公开(公告)号：US20180080610A1

公开(公告)日：2018-03-22

申请号：US15822574

申请日：2017-11-27

Applicant: Molex, LLC

Inventor： Daniel B. McGowan ,  Michael C. Picini

IPC: H01L25/075 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H05K1/18 ,  H01L33/64 ,  H05K3/00 ,  H05K1/05 ,  H05K3/12 ,  H01L33/62 ,  H05K1/11

CPC classification number: F21K9/20 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2933/005 ,  H01L2933/0066 ,  H05K1/05 ,  H05K1/117 ,  H05K1/183 ,  H05K3/0026 ,  H05K3/12 ,  H05K2201/09018 ,  H05K2201/09081 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014

Abstract: A light emitting diode (LED) module includes a base that is conductive and is selectively covered with an insulative layer. The base can include a connecting flange and a light emitting region. Traces are provided on the insulative coating and can be used to connect LEDs positioned on the light emitting region to pads on the connecting flange. The connecting flange can be offset in angle and/or position from the base and can be configured to provide a contact shape suitable to mate with a connector in a polarized manner. The base can be shaped so as to provide the desired functionality.

公开(公告)号：US09844148B2

公开(公告)日：2017-12-12

申请号：US15379177

申请日：2016-12-14

Applicant: CelLink Corporation

Inventor： Kevin Coakley ,  Malcolm Brown

IPC: H01L21/00 ,  H01M2/34 ,  H05K3/00 ,  H01L23/538 ,  H05K1/11 ,  H05K1/18 ,  H05K3/40 ,  H01M2/20 ,  H01M10/48 ,  H05K1/02 ,  H01M10/42

CPC classification number: H05K3/0058 ,  H01L23/5386 ,  H01M2/202 ,  H01M2/206 ,  H01M10/4257 ,  H01M10/48 ,  H05K1/0268 ,  H05K1/118 ,  H05K1/189 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/056 ,  H05K2201/09081 ,  H05K2201/10037

Abstract: Provided are interconnect circuits for interconnecting arrays of devices and methods of forming these interconnect circuits as well as connecting these circuits to the devices. An interconnect circuit may include a conductive layer and one or more insulating layers. The conductive layer may be patterned with openings defining contact pads, such that each pad is used for connecting to a different electrical terminal of the interconnected devices. In some embodiments, each contact pad is attached to the rest of the conductive layer by a fusible link formed from the same conductive layer as the contact pad. The fusible link controls the current flow to and from this contact pad. The insulating layer is laminated to the conductive layer and provides support to the contacts pads. The insulating layer may also be patterned with openings, which allow forming electrical connections between the contact pads and cell terminals through the insulating layer.

公开(公告)号：US09780471B2

公开(公告)日：2017-10-03

申请号：US15313401

申请日：2015-05-18

Applicant: PHILIPS LIGHTING HOLDING B.V.

Inventor： Nicolaas Antonie Van Rijswijk

IPC: H01R12/73 ,  H05K1/14 ,  H05K1/11 ,  H05K3/36 ,  H01R12/70

CPC classification number: H01R12/737 ,  H01R12/7023 ,  H05K1/11 ,  H05K1/141 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/09063 ,  H05K2201/09081

Abstract: A printed circuit board arrangement and a method for mounting a product to a main printed circuit board (100) at a substantially perpendicular angle, the printed circuit board arrangement comprises a main printed circuit board (100) comprising an elongated slot (102), and a product (128) comprising a connector portion (130) configured to be inserted into the elongated slot (102). The connector portion (130) is such that the product (128) may be attached at a substantially perpendicular angle to the main printed circuit board (100). The elongated slot (102) comprises a protrusion (104), and the connector portion (130) comprises a spring portion (132) configured to engage with the protrusion (104) when the connector portion (130) is inserted into the elongated slot (102). This results in a force pressing the connector portion (130) of the product (128) to at least one side wall of the elongated slot (102).

公开(公告)号：US09686866B2

公开(公告)日：2017-06-20

申请号：US14833129

申请日：2015-08-23

Applicant: Unimicron Technology Corp.

