公开(公告)号：US20240199791A1

公开(公告)日：2024-06-20

申请号：US18096169

申请日：2023-01-12

Applicant: Elite Material Co., Ltd.

Inventor： Chun-Hung CHEN ,  Chen-Yu HSIEH

IPC: C08G59/24 ,  C08G59/30 ,  C08G59/42 ,  C08J5/18 ,  C08J5/24 ,  C08K3/28 ,  C08K3/38

CPC classification number: C08G59/245 ,  C08G59/308 ,  C08G59/4223 ,  C08J5/18 ,  C08J5/24 ,  C08K3/28 ,  C08K3/38 ,  C08K2003/282 ,  C08K2003/385 ,  C08K2201/005

Abstract: A resin composition includes: (A) 100 parts by weight of an epoxy resin; (B) 10 to 30 parts by weight of a phenoxy resin; (C) 30 to 50 parts by weight of hydrogenated trimellitic anhydride; and (D) 250 to 400 parts by weight of a co-sintered body of aluminum nitride and boron nitride. The resin composition may be used to make a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including visible light reflectivity, routing distance, flame retardancy and copper foil peeling strength.

公开(公告)号：US20240409742A1

公开(公告)日：2024-12-12

申请号：US18348599

申请日：2023-07-07

Applicant: Elite Material Co., Ltd.

Inventor： Chun-Hung CHEN ,  Chen-Yu HSIEH

IPC: C08L79/08 ,  C08G73/02 ,  C08J5/24 ,  C08K3/38 ,  H05K1/03

Abstract: A resin composition includes 100 parts by weight of a prepolymer and 150 to 200 parts by weight of a ceramic filler, wherein: the prepolymer is prepared from a mixture subjected to a prepolymerization reaction, and the mixture includes a maleimide resin and a diamine compound in a molar ratio of between 1:2 and 2:1; the ceramic filler has a thermal conductivity of greater than 30 W/(m·K); and the diamine compound includes a compound of Formula (1), a compound of Formula (2), a compound of Formula (3) or a combination thereof. The resin composition may be used to make various articles, including a resin film, a prepreg, a laminate or a printed circuit board, and at least one or more properties can be improved.