公开(公告)号：US20140166492A1

公开(公告)日：2014-06-19

申请号：US14103767

申请日：2013-12-11

Applicant: EBARA CORPORATION

Inventor： Masashi SHIMOYAMA ,  Jumpei FUJIKATA ,  Yuji ARAKI ,  Masamichi TAMURA ,  Toshiki MIYAKAWA

IPC: C25D21/14 ,  C25D3/30

CPC classification number: C25D21/14 ,  C25D3/30 ,  C25D5/003 ,  C25D17/001 ,  C25D17/002 ,  C25D17/008 ,  C25D21/10 ,  C25D21/18

Abstract: An Sn alloy plating apparatus includes: a plating bath having a cathode chamber for holding therein an Sn alloy plating solution in which the substrate is to be immersed and an anode chamber for holding therein an anolyte containing Sn ions and an acid; an Sn anode located in the anode chamber; and an electrolytic solution supply line configured to supply an electrolytic solution containing the acid into the anode chamber such that a Sn ion concentration of the anolyte in the anode chamber is kept not less than a predetermined value and a concentration of the acid in the anolyte is kept not less than a predetermined acceptable value. The electrolytic solution supply line supplies the electrolytic solution into the anode chamber to increase an amount of the anolyte in the anode chamber and supply the anolyte into the Sn alloy plating solution by the increased amount.

Abstract translation: 一种Sn合金电镀装置，具备：具有阴极室的电镀槽，其具有用于保持浸渍有基板的Sn合金电镀液和用于保持含有Sn离子和酸的阳极电解液的阳极室; 位于阳极室中的Sn阳极; 以及电解液供给管线，被配置为将含有酸的电解液供给到阳极室中，使得阳极室中的阳极电解液的Sn离子浓度保持不低于预定值，阳极电解液中的酸浓度为 保持不低于预定的可接受值。 电解液供给线将电解液供给到阳极室，以增加阳极室中的阳极电解液的量，并通过增加量将阳极电解液供给到Sn合金电镀液中。

公开(公告)号：US20240082982A1

公开(公告)日：2024-03-14

申请号：US18311421

申请日：2023-05-03

Applicant: EBARA CORPORATION

Inventor： Toshiki MIYAKAWA ,  Kenichiro SAITO ,  Makoto FUKUSHIMA

IPC: B24B37/20 ,  B24B37/005

CPC classification number: B24B37/20 ,  B24B37/005

Abstract: An improved apparatus for use in replacing a polishing pad is disclosed. processing system includes: a polishing device configured to polish a workpiece; a pad break-in device configured to perform a pad break-in process of a polishing pad; and a pad transporting device configured to transport a pad structure from the pad break-in device to the polishing device. The pad structure includes at least the polishing pad. The pad transporting device includes a liquid receiving tray arranged under the holding hand and configured to receive liquid dropped from the pad structure.

公开(公告)号：US20230201991A1

公开(公告)日：2023-06-29

申请号：US18086200

申请日：2022-12-21

Applicant: EBARA CORPORATION

Inventor： Masaki KINOSHITA ,  Takashi KISHI ,  Toshiki MIYAKAWA

IPC: B24B37/04

CPC classification number: B24B37/042

Abstract: A polishing apparatus capable of preventing condensation on an inner surface of a transparent window provided in a polishing pad and capable of achieving accurate measuring of a film thickness is disclosed. The polishing apparatus includes: a polishing pad having a polishing surface; a polishing head configured to press a workpiece against the polishing surface; a transparent window disposed in the polishing pad; a polishing table configured to support the polishing pad; an optical sensor head located below the transparent window and configured to direct light to the workpiece through the transparent window and receive reflected light from the workpiece through the transparent window; and a cooling device configured to cool a space between the transparent window and the optical sensor head.

公开(公告)号：US20250010424A1

公开(公告)日：2025-01-09

申请号：US18759408

申请日：2024-06-28

Applicant: EBARA CORPORATION

Inventor： Masaki KINOSHITA ,  Shintaro ISONO ,  Toshiki MIYAKAWA

IPC: B24B37/013 ,  B24B37/20

Abstract: A polishing apparatus is disclosed. The polishing apparatus can stabilize an optical path in a space between a transparent window of a polishing pad and an optical sensor head, thereby achieving accurate measuring of a film thickness of a workpiece. polishing apparatus includes: a polishing pad having a transparent window configured to allow light to pass therethrough; a polishing table supporting the polishing pad; a polishing head configured to press a workpiece against the polishing pad; and an optical film-thickness measuring system having an optical sensor head disposed below the transparent window, a space formed between the transparent window and the optical sensor head being filled with a transparent liquid.

公开(公告)号：US20180209062A1

公开(公告)日：2018-07-26

申请号：US15878267

申请日：2018-01-23

Applicant: EBARA CORPORATION

Inventor： Mizuki NAGAI ,  Kazuhito TSUJI ,  Takashi KISHI ,  Toshiki MIYAKAWA ,  Masashi SHIMOYAMA ,  Jumpei FUJIKATA

IPC: C25D17/08 ,  C25D17/00 ,  C25D21/12 ,  H01L21/687

Abstract: A resistance measuring module for measuring electric resistance of a substrate holder is provided. The substrate holder has an electric contact configured to feed a current to a held substrate and contactable with the substrate. The substrate holder is able to hold a testing substrate for measurement of electric resistance of the substrate holder, and is configured such that the electric contact comes into contact with the testing substrate in a state where the testing substrate is held. The resistance measuring module includes: a test probe contactable with the testing substrate held in the substrate holder; and a resistance measuring instrument for measurement of a resistance value between the electric contact and the probe via the testing substrate.

公开(公告)号：US20140332393A1

公开(公告)日：2014-11-13

申请号：US14267874

申请日：2014-05-01

Applicant: EBARA CORPORATION

Inventor： Masashi SHIMOYAMA ,  Yuji ARAKI ,  Masamichi TAMURA ,  Toshiki MIYAKAWA

IPC: C25D21/18 ,  C25D3/30

CPC classification number: C25D21/18 ,  C25D3/60 ,  C25D17/002 ,  C25D17/10

Abstract: An Sn alloy plating apparatus is disclosed. The apparatus includes a plating bath configured to store an Sn alloy plating solution therein with an insoluble anode and a substrate immersed in the Sn alloy plating solution, an Sn dissolving having an anion exchange membrane therein which isolates an anode chamber, in which an Sn anode is disposed, and a cathode chamber, in which a cathode is disposed, from each other, a pure water supply structure configured to supply pure water to the anode chamber and the cathode chamber, a methanesulfonic acid solution supply structure configured to supply a methanesulfonic acid solution, containing a methanesulfonic acid, to the anode chamber and the cathode chamber, and an Sn replenisher supply structure configured to supply an Sn replenisher, produced in the anode chamber and containing Sn ions and a methanesulfonic acid, to the plating bath.

Abstract translation: 公开了一种Sn合金镀覆装置。 该装置包括：电镀槽，其中存储Sn合金电镀液中的不溶性阳极和浸在Sn合金电镀液中的基板，其中具有阴离子交换膜的Sn溶解，其中隔离阳极室，其中Sn阳极 并且设置有阴极的阴极室，构成为向阳极室和阴极室供给纯水的纯水供给结构，构成为供给甲烷磺酸的甲磺酸溶液供给结构体 含有甲磺酸的溶液，阳极室和阴极室，以及Sn补充液供给结构，其构造成将在阳极室中产生的含有Sn离子和甲磺酸的Sn补充剂供给到镀浴中。