Inventor： Hung-Lin Chang ,  Ta-Han Lin

IPC: H05K1/18 ,  H05K3/46 ,  H05K1/11 ,  H05K1/02 ,  H05K1/03

CPC classification number: H05K1/186 ,  H01L23/3121 ,  H01L2224/04105 ,  H01L2224/19 ,  H01L2224/73259 ,  H01L2224/92224 ,  H01L2924/15153 ,  H01L2924/19105 ,  H05K1/0298 ,  H05K1/0326 ,  H05K1/0333 ,  H05K1/0346 ,  H05K1/111 ,  H05K1/115 ,  H05K3/4644 ,  H05K3/4697 ,  H05K2201/0129 ,  H05K2201/0145 ,  H05K2201/09081 ,  H05K2201/09545

Abstract: A package structure includes a circuit substrate, at least one electronic component, and a connecting slot. The circuit substrate includes at least one core layer, a build-up structure including at least three patterned circuit layers, at least two dielectric layers and conductive through holes, and circuit pads. The electronic component is embedded in at least one of the dielectric layers and located in a disposition area. The electronic component is electrically connected to one of the patterned circuit layers through a portion of the conductive through holes. The connecting slot has a bottom portion, a plurality of sidewall portions connecting the bottom portion, and a plurality of connecting pads located on the sidewall portions. The circuit substrate is assembled to the bottom portion, and the circuit pads are electrically connected to the connecting pads through a bent area of the core layer that is bent relative to the disposition area.

公开(公告)号：US20170094802A1

公开(公告)日：2017-03-30

申请号：US15379177

申请日：2016-12-14

Applicant: CelLink Corporation

Inventor： Kevin Coakley ,  Malcolm Brown

IPC: H05K3/00 ,  H01M10/48 ,  H05K1/02 ,  H01M2/20 ,  H05K3/40 ,  H05K1/11

CPC classification number: H05K3/0058 ,  H01L23/5386 ,  H01M2/202 ,  H01M2/206 ,  H01M10/4257 ,  H01M10/48 ,  H05K1/0268 ,  H05K1/118 ,  H05K1/189 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/056 ,  H05K2201/09081 ,  H05K2201/10037

Abstract: Provided are interconnect circuits for interconnecting arrays of devices and methods of forming these interconnect circuits as well as connecting these circuits to the devices. An interconnect circuit may include a conductive layer and one or more insulating layers. The conductive layer may be patterned with openings defining contact pads, such that each pad is used for connecting to a different electrical terminal of the interconnected devices. In some embodiments, each contact pad is attached to the rest of the conductive layer by a fusible link formed from the same conductive layer as the contact pad. The fusible link controls the current flow to and from this contact pad. The insulating layer is laminated to the conductive layer and provides support to the contacts pads. The insulating layer may also be patterned with openings, which allow forming electrical connections between the contact pads and cell terminals through the insulating layer.

公开(公告)号：US20170094800A1

公开(公告)日：2017-03-30

申请号：US15279080

申请日：2016-09-28

Applicant: TactoTek Oy

Inventor： Antti KERANEN ,  Mikko HEIKKINEN ,  Pasi RAAPPANA ,  Jarmo SAASKI

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/16 ,  H05K3/46 ,  H05K3/12 ,  H05K3/28 ,  H05K3/00 ,  H05K1/02 ,  H05K3/40

CPC classification number: H05K1/189 ,  H05K1/0269 ,  H05K1/028 ,  H05K1/111 ,  H05K1/118 ,  H05K1/16 ,  H05K3/0044 ,  H05K3/12 ,  H05K3/28 ,  H05K3/4092 ,  H05K3/46 ,  H05K2201/0129 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/09754 ,  H05K2203/0228 ,  H05K2203/1316

Abstract: A multilayer structure includes a flexible substrate film having a first side and opposite second side, a number of conductive traces, optionally defining contact pads and/or conductors, printed on the first side for establishing a desired predetermined circuit design, a plastic layer molded onto the first side so as to enclose the circuit between the plastic layer and the first side, and a connector in a form of a flexible flap for providing external electrical connection to the embedded circuit from the second, opposite side, the connector defined by a portion of the substrate film accommodating at least part of one or more of the printed conductive traces and cut partially loose from the surrounding substrate material to establish the flap, whose loose end is bendable away from the molded plastic layer to facilitate establishment of the electrical connection with external element, wire or connector, via the associated gap.

