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公开(公告)号：US20190357384A1
公开(公告)日：2019-11-21
申请号：US16347782
申请日：2016-11-12
Applicant: ExaScaler Inc.
Inventor： Motoaki SAITO
Abstract: Provided is a power supply unit which is immersed and directly cooled in a coolant filled in a cooling apparatus. The power supply unit includes a unit substrate, and a voltage step-down device mounted on the unit substrate. The unit substrate includes a voltage input terminal for supplying an external power supply voltage, and a voltage output terminal. The voltage output terminal is electrically connected to a voltage input terminal of an electronic device. The power supply unit is mounted on a bottom of a cooling tank of the cooling apparatus so that the electronic device is positioned at an upper part of the power supply unit upon electrical connection between the electronic device and the power supply unit, and cooled by the coolant flowing from the bottom, or flowing from another section of the cooling tank. The unit substrate may be disposed apart from the bottom so as to form a flow channel which allows passage of the coolant between one surface of the unit substrate and the bottom. The voltage step-down device may be configured to include a converter module which steps down the external high voltage DC voltage from 200V to 420V to the DC voltage from 24V to 52V.
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公开(公告)号：US20190317570A1
公开(公告)日：2019-10-17
申请号：US16347759
申请日：2016-11-12
Applicant: ExaScaler Inc.
Inventor： Motoaki SAITO
Abstract: Provided are an electronic device and a power supply unit, both of which are immersed and directly cooled in a coolant filled in a cooling apparatus. The electronic device includes a carrier substrate having a voltage input terminal for supplying a DC voltage for the electronic device, a plurality of module connectors arranged on one surface of the carrier substrate, a plurality of module substrates, a plurality of supporting plates for holding both ends of the respective module substrates, and a supporting member for supporting the carrier substrate. The voltage input terminal is electrically connected to a voltage output terminal of the power supply unit. Each of the module substrates includes a module connector plug electrically coupled to each of the module connectors. The supporting member supports the carrier substrate so as to be positioned at the upper part of the power supply unit mounted on the bottom of the cooling tank of the cooling apparatus upon electrical connection between the electronic device and the power supply unit. The power supply unit includes a unit substrate, a voltage step-down device mounted on the unit substrate, and a stage to which the unit substrate is fixed.
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公开(公告)号：US20180363994A1
公开(公告)日：2018-12-20
申请号：US15773140
申请日：2015-11-11
Applicant: ExaScaler Inc.
Inventor： Motoaki SAITO
Abstract: A cooling system 400 configured to directly cool an electronic device immersed in a coolant includes a cooling tank 50 containing the coolant C, and a leakage receiving portion 21 disposed between the cooling tank 50 and a floor surface 32 so as to receive the coolant L leaked from the cooling tank 50. The cooling tank 50 includes a lower structure 53 fixed to the floor surface 32, an upper structure 51 having the electronic device immersed in the coolant C, and a seismic isolation device 55 disposed between the lower structure 53 and the upper structure 51. It is possible to provide the cooling system which is highly durable against externally exerted strong impact and vibration caused by such disaster as earthquake.
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公开(公告)号：US20180356866A1
公开(公告)日：2018-12-13
申请号：US15773128
申请日：2015-11-11
Applicant: ExaScaler Inc.
Inventor： Motoaki SAITO
CPC classification number: G06F1/206 , G05B15/02 , G06F1/20 , H05K7/20 , H05K7/20236 , H05K7/20272 , H05K7/20763
Abstract: A cooling system 300 configured to directly cool an electronic device immersed in a coolant includes a cooling tank 11 containing the coolant C, and a leakage receiving portion 41 disposed between the cooling tank 11 and a floor surface so as to receive the coolant C leaked from the cooling tank 11. The leakage receiving portion 41 includes a distribution plate 40 for distributing a load applied from the cooling tank 11, a closed side wall disposed on the distribution plate to enclose the cooling tank 11, and a lid member 42 for covering an upper opening between the closed side wall and the cooling tank 11. The system facilitates collection of the accidentally leaked coolant, and ensures to keep the low height of the device for temporarily accumulating the leaked coolant L until it is collected.
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公开(公告)号：US20180246550A1
公开(公告)日：2018-08-30
申请号：US15756538
申请日：2015-08-31
Applicant: ExaScaler Inc.
Inventor： Kenichi INABA , Motoaki SAITO
CPC classification number: G06F1/206 , G06F1/20 , G06F2200/201 , H01L23/473 , H05K7/20 , H05K7/20236 , H05K7/20254 , H05K7/20263 , H05K7/20272 , H05K7/203 , H05K7/20327 , H05K7/20381 , H05K7/20763 , H05K7/20781 , H05K7/208 , H05K7/20818
Abstract: A cooling system has a cooling bath. The open space of the cooling bath contains a second coolant having a boiling point, and having an electronic device that has a processor that is a heat generating component mounted on a board, and is immersed in the second coolant. A boiling cooling device is thermally connected to the processor, and encloses a first coolant having a boiling point. A first heat exchanger has a high-temperature side passage formed of a group of narrow gaps or a group of micro passages, through which the second coolant is passed, and a low-temperature side passage formed of a group of narrow gaps or a group of micro passages, through which a third cooling medium having a boiling point is passed. A pump is configured to pressurize and deliver the second coolant warmed in the cooling bath toward the inlet of the high-temperature side passage.
