公开(公告)号：US20180339392A1

公开(公告)日：2018-11-29

申请号：US15979180

申请日：2018-05-14

Applicant: EBARA CORPORATION

Inventor： Toshifumi KIMBA ,  Masaki KINOSHITA

IPC: B24B37/005 ,  B24B37/20 ,  B24B37/04

Abstract: A polishing apparatus capable of accurately determining a service life of a light source, and further capable of accurately measuring a film thickness of a substrate, such as a wafer, without calibrating an optical film-thickness measuring device, is disclosed. The polishing apparatus includes: a light source configured to emit light; an illuminating fiber having a distal end arranged at a predetermined position in the polishing table, the illuminating fiber being coupled to the light source; a spectrometer configured to decompose reflected light from the wafer in accordance with wavelength and measure an intensity of the reflected light at each of wavelengths; a light-receiving fiber having a distal end arranged at the predetermined position in the polishing table, the light-receiving fiber being coupled to the spectrometer, a processor configured to determine a film thickness of the wafer based on a spectral waveform indicating a relationship between the intensity of the reflected light and wavelength; an internal optical fiber coupled to the light source; and an optical-path selecting mechanism configured to selectively couple either the light-receiving fiber or the internal optical fiber to the spectrometer.

公开(公告)号：US20170190020A1

公开(公告)日：2017-07-06

申请号：US15304829

申请日：2015-04-10

Applicant: EBARA CORPORATION

Inventor： Yoichi KOBAYASHI ,  Keita YAGI ,  Masaki KINOSHITA ,  Yoichi SHIOKAWA

IPC: B24B49/05 ,  H01L21/67 ,  H01L21/66 ,  B24B49/03

CPC classification number: B24B49/05 ,  B24B37/013 ,  B24B37/105 ,  B24B37/32 ,  B24B37/34 ,  B24B49/02 ,  B24B49/03 ,  B24B49/04 ,  B24B49/12 ,  H01L21/67 ,  H01L22/12 ,  H01L22/26

Abstract: The present invention relates to a polishing method and a polishing apparatus for polishing a substrate such as a wafer while measuring a film thickness based on optical information included in reflected light from the substrate. The polishing method includes preparing a plurality of spectrum groups each containing a plurality of reference spectra corresponding to different film thicknesses; directing light to a substrate and receiving reflected light from the substrate; producing, from the reflected light, a sampling spectrum for selecting a spectrum group; selecting a spectrum group containing a reference spectrum which is closest in shape to the sampling spectrum; producing a measurement spectrum for obtaining a film thickness while polishing the substrate; selecting, from the selected spectrum group, a reference spectrum which is closest in shape to the measurement spectrum that has been produced when the substrate is being polished; and obtaining a film thickness corresponding to the selected reference spectrum.

公开(公告)号：US20240353344A1

公开(公告)日：2024-10-24

申请号：US18634702

申请日：2024-04-12

Applicant: EBARA CORPORATION

Inventor： Masaki KINOSHITA ,  Keita YAGI ,  Taro TAKAHASHI ,  Yoichi SHIOKAWA ,  Yuki WATANABE

IPC: G01N21/84 ,  G01N21/95 ,  H01L21/304 ,  H01L21/66

CPC classification number: G01N21/8422 ,  G01N21/9501 ,  H01L21/304 ,  H01L22/12

Abstract: Provided is a film thickness measurement device, including: a head that holds a substrate to be polished and is capable of moving the substrate, a stage made of transparent material; a liquid supply unit configured to supply liquid onto the stage; a liquid discharge unit configured to discharge the liquid on the stage to the outside; a measurement unit configured to be placed on a side opposite to the head across the stage and to optically measure a film thickness on a surface of the substrate that is placed across the stage; and a control unit configured to move at least one of the stage and the head toward the other, and to irradiate the substrate with light while the surface of the substrate is immersed in the liquid, thereby performing film thickness measurement.

公开(公告)号：US20230204342A1

公开(公告)日：2023-06-29

申请号：US18082342

申请日：2022-12-15

Applicant: EBARA CORPORATION

Inventor： Masaki KINOSHITA ,  Yoichi SHIOKAWA

IPC: G01B11/06 ,  H01L21/66

CPC classification number: G01B11/0616 ,  H01L22/26

Abstract: A film-thickness measuring method capable of substantially extending a wavelength range of a spectrum of reflected light from a workpiece, and accurately measuring a film thickness is disclosed. The film-thickness measuring method includes: pressing a workpiece against a polishing pad, while rotating a polishing table that supports the polishing pad, to polish the workpiece; during the polishing of the workpiece, directing light to the workpiece from a liquid-seal sensor and a transparent-window sensor disposed in the polishing table and receiving reflected light from the workpiece by the liquid-seal sensor and the transparent-window sensor; and determining a film thickness of the workpiece based on a spectrum of the reflected light from the workpiece.

