Integration techniques for micromachined pMUT arrays and electronics using thermocompression bonding, eutectic bonding, and solder bonding

    公开(公告)号:US12263507B2

    公开(公告)日:2025-04-01

    申请号:US17095333

    申请日:2020-11-11

    Abstract: The present disclosure provides methods to integrate piezoelectric micromachined ultrasonic transducer (pMUT) arrays with an application-specific integrated circuit (ASIC) using thermocompression or eutectic/solder bonding. In an aspect, the present disclosure provides a device comprising a first substrate and a second substrate, the first substrate comprising a pMUT array and the second substrate comprising an electrical circuit, wherein the first substrate and the second substrate are bonded together using thermocompression, wherein any set of individual PMUTs of PMUT array is addressable. In another aspect, the present disclosure provides a device comprising a first substrate and a second substrate, the first substrate comprising a pMUT array and the second substrate comprising an electrical circuit, wherein the first substrate and the second substrate are bonded together using eutectic or solder bonding, wherein any set of individual PMUTs of the PMUT array is addressable.

    ULTRASONIC IMAGING DEVICE WITH PROGRAMMABLE ANATOMY AND FLOW IMAGING

    公开(公告)号:US20210278530A1

    公开(公告)日:2021-09-09

    申请号:US17153631

    申请日:2021-01-20

    Abstract: An imaging device includes a transducer that includes an array of piezoelectric elements formed on a substrate. Each piezoelectric element includes at least one membrane suspended from the substrate, at least one bottom electrode disposed on the membrane, at least one piezoelectric layer disposed on the bottom electrode, and at least one top electrode disposed on the at least one piezoelectric layer. Adjacent piezoelectric elements are configured to be isolated acoustically from each other. The device is utilized to measure flow or flow along with imaging anatomy.

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