Thermal cover for T1/HDSL repeater case
    1.
    发明授权
    Thermal cover for T1/HDSL repeater case 失效
    T1 / HDSL中继器外壳的热盖

    公开(公告)号:US06396691B1

    公开(公告)日:2002-05-28

    申请号:US09550619

    申请日:2000-04-17

    Inventor: Ernest Pagnozzi

    CPC classification number: H05K7/20445 H04Q1/035 H04Q2201/06

    Abstract: A repeater case capable of housing HDSL telecommunications modules without an excessive buildup of heat. The repeater case has a base, an open-topped housing, and a closure member that closes the housing. The closure member is provided in the form of a pair of thermal covers that share a common construction, including heat-radiating fins formed on their respective top walls and heat transferring structures positioned on the respective interior sides of their top walls. The housing includes multiple printed circuit boards to further enhance internal air flow, each of which is protected from short circuits by an acrylic plastic barrier mounted in vertically spaced apart relation from it. The spacing between each printed circuit board and its barrier provides ample space for the connection of individual conductors from a stub cable that enters the repeater case through an opening formed in the base. The spacing also enhances the air flow within the repeater case.

    Abstract translation: 一种能够容纳HDSL电信模块而不会过多积聚热量的中继器。 中继器壳体具有底座,敞开的外壳以及关闭壳体的封闭构件。 封闭构件以一对热罩的形式提供,共享共同的结构,包括形成在其各自顶壁上的散热翅片和位于其顶壁的相应内侧上的热传递结构。 壳体包括多个印刷电路板,以进一步增强内部空气流动,其中的每一个通过与其垂直间隔开的关系安装的丙烯酸塑料屏障而被短路保护。 每个印刷电路板与其屏障之间的间隔为通过形成在基座中的开口进入中继器外壳的短路电缆连接各个导体提供了充足的空间。 间距也增强了中继器外壳内的气流。

Patent Agency Ranking