公开(公告)号：US10111343B2

公开(公告)日：2018-10-23

申请号：US14538684

申请日：2014-11-11

Applicant: FINISAR CORPORATION

Inventor： Henry Meyer Daghighian ,  Steven C. Bird ,  YongShan Zhang

IPC: H01K3/10 ,  H05K3/40 ,  H05K3/00 ,  H05K1/02

Abstract: Some embodiments relate to micro vias in printed circuit boards (PCBs). In an example, a PCB may include a PCB substrate and a micro via. The micro via may extend between opposing surfaces of the PCB substrate and may have a diameter less than or equal to about 100 microns. In another example, a method of forming micro vias in a PCB may include forming a through hole in a PCB substrate of the PCB. The method may also include positioning a pillar that is electrically conductive within the through hole. The method may also include backfilling the through hole around the pillar with an epoxy backfill.

公开(公告)号：US20150136468A1

公开(公告)日：2015-05-21

申请号：US14538684

申请日：2014-11-11

Applicant: FINISAR CORPORATION

Inventor： Henry Meyer Daghighian ,  Steven C. Bird ,  YongShan Zhang

IPC: H05K1/11 ,  H05K3/00

CPC classification number: H05K3/4046 ,  H05K1/0245 ,  H05K1/0251 ,  H05K3/0094 ,  H05K2201/0959 ,  H05K2201/09636 ,  H05K2201/10242 ,  Y10T29/49165

Abstract: Some embodiments relate to micro vias in printed circuit boards (PCBs). In an example, a PCB may include a PCB substrate and a micro via. The micro via may extend between opposing surfaces of the PCB substrate and may have a diameter less than or equal to about 100 microns. In another example, a method of forming micro vias in a PCB may include forming a through hole in a PCB substrate of the PCB. The method may also include positioning a pillar that is electrically conductive within the through hole. The method may also include backfilling the through hole around the pillar with an epoxy backfill.

Abstract translation: 一些实施例涉及印刷电路板（PCB）中的微通孔。 在一个示例中，PCB可以包括PCB基板和微通孔。 微通孔可以在PCB基板的相对表面之间延伸并且可以具有小于或等于约100微米的直径。 在另一示例中，在PCB中形成微通孔的方法可以包括在PCB的PCB衬底中形成通孔。 该方法还可以包括定位在通孔内导电的支柱。 该方法还可以包括用环氧填充物填充柱周围的通孔。