公开(公告)号：US20160345106A1

公开(公告)日：2016-11-24

申请号：US15111224

申请日：2014-12-04

Applicant: EPCOS AG

Inventor： Wolfgang Pahl ,  Gregor Feiertag

IPC: H04R19/04 ,  H04R19/00 ,  H04R1/40 ,  B81B7/00 ,  H04R1/04

CPC classification number: H04R19/04 ,  B81B7/0061 ,  B81B2201/0257 ,  B81B2207/012 ,  B81B2207/07 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2924/10158 ,  H01L2924/15192 ,  H01L2924/16153 ,  H04R1/04 ,  H04R1/406 ,  H04R5/027 ,  H04R19/005 ,  H04R2201/003 ,  H04R2410/03 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A multi-MEMS module is specified which can be produced expediently and enables a smaller design. The module comprises a housing having an interior and a first and a second opening, a first MEMS chip and a second MEMS chip. The first MEMS chip is acoustically coupled to the first opening. The second MEMS chip is acoustically coupled to the second opening.

Abstract translation: 指定了可以方便生产并实现更小设计的多MEMS模块。 模块包括具有内部和第一和第二开口的壳体，第一MEMS芯片和第二MEMS芯片。 第一个MEMS芯片声耦合到第一个开口。 第二MEMS芯片声耦合到第二开口。

公开(公告)号：US10015600B2

公开(公告)日：2018-07-03

申请号：US15111224

申请日：2014-12-04

Applicant: Epcos AG

Inventor： Wolfgang Pahl ,  Gregor Feiertag

IPC: H04R19/04 ,  H04R1/04 ,  H04R19/00 ,  H04R1/40 ,  B81B7/00 ,  H04R5/027

CPC classification number: H04R19/04 ,  B81B7/0061 ,  B81B2201/0257 ,  B81B2207/012 ,  B81B2207/07 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2924/10158 ,  H01L2924/15192 ,  H01L2924/16153 ,  H04R1/04 ,  H04R1/406 ,  H04R5/027 ,  H04R19/005 ,  H04R2201/003 ,  H04R2410/03 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A multi-MEMS module is specified which can be produced expediently and enables a smaller design. The module comprises a housing having an interior and a first and a second opening, a first MEMS chip and a second MEMS chip. The first MEMS chip is acoustically coupled to the first opening. The second MEMS chip is acoustically coupled to the second opening.