Antislip, heat sealable plastic flexible packaging bag and method and apparatus for its production

    公开(公告)号:US10703039B2

    公开(公告)日:2020-07-07

    申请号:US16304403

    申请日:2017-04-20

    Applicant: FLEXINNOVA KFT

    Abstract: An antislip, heat sealable plastic packaging bag, is formed from an antislip flexible packaging material whose wall has an average surface weight of at most 500 g/m2. The packaging material includes a multiplicity of randomly distributed, separate antislip protrusions of a first substance. The protrusion height is between 50 micrometres and 10000 micrometres, with an average of top-plan-view aspect ratios of the antislip protrusions being at most 5.0. Some antislip protrusions have a hidden surface portion being a portion of a free surface of the antislip protrusion, which the antislip protrusion covers from a viewer in a top plan view of the wall. The first substance is a thermoplastic polymer, and the wall's outer surface is of a substance at least somewhat different from the first substance. It is an important feature that the first substance has a melt mass flow rate of at least 0.6 g/10 min. An apparatus, for producing the packaging material, includes a film blowing die head, a cooling air ring, and a particle dispersing unit therebetween, for dispersing polymer particles on the bubble neck at a place in, or closely under, an expanding area where the bubble has a divergent shape.

    Antislip flexible materials and methods for their making and use

    公开(公告)号:US11529647B2

    公开(公告)日:2022-12-20

    申请号:US16304587

    申请日:2017-04-20

    Applicant: FLEXINNOVA KFT

    Abstract: A method for forming an antislip material. A flexible thermoplastic carrier is provided. A hot release surface is provided. Provided is a first layer of discrete thermoplastic particles, sifting on the hot release surface. The discrete particles are above their softening temperatures, providing in the first layer a tackiness. The method includes contacting the carrier with the tacky first layer for sticking the first layer to the carrier, and thereafter removing the carrier, and therewith the tacky first layer stuck to the carrier, from the release surface. Thereby the carrier is provided with a hot, preferably discontinuous and/or elastomeric antislip coating. With a heat energy of the hot coating a bond is formed between the carrier and the coating. The removing of the carrier includes pulling the carrier out of the contact with a pulling-out force. The temperature of the hot release surface is above the melting temperature of the carrier. The carrier would be spoiled, if heated completely to the temperature of the release surface and simultaneously pulled with the pulling-out force. Therefore the contacting time is kept shorter than a minimum time required by a heat of the hot release surface for spoiling the carrier. Flat-topped roughening projections can be included in the antislip coating.

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