公开(公告)号：US20150270241A1

公开(公告)日：2015-09-24

申请号：US14667490

申请日：2015-03-24

Applicant: Efficient Power Conversion Corporation

Inventor： ROBERT STRITTMATTER ,  Seshadri Kolluri ,  Robert Beach ,  Jianjun Cao ,  Alana Nakata

IPC: H01L23/00 ,  B23K1/00

CPC classification number: H01L24/81 ,  B23K1/0004 ,  B23K1/0016 ,  B23K3/047 ,  B23K3/0623 ,  B23K2101/42 ,  H01L23/4824 ,  H01L23/49844 ,  H01L23/50 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/13012 ,  H01L2224/13013 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/1312 ,  H01L2224/16227 ,  H01L2224/29012 ,  H01L2224/29013 ,  H01L2224/29111 ,  H01L2224/29116 ,  H01L2224/2912 ,  H01L2224/32227 ,  H01L2224/8112 ,  H01L2224/81234 ,  H01L2224/81447 ,  H01L2224/81815 ,  H01L2224/8312 ,  H01L2224/83234 ,  H01L2224/83447 ,  H01L2224/83815 ,  H01L2924/1306 ,  H01L2924/1461 ,  H05K1/0265 ,  H05K2201/09672 ,  H05K2201/10166 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A method and system for electrically connect a semiconductor device with a flip-chip form factor to a printed circuit board. An exemplary embodiment of the method comprises: aligning solder contacts on the device with a first copper contact and a second copper contact of the external circuitry, and, applying a supply current only directly to a buried layer of the first copper and not directly to the layer which is nearest the device, such that no current is sourced to the device through the layer nearest the device.

Abstract translation: 一种用于将半导体器件与倒装芯片形状电连接到印刷电路板的方法和系统。 该方法的示例性实施例包括：将器件上的焊接触点与外部电路的第一铜触点和第二铜触点对准，并且仅将电源电流直接施加到第一铜的掩埋层，而不是直接连接到 层，其最接近设备，使得没有电流通过最靠近设备的层来源到设备。