公开(公告)号：US20190300556A1

公开(公告)日：2019-10-03

申请号：US15977127

申请日：2018-05-11

Applicant: Elite Material Co., Ltd.

Inventor： Shu-Hao CHANG ,  Zhilong HU ,  Ching-Hsien HSU

IPC: C07F9/6571 ,  C09K21/12 ,  C09D5/18 ,  C09D123/08 ,  C09D123/02 ,  C09D171/12

Abstract: A phosphorus-containing flame retardant, a preparation method thereof, a resin composition comprising the phosphorus-containing flame retardant and an article made therefrom are disclosed. The phosphorus-containing flame retardant is characterized by having the advantages of high phosphorus content, high resin compatibility, not increasing gel time of varnish and low water absorption rate, and is therefore suitable for use as a flame retardant of various resin materials.

公开(公告)号：US20230383121A1

公开(公告)日：2023-11-30

申请号：US17899873

申请日：2022-08-31

Applicant: Elite Material Co., Ltd.

Inventor： Ching-Hsien HSU ,  Jun-Yan YU ,  Yu-Chiao SHIH

IPC: C08L71/02 ,  C08L53/02 ,  C08L47/00

CPC classification number: C08L71/02 ,  C08L53/02 ,  C08L47/00

Abstract: A resin composition includes 100 parts by weight of a vinyl group-containing polyphenylene ether resin, 10 parts by weight to 20 parts by weight of a polyolefin, 15 parts by weight to 45 parts by weight of a first phosphorus-containing compound and 5 parts by weight to 15 parts by weight of a second phosphorus-containing compound, wherein the polyolefin includes a styrene-butadiene-maleic anhydride terpolymer or a butadiene-maleic anhydride copolymer, the first phosphorus-containing compound includes a compound of Formula (I), and the second phosphorus-containing compound includes a compound of Formula (II), a compound of Formula (III) or a combination thereof. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including difference rate of dissipation factor before and after 24 hours of water absorption, Z-axis coefficient of thermal expansion and dissipation factor after 24 hours of water absorption.

公开(公告)号：US20200148881A1

公开(公告)日：2020-05-14

申请号：US16224105

申请日：2018-12-18

Applicant: ELITE MATERIAL CO., LTD.

Inventor： Yi-Fei YU ,  Ching-Hsien HSU

IPC: C08L79/04 ,  C08L33/08 ,  C08L67/00 ,  C08L63/00 ,  C08L33/14 ,  C08J5/24 ,  C08J5/18

Abstract: A resin composition and an article made from the resin composition are provided. The resin composition comprises: 30 parts by weight of thermosetting resin; 50 to 125 parts by weight of maleimide resin; and 5 to 35 parts by weight of monofunctional long-chain alkyl acrylate monomer. The resin composition is capable of achieving a proper viscosity and a good filling property whiling maintaining a high glass transition temperature.

公开(公告)号：US20220372284A1

公开(公告)日：2022-11-24

申请号：US17339566

申请日：2021-06-04

Applicant: Elite Material Co., Ltd.

Inventor： Ching-Hsien HSU ,  Tse-Hung LIU ,  Tsan-Hung TSAI

IPC: C08L71/12

Abstract: A resin composition includes 100 parts by weight of a vinyl-containing polyphenylene ether resin; 2 parts by weight to 50 parts by weight of any compound having a structure of Formula (1) or a combination thereof; and 20 parts by weight to 80 parts by weight of a polyolefin resin; the polyolefin resin includes styrene-butadiene-divinylbenzene terpolymer, styrene-butadiene-maleic anhydride terpolymer, styrene-butadiene copolymer, hydrogenated styrene-butadiene copolymer, polybutadiene, maleic anhydride-butadiene copolymer or a combination thereof. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.

公开(公告)号：US20220081559A1

公开(公告)日：2022-03-17

申请号：US17071322

申请日：2020-10-15

Applicant: Elite Material Co., Ltd.

Inventor： Ching-Hsien HSU

IPC: C08L71/12 ,  C08L79/08

Abstract: A resin composition includes 80 parts by weight to 160 parts by weight of a vinyl-containing resin, 0.1 part by weight to 1.0 part by weight of a first compound and 0.1 part by weight to 2.0 parts by weight of a second compound; wherein the vinyl-containing resin includes a vinyl-containing polyphenylene ether resin, a maleimide resin, a bis(vinylphenyl)ethane, a triallyl isocyanurate, a vinyl-containing polyolefin resin or a combination thereof, the first compound includes a structure of Formula (1) to Formula (3) or a combination thereof, and the second compound includes a structure of Formula (4) to Formula (6) or a combination thereof. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.

公开(公告)号：US20210371655A1

公开(公告)日：2021-12-02

申请号：US16923315

申请日：2020-07-08

Applicant: Elite Material Co., Ltd.

Inventor： Ching-Hsien HSU

IPC: C08L79/08 ,  C08J5/24

Abstract: A resin composition includes 60 parts by weight of a maleimide resin; 10 parts by weight to 30 parts by weight of an epoxy resin of Formula (I), wherein n represents an integer of 0 to 10: and 2 parts by weight to 40 parts by weight of a methylenebis (diethylaniline). Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.

公开(公告)号：US20210371627A1

公开(公告)日：2021-12-02

申请号：US16923283

申请日：2020-07-08

Applicant: Elite Material Co., Ltd.

Inventor： Kok-Sheng TAN ,  Ching-Hsien HSU

IPC: C08L9/00 ,  C08J5/24

Abstract: A resin composition includes 100 parts by weight of a polybutadiene and 10 parts by weight to 40 parts by weight of a maleimide resin, wherein: the polybutadiene has a 1,2-vinyl content of greater than or equal to 85%; the polybutadiene has a lithium ion content of less than or equal to 100 ppm; and the resin composition is free from a polyphenylene ether resin. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.

公开(公告)号：US20200263022A1

公开(公告)日：2020-08-20

申请号：US16359060

申请日：2019-03-20

Applicant: Elite Material Co., Ltd.

Inventor： Ching-Hsien HSU

IPC: C08L33/10 ,  C08L33/08 ,  C08L79/08 ,  C08K5/00 ,  C08K3/013

Abstract: Provided is a resin composition, which comprises 1 to 10 parts by weight of a bifunctional aliphatic long-chain acrylate and 30 to 50 parts by weight of a thermosetting resin. Moreover, an article is also provided, which is made from the resin composition described above. The article may comprise a prepreg, a resin film, a laminate or a printed circuit board.