公开(公告)号：US20210273138A1

公开(公告)日：2021-09-02

申请号：US17322459

申请日：2021-05-17

Applicant: EPISTAR CORPORATION

Inventor： Chien-Liang LIU ,  Ming-Chi HSU ,  Shih-An LIAO ,  Jen-Chieh YU ,  Min-Hsun HSIEH ,  Jia-Tay KUO ,  Yu-His SUNG ,  Po-Chang CHEN

IPC: H01L33/38 ,  H01L33/10 ,  H01L33/00 ,  H01L33/32 ,  H01L33/46 ,  H01L33/24

Abstract: The present application discloses a light-emitting device comprises a semiconductor light-emitting element, a transparent element covering the semiconductor light-emitting element, an insulating layer which connects to the transparent element, an intermediate layer which connects to the insulating layer; and a conductive adhesive material connecting to the intermediate layer.

公开(公告)号：US20150129919A1

公开(公告)日：2015-05-14

申请号：US14541680

申请日：2014-11-14

Applicant: EPISTAR CORPORATION

Inventor： Chien-Liang LIU ,  Ming-Chi HSU ,  Shih-An LIAO ,  Jen-Chieh YU ,  Min-Hsun HSIEH ,  Jia-Tay KUO ,  Yu-His SUNG ,  Po-Chang CHEN

IPC: H01L33/48 ,  H01L33/60 ,  H01L33/62

CPC classification number: H01L33/486 ,  H01L24/19 ,  H01L33/0095 ,  H01L33/54 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/00

Abstract: The present application discloses a light-emitting device comprises a semiconductor light-emitting element, a transparent element covering the semiconductor light-emitting element, an insulating layer which connects to the transparent element, an intermediate layer which connects to the insulating layer; and a conductive adhesive material connecting to the intermediate layer.

Abstract translation: 本申请公开了一种发光装置，包括半导体发光元件，覆盖半导体发光元件的透明元件，连接到透明元件的绝缘层，连接到绝缘层的中间层; 以及连接到中间层的导电粘合剂材料。