Abstract:
The present invention is a method and apparatus for providing an electrical substrate. The electrical substrate comprises a dielectric layer; and a first conductive layer attached to the dielectric layer, in which the first conductive layer has an elliptical cross-section. The electrical substrate may be used in a flexible circuit that connects the read/write head to electronic circuitry in a hard disk drive.
Abstract:
A write circuit and a head for a hard disk drive. The head includes a substrate that has an electrical ground and a write element that has a center tap. The head also has a resistor that is connected to the center tap and the electrical ground. The resistor provides a return path for AC and DC components of any common mode signal in a write circuit. The resistor can also generate heat that thermally expands the head and varies a head flying height. The write element is connected to an write driver circuit that provides in phase currents to a write element during the write operation and out of phase currents during a read operation. The out of phase currents allow for thermal expansion and flying height control even during a read operation.
Abstract:
A method for determining whether a magneto-resistive head of a hard disk drive is defective for having an undesirable break down voltage. The method includes applying a voltage to a heater element of a magneto-resistive head and measuring a write element resistance and a read element resistance. A temperature coefficient of resistance for the read element is determined from the measured read and write element resistances. The head is considered defective if the temperature coefficient exceeds a threshold.
Abstract:
An interconnect that may reduce a head slider's exposure to electrostatic discharge events and may dissipate charging of the head is provided. Conductive and nonconductive adhesives are used to adhere a head slider to the interconnect. An electromagnetic interference generating circuit generates current that flows through the conductive adhesive bonding the head slider to the flexure arm. The electromagnetic interference current breaks down the resistance of the conductive adhesive to dissipate an electrostatic voltage charge on the head slider. This may prolong the life of the head slider and a read/write head coupled to the head slider.
Abstract:
A head for a hard disk drive. The head includes a substrate, a write element, a read element and a heater element. The head also includes a buffer layer between the read element and the substrate, and a first resistor connected to the heater element and the buffer layer. The buffer layer and resistor create an impedance that suppresses noise introduced to the head from the disk of the drive.
Abstract:
A head for a hard disk drive. The head includes a substrate, a write element, a read element and a heater element. The head also includes a buffer layer between the read element and the substrate, and a first resistor connected to the heater element and the buffer layer. The buffer layer and resistor create an impedance that suppresses noise introduced to the head from the disk of the drive.
Abstract:
A printed circuit that connects a head to a pre-amplifier circuit of a hard disk drive. The head has a pair of write bond pads and a pair of read bond pads. The printed circuit has a pair of read traces located in a first layer and connected to the read bond pads. The printed circuit also has a pair of write traces that are located in a second layer and connected to the write bond pads. The write traces cross with the read traces so that a head fabricated from a single head wafer can be used as a Up head in a hard disk drive.
Abstract:
A write circuit and a head for a hard disk drive. The head includes a substrate that has an electrical ground and a write element that has a center tap. The head also has a resistor that is connected to the center tap and the electrical ground. The resistor provides a return path for AC and DC components of any common mode signal in a write circuit. The resistor can also generate heat that thermally expands the head and varies a head flying height. The write element is connected to an write driver circuit that provides in phase currents to a write element during the write operation and out of phase currents during a read operation. The out of phase currents allow for thermal expansion and flying height control even during a read operation.
Abstract:
A printed circuit that connects a head to a pre-amplifier circuit of a hard disk drive. The head has a pair of write bond pads and a pair of read bond pads. The printed circuit has a pair of read traces located in a first layer and connected to the read bond pads. The printed circuit also has a pair of write traces that are located in a second layer and connected to the write bond pads. The write traces cross with the read traces so that a head fabricated from a single head wafer can be used as a Up head in a hard disk drive.
Abstract:
A hard disk drive that includes a head coupled to a disk. The head has a heater element. The drive also includes a controller that causes the heater element to heat the head to a temperature sufficient to anneal material within the head. The head is heated to a temperature sufficient to cause oxidation of any metal, such as aluminum, within the head, and/or oxygen redistribution and homogenization in the barrier. This heating process preferably occurs while the drive is not writing or reading data and the head is off disk.