公开(公告)号：US20160380380A1

公开(公告)日：2016-12-29

申请号：US15189586

申请日：2016-06-22

Applicant: Johnson Electric S.A.

Inventor： Martin Koepsell

IPC: H01R13/52 ,  B33Y80/00

CPC classification number: H01R13/03 ,  B33Y80/00 ,  H01R12/7088 ,  H01R12/777 ,  H01R12/91 ,  H01R13/5202 ,  H01R13/521 ,  H05K1/028 ,  H05K1/118 ,  H05K2201/055 ,  H05K2201/09081 ,  H05K2203/1173

Abstract: A sealed electrical connection assembly joins an electrical component to a plug-in component. For liquid-tight sealing, the free, deformable ends of the conductor tracks of the electrical component and/or the contact elements of the plug-in component are provided with hydrophobic surfaces at least regionally, so that even after a plurality of plug contact operations have been performed, in the coupling position and, optionally, in the uncoupled position, the contact region is surrounded by hydrophobic surfaces.

Abstract translation: 密封的电连接组件将电气部件连接到插入式部件。 对于液密密封，电气部件和/或插件部件的接触元件的导体轨迹的自由变形的端部至少在区域上设置有疏水表面，使得即使在多个插头接触操作之后 已经在耦合位置和可选地在非耦合位置执行接触区域被疏水表面包围。

公开(公告)号：US09274289B2

公开(公告)日：2016-03-01

申请号：US13676351

申请日：2012-11-14

Applicant: International Business Machines Corporation

Inventor： Stefano Sergio Oggioni ,  Jonas R. Weiss ,  Bert Jan Offrein

IPC: G02B6/36 ,  G02B6/42 ,  G02B6/43 ,  H05K1/02 ,  G02B6/13 ,  H05K13/00 ,  G02B6/38 ,  H05K1/18 ,  H05K3/34 ,  G02B6/12

CPC classification number: G02B6/42 ,  G02B6/13 ,  G02B6/3885 ,  G02B6/4214 ,  G02B6/43 ,  G02B2006/12166 ,  H05K1/0274 ,  H05K1/184 ,  H05K1/189 ,  H05K3/3405 ,  H05K13/00 ,  H05K2201/09081 ,  H05K2201/10121 ,  H05K2201/10674 ,  H05K2203/0195 ,  Y10T29/49002 ,  Y10T29/49037 ,  Y10T29/49124 ,  Y10T29/49826 ,  Y10T29/53

Abstract: Embodiments provide a horizontally movable stage, with an opening, of a flip-chip bonder, a substrate including at least one flexible portion and a waveguide, the waveguide exposed at one end edge of the substrate positioned upon the stage with the end edge over the opening, a vertically upwardly movable clamp sized to penetrate the stage opening and positioned underneath the stage, a vertically downwardly movable bond head above the stage opening, an optical component positioned in the head, a glue dispenser positioned to provide glue to either a mating surface of the substrate exposed end edge or a mating surface of the optical component, and a controller connected to the stage, clamp, head and dispenser, including a control circuit for positioning the substrate waveguide exposed end edge underneath the optical component while dispensing glue for fixably bonding the mating surfaces of the optical component and the substrate exposed end edge.

Abstract translation: 实施例提供了具有倒装芯片连接器的开口的水平移动平台，包括至少一个柔性部分和波导的基板，该波导在位于台面上的基板的一个端部边缘处露出，端部边缘超过 开口，垂直向上可移动的夹具，其大小适于穿透平台开口并且定位在平台下方，在平台开口上方具有垂直向下可移动的接合头，定位在头部中的光学部件，定位成将胶水提供给配合表面 衬底暴露的端边缘或光学部件的配合表面，以及连接到平台，夹具，头部和分配器的控制器，包括用于将衬底波导暴露的端部边缘定位在光学部件下方的控制电路，同时分配用于可固定的胶 粘合光学部件的配合表面和基板暴露的端部边缘。

公开(公告)号：US09237683B2

公开(公告)日：2016-01-12

申请号：US14024826

申请日：2013-09-12

Applicant: DELPHI TECHNOLOGIES, INC.

