公开(公告)号：US11965239B2

公开(公告)日：2024-04-23

申请号：US17161332

申请日：2021-01-28

Applicant: ENTEGRIS, INC.

Inventor： Gavin Richards ,  Thomas H. Baum ,  Han Wang ,  Bryan C. Hendrix

IPC: C23C16/34 ,  C23C16/455

CPC classification number: C23C16/34 ,  C23C16/45534 ,  C23C16/45553

Abstract: Provided is improved methodology for the nucleation of certain metal nitride substrate surfaces utilizing certain silicon-containing halides, silicon-containing amides, and certain metal precursors, in conjunction with nitrogen-containing reducing gases. While utilizing a pretreatment step, the methodology shows greatly improved nucleation wherein a microelectronic device substrate having such a metal nitride film deposited thereon has a thickness of about 10 Å to about 15 Å and less than about 1% of void area. Once such nucleation has been achieved, traditional layer-upon-layer deposition can rapidly take place.

公开(公告)号：US20230287564A1

公开(公告)日：2023-09-14

申请号：US18118300

申请日：2023-03-07

Applicant: ENTEGRIS, INC.

Inventor： Bryan C. Hendrix ,  Scott L. Battle ,  Benjamin R. Garrett ,  Carlo Waldfried ,  Gavin Richards

IPC: C23C16/44 ,  C01G41/04 ,  C01G39/00

CPC classification number: C23C16/4404 ,  C01G41/04 ,  C01G39/006

Abstract: A device which can be exposed to chemical vapors, such as a molybdenum vapor, a tungsten vapor, or any combination thereof, which has a coating covering at least a portion thereof. The coating reduces or inhibits mass change at an outer surface of the device from exposure to the vapor. In certain situations, the mass change is a mass gain, and the coating reduces or inhibits the mass gain of equal to or less than 1×10−5 g mm−2.

公开(公告)号：US20230416913A1

公开(公告)日：2023-12-28

申请号：US18215757

申请日：2023-06-28

Applicant: ENTEGRIS, INC.

Inventor： Bryan C. Hendrix ,  Carlo Waldfried ,  Scott L. Battle ,  Gavin Richards ,  Benjamin R. Garrett

IPC: C23C16/455 ,  C23C16/44

CPC classification number: C23C16/45544 ,  C23C16/4404 ,  C23C16/45561 ,  C23C16/52

Abstract: A system including a chemical supply cabinet (e.g., such as a chemical supply cabinet configured to contain an ampoule), a module configured to modify a surface, and a control unit connected to the module, wherein the control unit is configured to direct the modifying of the surface.