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公开(公告)号：US09545682B2
公开(公告)日：2017-01-17
申请号：US14931957
申请日：2015-11-04
Applicant: Ferro Corporation
IPC: B23K31/02 , B23K1/00 , H01L23/10 , B23K1/19 , H01L31/048 , H01L31/18 , H05K13/00 , B23K1/002 , B23K1/005 , B23K1/06 , B23K35/26 , C03C27/08 , H01G9/20 , H01L51/52
CPC classification number: B23K1/0008 , B23K1/0016 , B23K1/002 , B23K1/005 , B23K1/0053 , B23K1/0056 , B23K1/06 , B23K1/19 , B23K31/02 , B23K35/262 , C03C27/08 , H01G9/2077 , H01L23/10 , H01L31/048 , H01L31/0488 , H01L31/18 , H01L51/5246 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , H05K13/00 , Y02E10/50 , Y10T156/10 , Y10T156/1062 , H01L2924/00
Abstract: Solder can be used to wet and bind glass substrates together to ensure a hermetic seal that superior (less penetrable) than conventional polymeric (thermoplastic or thermoplastic elastomer) seals in electric and electronic applications.
Abstract translation: 焊接可用于将玻璃基板湿润并粘合在一起，以确保在电气和电子应用中比常规聚合物（热塑性或热塑性弹性体）密封件更好（更不易穿透）的气密密封。
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Patent Agency Ranking
公开(公告)号：US20160059339A1
公开(公告)日：2016-03-03
申请号：US14931957
申请日：2015-11-04
Applicant: Ferro Corporation
CPC classification number: B23K1/0008 , B23K1/0016 , B23K1/002 , B23K1/005 , B23K1/0053 , B23K1/0056 , B23K1/06 , B23K1/19 , B23K31/02 , B23K35/262 , C03C27/08 , H01G9/2077 , H01L23/10 , H01L31/048 , H01L31/0488 , H01L31/18 , H01L51/5246 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , H05K13/00 , Y02E10/50 , Y10T156/10 , Y10T156/1062 , H01L2924/00
Abstract: Solder can be used to wet and bind glass substrates together to ensure a hermetic seal that superior (less penetrable) than conventional polymeric (thermoplastic or thermoplastic elastomer) seals in electric and electronic applications.
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公开(公告)号：US09565772B2
公开(公告)日：2017-02-07
申请号：US14907590
申请日：2014-07-22
Applicant: Ferro Corporation
Inventor： George E. Sakoske , Phil Maitland , Dietrich Speer , Frank Walter , Robert P. Blonski , Srinivasan Sridharan
CPC classification number: H05K3/1291 , H05K1/0296 , H05K1/0306 , H05K1/092 , H05K1/115 , H05K3/282 , H05K3/388 , H05K3/389 , H05K2201/0338 , H05K2203/1126
Abstract: The present subject matter provides for a multi-layer conductive trace. The trace can be formed by digital printing the individual layers and firing. The individual layers each impart functional characteristics to the conductive trace and each layer has components that can be adjusted to affect the performance characteristics of that particular layer without detrimentally affecting the performance characteristics of the remaining layers.
Abstract translation: 本主题提供多层导电迹线。 痕迹可以通过数字印刷单独的层和烧制形成。 各个层各自赋予导电迹线功能特征，并且每个层具有可被调整以影响该特定层的性能特征的组分，而不会有害地影响剩余层的性能特征。
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公开(公告)号：US20160174386A1
公开(公告)日：2016-06-16
申请号：US14907590
申请日：2014-07-22
Applicant: FERRO CORPORATION
Inventor： George E. Sakoske , Phil Maitland , Dietrich Speer , Frank Walter , Robert P. Blonski , Srinivasan Sridharan
CPC classification number: H05K3/1291 , H05K1/0296 , H05K1/0306 , H05K1/092 , H05K1/115 , H05K3/282 , H05K3/388 , H05K3/389 , H05K2201/0338 , H05K2203/1126
Abstract: The present subject matter provides for a multi-layer conductive trace. The trace can be formed by digital printing the individual layers and firing. The individual layers each impart functional characteristics to the conductive trace and each layer has components that can be adjusted to affect the performance characteristics of that particular layer without detrimentally affecting the performance characteristics of the remaining layers.
Abstract translation: 本主题提供多层导电迹线。 痕迹可以通过数字印刷单独的层和烧制形成。 各个层各自赋予导电迹线功能特征，并且每个层具有可被调整以影响该特定层的性能特征的组分，而不会有害地影响剩余层的性能特征。
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5.发明申请公开(公告)号：US20140261975A1
公开(公告)日：2014-09-18
申请号：US14353557
申请日：2012-11-01
Applicant: Ferro Corporation
Inventor： Srinivasan Sridharan , John J. Maloney , Chandrashekhar S. Khadilkar , Robert P. Blonski , Gregory R. Prinzbach , George E. Sakoske
CPC classification number: C03C27/06 , C03C8/00 , C03C8/04 , C03C8/06 , C03C8/10 , C03C8/12 , C03C8/24 , C03C23/0065 , C03C27/00 , C03C27/10 , C04B37/045 , C04B2237/10 , C04B2237/32
Abstract: A frit-based hermetic sealing system for sealing glass plates to one another, or sealing glass to ceramics is disclosed. Seal materials, the methods to apply these seal materials, and the seal designs for selective and controlled absorption of microwave energy to heat and seal the system are presented. The hermetic seals are useful in various applications such as (a) encapsulating solar cells based on silicon, organic systems, and thin film, (b) encapsulating other electronic devices such as organic LEDs, (c) producing Vacuum Insulated Glass windows, and (d) architectural windows and automotive glass.
Abstract translation: 公开了一种用于将玻璃板彼此密封或将玻璃密封到陶瓷的玻璃料密封系统。 提出了密封材料，应用这些密封材料的方法，以及用于选择性和受控吸收微波能量以加热和密封系统的密封设计。 气密密封件可用于各种应用，例如（a）基于硅，有机系统和薄膜封装太阳能电池，（b）封装诸如有机LED的其它电子器件，（c）制造真空绝缘玻璃窗和（ d）建筑窗户和汽车玻璃。
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公开(公告)号：US20140026619A1
公开(公告)日：2014-01-30
申请号：US13947301
申请日：2013-07-22
Applicant: Ferro Corporation
Inventor： John J. Maloney , Andrew M. Rohn, JR. , Chandrashekhar S. Khadilkar , Srinivasan Sridharan , Robert P. Blonski , George E. Sakoske
IPC: C03B23/24
CPC classification number: C03B23/245 , C03C3/066 , C03C3/072 , C03C3/093 , C03C8/04 , C03C8/10 , C03C8/24 , C03C23/001 , C03C27/00
Abstract: Broadband infrared radiation is used to heat and fuse an enamel paste to form an enamel seal between at least two solid substrates such as glass, ceramic or metal.
Abstract translation: 宽带红外辐射用于加热和熔化搪瓷膏，以在至少两个固体基底如玻璃，陶瓷或金属之间形成搪瓷密封。
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