公开(公告)号：US3594493A

公开(公告)日：1971-07-20

申请号：US3594493D

申请日：1969-10-02

Applicant: ELLIOTT BROS

Inventor： KAUFFMAN ALAN MICHAEL ,  BOND JAMES

IPC: H05K1/11 ,  H05K3/00 ,  H05K3/18 ,  H05K3/28 ,  H05K3/32 ,  H05K3/40 ,  H05K3/46 ,  H05K1/18 ,  H05K3/36

CPC classification number: H05K3/284 ,  H05K1/113 ,  H05K3/002 ,  H05K3/181 ,  H05K3/32 ,  H05K3/4007 ,  H05K3/4084 ,  H05K3/4092 ,  H05K3/4611 ,  H05K3/4644 ,  H05K2201/0379 ,  H05K2201/0397 ,  H05K2201/096 ,  H05K2201/10689 ,  H05K2201/10977 ,  H05K2203/025 ,  H05K2203/063 ,  H05K2203/1316 ,  H05K2203/1461 ,  H05K2203/1469

Abstract: A multilayer printed circuit assembly has connections between the layers formed by extending a printed circuit conductor from each layer through a number of aligned holes in the different layers to the outer surface of the assembly where the end faces of the conductors terminate in the same plane. A plated layer then interconnects the end faces. Component leads may also extend through holes to the connection plane. The assembly is potted in stages.