公开(公告)号：US20090120678A1

公开(公告)日：2009-05-14

申请号：US12267864

申请日：2008-11-10

Applicant: Erick Spory

Inventor： Erick Spory

IPC: H05K1/11 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K1/16 ,  H01R12/52 ,  H01R12/7082 ,  H05K3/326 ,  H05K2201/09081 ,  H05K2201/09481 ,  H05K2201/0949 ,  H05K2201/10378

Abstract: An interconnecting structure for interconnecting two electronic modules. The structure includes a dielectric substrate having a copper trace deposited on the lower surface thereof, and a copper pad disposed on the upper surface of the substrate directly above one end of the trace. A first copper plate-up area deposited on the pad, and a second copper plate-up area is deposited on the distal end of the trace. A slot, semi-circumscribing the pad and extending on both sides of the trace toward the distal end of the trace, is cut through the substrate to allow the proximal end of the trace to be displaced in a cantilevered manner below the lower side of the substrate when a force is applied to the pad.

Abstract translation: 用于互连两个电子模块的互连结构。 该结构包括具有沉积在其下表面上的铜迹线的电介质基板，以及直接位于迹线一端上方的衬底的上表面上的铜焊盘。 沉积在垫上的第一铜平板区域和第二铜平板区域沉积在迹线的远端上。 将衬垫半封闭并在迹线的两侧延伸到迹线的远端的狭缝被切穿穿过衬底，以允许迹线的近端以悬臂方式移位到下方的下方 当将力施加到衬垫时，衬底。

公开(公告)号：US08466371B2

公开(公告)日：2013-06-18

申请号：US12267864

申请日：2008-11-10

Applicant: Erick Spory

Inventor： Erick Spory

IPC: H05K1/16

CPC classification number: H05K1/16 ,  H01R12/52 ,  H01R12/7082 ,  H05K3/326 ,  H05K2201/09081 ,  H05K2201/09481 ,  H05K2201/0949 ,  H05K2201/10378

Abstract: An interconnecting structure for interconnecting two electronic modules. The structure includes a dielectric substrate having a copper trace deposited on the lower surface thereof, and a copper pad disposed on the upper surface of the substrate directly above one end of the trace. A first copper plate-up area deposited on the pad, and a second copper plate-up area is deposited on the distal end of the trace. A slot, semi-circumscribing the pad and extending on both sides of the trace toward the distal end of the trace, is cut through the substrate to allow the proximal end of the trace to be displaced in a cantilevered manner below the lower side of the substrate when a force is applied to the pad.

Abstract translation: 用于互连两个电子模块的互连结构。 该结构包括具有沉积在其下表面上的铜迹线的电介质基板，以及直接位于迹线一端上方的衬底的上表面上的铜焊盘。 沉积在垫上的第一铜平板区域和第二铜平板区域沉积在迹线的远端上。 将衬垫半封闭并在迹线的两侧延伸到迹线的远端的狭缝被切穿穿过衬底，以允许迹线的近端以悬臂方式移位到下方的下方 当将力施加到衬垫时，衬底。