hole penetrates the plate, and a liquid discharged from the cleaning member is discharged below via the hole, whereby absorption of the liquid discharged from the cleaning member into the cleaning member is suppressed.

公开(公告)号：US20240145276A1

公开(公告)日：2024-05-02

申请号：US18497324

申请日：2023-10-30

Applicant: EBARA CORPORATION

Inventor： Yosuke HIMORI

IPC: H01L21/67 ,  B08B1/14 ,  B08B1/20 ,  B08B1/34 ,  B08B3/04 ,  H01L21/687 ,  H05F1/00

CPC classification number: H01L21/67253 ,  B08B1/14 ,  B08B1/20 ,  B08B1/34 ,  B08B3/041 ,  H01L21/67034 ,  H01L21/67046 ,  H01L21/68707 ,  H05F1/00

Abstract: Provided is a substrate cleaning apparatus including: a substrate holding and rotating mechanism configured to hold and rotate a substrate; a cleaning liquid supplier configured to supply a cleaning liquid to the substrate; a cleaning member configured to come into contact with the substrate to clean the substrate; a charge amount adjustment apparatus capable of increasing and decreasing a charge amount of the substrate; a charge amount measuring instrument configured to measure the charge amount of the substrate; and a controller configured to control the charge amount adjustment apparatus according to the charge amount measured by the charge amount measuring instrument.

公开(公告)号：US20230038445A1

公开(公告)日：2023-02-09

申请号：US17878840

申请日：2022-08-01

Applicant: EBARA CORPORATION

Inventor： Itsuki KOBATA ,  Yosuke HIMORI

IPC: H01L21/67 ,  H01L21/677

Abstract: A substrate processing method capable of suppressing corrosion of a conductive material on a surface of a substrate by supplying a liquid having a reduced concentration of dissolved oxygen onto the substrate. The substrate processing method includes: dissolving an inert gas in a liquid at not less than a saturation solubility to replace oxygen dissolved in the liquid with the inert gas; generating bubbles of the inert gas in the liquid by depressurizing the liquid in which the inert gas is dissolved; and processing the substrate while supplying the liquid containing the bubbles to the surface of the substrate.