公开(公告)号：US20250095953A1

公开(公告)日：2025-03-20

申请号：US18970226

申请日：2024-12-05

Applicant: FEI COMPANY

Inventor： Adam STOKES ,  Cliff BUGGE ,  Brandon VAN LEER ,  Valerie BROGDEN ,  Chengge JIAO ,  Letian LI ,  David DONNET

IPC: H01J37/20 ,  H01J37/244 ,  H01J37/28

Abstract: Methods and systems for performing sample lift-out and creating attachments for highly reactive materials within charged particle microscopy systems are disclosed herein. Methods include creating attachments between a sample manipulator and a sample within a charged particle system and translating a sample manipulator so that the sample manipulator is proximate to a sample such that a portion of the sample manipulator proximate to the sample is composed of a high sputter yield material. The methods and systems include milling, with a charged particle beam, the high sputter yield material such that portions of the high sputter yield material are removed from the sample manipulator without milling away material from the sample such that at least some of the removed high sputter yield material redeposits to form an attachment between the sample manipulator and the sample without milling material away from the sample.

公开(公告)号：US20230215683A1

公开(公告)日：2023-07-06

申请号：US17566894

申请日：2021-12-31

Applicant: FEI Company

Inventor： Adam STOKES ,  Cliff BUGGE ,  Brandon VAN LEER ,  Valerie BROGDEN ,  Chengge JIAO ,  Letian LI ,  David DONNET

IPC: H01J37/20 ,  H01J37/28 ,  H01J37/244

CPC classification number: H01J37/20 ,  H01J37/28 ,  H01J37/244 ,  H01J2237/24475 ,  H01J2237/31749 ,  H01J2237/2007

Abstract: Methods and systems for performing sample lift-out and protective cap placement for highly reactive materials within charged particle microscopy systems are disclosed herein. Methods include preparing a nesting void in a support structure, translating at least a portion of a sample into the nesting void, and milling material from a region of the support structure that defines the nesting void. The material from the region of the support structure is milled such that at least some of the removed material redeposits to form an attachment bond between the sample and a remaining portion of the support structure. In various embodiments, the sample can then be investigated using one or more of serial sectioning tomography on the sample, enhanced insertable backscatter detector (CBS) analysis on the sample, and electron backscatter diffraction (EBSD) analysis on the sample.