Inventor： Vineet Gupta ,  Joseph K. Huntzinger ,  Michael G. Coady ,  Curtis Allen Stapert ,  Kevin Earl Meyer ,  Timothy D. Garner ,  Jeffrey T. Bell ,  Robert L. Vadas ,  Allen E. Oberlin

IPC: H05K7/20 ,  H05K9/00 ,  H04B1/08 ,  H05K1/02 ,  H05K5/02 ,  H05K13/00 ,  H04R1/02 ,  B29C59/16 ,  G06F11/00 ,  B60R11/02 ,  H05K1/14

CPC classification number: H05K9/0007 ,  B29C59/16 ,  B60R11/02 ,  G06F11/00 ,  H04B1/082 ,  H04R1/02 ,  H05K1/0215 ,  H05K1/141 ,  H05K5/0217 ,  H05K5/0221 ,  H05K5/0226 ,  H05K7/20409 ,  H05K7/20418 ,  H05K7/20436 ,  H05K9/0047 ,  H05K9/0079 ,  H05K9/0081 ,  H05K13/00 ,  H05K2201/09081 ,  H05K2201/10386 ,  H05K2201/10446 ,  Y10T16/547 ,  Y10T16/5476 ,  Y10T29/49002 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49169 ,  Y10T29/49172 ,  Y10T29/4957 ,  Y10T29/49826 ,  Y10T29/49861 ,  Y10T29/5313 ,  Y10T74/20396 ,  Y10T403/70 ,  Y10T403/77 ,  Y10T428/24289

Abstract: A lightweight radio/Audio player for vehicular application includes a case and frontal interface formed of polymer based material molded to provide details to accept audio devices and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips.

Abstract translation: 用于车辆应用的轻便无线电/音频播放器包括由聚合物基材料模制的壳体和正面接口，以提供接收音频设备和无线电接收器的细节以及电气控制和显示所需的电路板。 外壳和正面接口为复合结构，包括已经通过模制操作预先形成轮廓的镶嵌模制导电丝网。 丝网通过暴露的金属丝网垫和相邻的接地夹提供电路板的屏蔽和接地。

公开(公告)号：US20150327330A1

公开(公告)日：2015-11-12

申请号：US14706042

申请日：2015-05-07

Applicant: I.G. BAUERHIN GMBH

Inventor： KARL LOCHMANN ,  DIETER BARTHEL

IPC: H05B1/02 ,  H05B3/26

CPC classification number: H05B1/0236 ,  H05B3/26 ,  H05B3/34 ,  H05B2203/003 ,  H05B2203/016 ,  H05B2203/029 ,  H05K1/0212 ,  H05K1/0265 ,  H05K1/117 ,  H05K2201/062 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/10151

Abstract: An apparatus for heating surfaces in the internal space of a motor vehicle comprises at least one heating element, having at least one heating conductor that forms an electrical heating circuit, and at least one carrier material, wherein the heating conductor has at least two HC terminal ends and the temperature acquisition element has at least two TA terminal ends. This apparatus for heating is characterized in that at least two of the HC and TA terminal ends are electrically connected to first HC terminal areas or first TA terminal areas of a printed circuit board and in that the printed circuit board has second HC terminal areas and second TA terminal areas, wherein the first HC terminal areas and the second HC terminal areas are at least in part connected to each other via first pcb traces and the first TA terminal areas and the second TA terminal areas via second pcb traces, wherein the first and the second pcb traces are part of the printed circuit board, and wherein the printed circuit board is arranged on, under or at the at least one carrier material.

Abstract translation: 一种用于加热机动车辆的内部空间中的表面的装置包括至少一个加热元件，其具有形成电加热回路的至少一个加热导体和至少一个载体材料，其中加热导体具有至少两个HC端子 端部，并且温度采集元件具有至少两个TA终端。 该加热装置的特征在于，HC和TA终端中的至少两个电连接到印刷电路板的第一HC端子区域或第一TA端子区域，并且印刷电路板具有第二HC端子区域和第二HC端子区域 TA端子区域，其中第一HC端子区域和第二HC端子区域经由第一pcb迹线和经由第二pcb迹线的第一TA端子区域和第二TA端子区域至少部分地彼此连接，其中第一和 所述第二pcb迹线是所述印刷电路板的一部分，并且其中所述印刷电路板布置在所述至少一种载体材料的下方或下方。