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Patent Agency Ranking
公开(公告)号：US20180092243A1
公开(公告)日：2018-03-29
申请号：US15563428
申请日：2015-03-30
Applicant: ExaScaler Inc.
Inventor： Motoaki SAITO
CPC classification number: H05K7/20236 , G06F1/20 , G06F1/206 , H01L23/473 , H05K7/20 , H05K7/20263
Abstract: Provided is a cooling system capable of improving the cooling performance of an electronic device and being simple and efficient. The cooling system has a cooling tank, and the cooling tank contains in its open space a second cooling liquid having a boiling point T2. An electronic device mounting a processor as a heating element on a board is stored within the open space of the cooling tank and is immersed in the second cooling liquid. A boiling cooling device is a cooling device thermally connected to the processor and encloses a first cooling liquid having a boiling point T1 (provided T1=T2 or T1 T3).
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公开(公告)号：US20170273223A1
公开(公告)日：2017-09-21
申请号：US15506707
申请日：2015-08-04
Applicant: ExaScaler Inc.
Inventor： Motoaki SAITO
CPC classification number: H05K7/20772 , C09K5/10 , G06F1/20 , G06F2200/201 , H01L23/44 , H01L23/473 , H01L2924/0002 , H05K7/20236 , H05K7/20272 , H05K7/20836 , H01L2924/00
Abstract: A cooling system is adapted for reduction of evaporative loss of a liquid coolant and for efficient cooling of plural electronic devices densely accommodated in a cooling bath of a small volume. A cooling system accommodates plural electronic devices in an open space of a cooling bath provided with an inlet port and an outlet port for a liquid coolant. The cooling system is configured to directly cool the electronic devices by immersion of the electronic devices in the liquid coolant circulated in the open space. The liquid coolant contains a perfluorinated compound as a main component. The liquid coolant is adapted to exhibit a liquid weight loss percentage of 1.5% or less as determined by allowing 10 ml of the liquid coolant in a 10-ml measuring cylinder (opening diameter: 11.5 mm) to spontaneously evaporate under normal environment at a room temperature of 25° C. for 100 hours.
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公开(公告)号：US20180196484A1
公开(公告)日：2018-07-12
申请号：US15741094
申请日：2015-07-02
Applicant: ExaScaler Inc.
Inventor： Motoaki SAITO
CPC classification number: G06F1/20 , B66D3/26 , G06F2200/201 , H01L23/44 , H05K7/20236 , H05K7/20272 , H05K7/20763 , H05K7/20781
Abstract: Inner partitions disposed within a cooling tank have an open space to form arrayed housing parts, and at least one unit of electronic device housed in each of the housing parts. A lifting mechanism includes a tower having a guide and a driving source for raising and lowering an arm, a slide mechanism attached to the cooling tank, and a stopper for restricting the tower's movement so that a range of the tower's motion in a width direction of the cooling tank does not exceed at least a width of the open space. The slide mechanism supports the tower movably with respect to the cooling tank in a horizontal plane located above the open space. The liquid immersion cooling system can safely lift or lower the electronic devices densely housed within the cooling tank without requiring the stage in the periphery of the installation surface of the cooling tank.
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公开(公告)号：US20180020571A1
公开(公告)日：2018-01-18
申请号：US15545651
申请日：2015-01-22
Applicant: ExaScaler Inc.
Inventor： Motoaki SAITO
CPC classification number: H05K7/20236 , F25D9/005 , G06F1/20 , G06F1/206 , G06F2200/201 , H01L23/44 , H01L23/473 , H05K5/0026 , H05K7/20 , H05K7/20272 , H05K7/20281 , H05K7/20636
Abstract: In a cooling system for electronic apparatuses, the electronic apparatus includes inner partitioning walls disposed in a cooling tank with an open space, defined by a bottom wall and side walls for dividing the open space into arrayed storage sections. An electronic apparatus is stored in the storage section. Inflow openings for the cooling liquid are formed in a bottom portion or a side surface of the respective storage sections, and outflow openings are formed at a position near the liquid surface of the cooling liquid flowing in the respective storage sections. The electronic apparatus includes a first board having a first surface on which at least one processor is mounted, and a second surface opposite the first surface, a second board having the third surface that faces the second surface of the first board, and a flow channel formed as a gap between the second and third surface.
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公开(公告)号：US20170354061A1
公开(公告)日：2017-12-07
申请号：US15533348
申请日：2014-12-05
Applicant: EXASCALER INC.
Inventor： Motoaki SAITO
CPC classification number: H05K7/20236 , F24T10/10 , F25D9/00 , F25D9/005 , G06F1/20 , G06F1/206 , H01L23/44 , H01L23/473 , H01L2924/0002 , H05K7/20 , H05K7/20636 , Y02E10/12 , H01L2924/00
Abstract: Provided is a cooling system capable of improving the cooling performances of a plurality of electronic apparatuses, of making stabilization by eliminating the variance in the cooling performances and of being improved in the handling and maintainability of the electronic apparatuses. A plurality of inner partitioning walls are provided in a cooling tank having an open space defined by a bottom wall and side walls to divide the open space, and a plurality of arrayed storage sections are defined. An electronic apparatus is stored in each of the storage sections. Each of the storage sections is formed with an inflow opening and an outflow opening for the cooling liquid. The inflow opening is formed at a bottom portion or a side surface of each storage section, and the outflow opening is formed in the vicinity of the liquid level of the cooling liquid flowing through each storage section.
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