公开(公告)号：US20180229346A1

公开(公告)日：2018-08-16

申请号：US15949960

申请日：2018-04-10

Applicant: EBARA CORPORATION

Inventor： Itsuki KOBATA ,  Yoichi KOBAYASHI ,  Katsutoshi ONO ,  Masaki KINOSHITA ,  Toshifumi KIMBA

IPC: B24B37/26 ,  H01L21/687 ,  H01L21/67 ,  B24B37/04 ,  B24B37/10 ,  B24B37/005 ,  H01L21/66 ,  H01L21/3105 ,  B24B49/12 ,  B24B37/013

CPC classification number: B24B37/26 ,  B24B37/005 ,  B24B37/013 ,  B24B37/04 ,  B24B37/042 ,  B24B37/10 ,  B24B37/205 ,  B24B49/12 ,  H01L21/31053 ,  H01L21/67075 ,  H01L21/67092 ,  H01L21/67253 ,  H01L21/68721 ,  H01L22/26

Abstract: A polishing apparatus for polishing a substrate is provided. The polishing apparatus includes: a polishing table holding a polishing pad; a top ring configured to press the substrate against the polishing pad; first and second optical heads each configured to apply the light to the substrate and to receive reflected light from the substrate; spectroscopes each configured to measure at each wavelength an intensity of the reflected light received; and a processor configured to produce a spectrum indicating a relationship between intensity and wavelength of the reflected light. The first optical head is arranged so as to face a center of the substrate, and the second optical head is arranged so as to face a peripheral portion of the substrate.

公开(公告)号：US20250041989A1

公开(公告)日：2025-02-06

申请号：US18782148

申请日：2024-07-24

Applicant: EBARA CORPORATION

Inventor： Masaki KINOSHITA

IPC: B24B53/017 ,  B24B49/04 ,  B24B49/12

Abstract: A polishing apparatus capable of preventing abrasive grains in a polishing liquid and polishing debris of a workpiece from adhering to an optical sensor head and capable of improving a measuring accuracy of a film thickness of a workpiece is disclosed. The polishing apparatus includes: a polishing table configured to support a polishing pad having a through-hole; a polishing head configured to press a workpiece against the polishing pad; an optical film-thickness measuring system having an optical sensor head disposed below the polishing pad; and a sensor-head cleaning nozzle configured to emit a cleaning liquid to the optical sensor head. The sensor-head cleaning nozzle is disposed in the polishing table and points at the optical sensor head.

公开(公告)号：US20250010424A1

公开(公告)日：2025-01-09

申请号：US18759408

申请日：2024-06-28

Applicant: EBARA CORPORATION

Inventor： Masaki KINOSHITA ,  Shintaro ISONO ,  Toshiki MIYAKAWA

IPC: B24B37/013 ,  B24B37/20

Abstract: A polishing apparatus is disclosed. The polishing apparatus can stabilize an optical path in a space between a transparent window of a polishing pad and an optical sensor head, thereby achieving accurate measuring of a film thickness of a workpiece. polishing apparatus includes: a polishing pad having a transparent window configured to allow light to pass therethrough; a polishing table supporting the polishing pad; a polishing head configured to press a workpiece against the polishing pad; and an optical film-thickness measuring system having an optical sensor head disposed below the transparent window, a space formed between the transparent window and the optical sensor head being filled with a transparent liquid.

公开(公告)号：US20240207997A1

公开(公告)日：2024-06-27

申请号：US18541797

申请日：2023-12-15

Applicant: EBARA CORPORATION

Inventor： Masaki KINOSHITA

IPC: B24B37/013 ,  B24B37/015

CPC classification number: B24B37/013 ,  B24B37/015

Abstract: A light intensity adjustment method for an optical film thickness measuring device that can improve an operational efficiency of a light source and extend a life of the light source is disclosed. The light intensity adjustment method for an optical film thickness measuring device monitors a light intensity of the light source, and adjusts a voltage applied to the light source based on the monitored light intensity.

公开(公告)号：US20240207996A1

公开(公告)日：2024-06-27

申请号：US18396256

申请日：2023-12-26

Applicant: EBARA CORPORATION

Inventor： Yasumasa HIROO ,  Masaki KINOSHITA

IPC: B24B37/013

CPC classification number: B24B37/013

Abstract: To remove or reduce the influence on the measurement accuracy due to a difference of the relative velocity between a substrate and a polishing table in an optical surface monitoring system. A substrate polishing apparatus includes a polishing table, a motor, a substrate holding head, a light source, an optical head, an optical detector, a shutter, and a control device. The motor is for rotating the polishing table. The substrate holding head is configured to hold a substrate. The optical head is disposed inside the polishing table. The optical head includes a light projection port and a light reception port. The light projection port is disposed to project light from the light source toward the substrate held by the substrate holding head. The light reception port is disposed to receive light reflected from the substrate held by the substrate holding head. The optical detector is for detecting the light received at the light reception port. The shutter is for controlling an exposure time during which the light is captured in the optical detector. The control device is for controlling the operation of the shutter so as to change the exposure time based on the polishing condition of the substrate.

公开(公告)号：US20190118331A1

公开(公告)日：2019-04-25

申请号：US16162063

申请日：2018-10-16

Applicant: EBARA CORPORATION

Inventor： Nobuyuki TAKAHASHI ,  Toshifumi KIMBA ,  Masaki KINOSHITA

IPC: B24B37/013 ,  B24B37/10 ,  B24B49/12 ,  G01J3/42 ,  G01J3/10

Abstract: There is disclosed a polishing apparatus which allows for easy replacement of a light source with another type of light source. The light-source assembly includes: a base fixed to a polishing table and coupled to a light-emitting transmission line; and a light-source module having a lamp for emitting light. The light-source module is removably attached to the base. The base is a common base which is adapted to any of a plurality of light-source modules of different types including the light-source module. The base includes a positioning structure which achieves positioning of the light-source module relative to the base.