公开(公告)号：US20240352251A1

公开(公告)日：2024-10-24

申请号：US18210869

申请日：2023-06-16

Applicant: Elite Material Co., Ltd.

Inventor： Yu-Te LIN ,  Jun-Yan YU ,  Chien-Cheng WANG

IPC: C08L71/12 ,  C08K5/00

CPC classification number: C08L71/12 ,  C08K5/0066 ,  C08L2201/02 ,  C08L2203/16 ,  C08L2203/20

Abstract: A resin composition is provided, which comprises: 75 parts by weight of vinyl group-containing polyphenylene ether resin; 35 parts by weight to 60 parts by weight of an insoluble flame retardant; and 0.4 parts by weight to 5 parts by weight of a compound represented by the following formula (1):




wherein R1, R2, R3 and n are defined in the specification. The present invention also provides an article manufactured using the aforesaid resin composition.

公开(公告)号：US20230303835A1

公开(公告)日：2023-09-28

申请号：US17746727

申请日：2022-05-17

Applicant: Elite Material Co., Ltd.

Inventor： Yu-Te LIN ,  Chien-Cheng WANG

IPC: C08L71/12 ,  C08L53/02 ,  C08J5/24

CPC classification number: C08L71/12 ,  C08L53/02 ,  C08J5/24 ,  C08J2353/02 ,  C08J2371/12

Abstract: A resin composition includes 50 parts by weight of a vinyl-containing polyphenylene ether resin, 1 part by weight to 30 parts by weight of a styrene-butadiene-styrene block copolymer and 0.5 part by weight to 30 parts by weight of a zinc molybdate-covered silica, wherein the zinc molybdate-covered silica has a mass ratio of zinc molybdate to silica of between 1:9 and 2:8. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including gel time stability, copper foil peeling strength, difference rate of dissipation factor and conductive anodic filament test.