Abstract:
Provided are: a composition for forming an underlayer film in an imprinting method, which includes a high-molecular-weight compound having a polymerizable functional group and a monomer having a plurality of crosslinking functional groups capable of being bonded to the polymerizable functional group, and in which a Hansen solubility parameter distance, which is a difference between a Hansen solubility parameter of the high-molecular-weight compound and a Hansen solubility parameter of the monomer, is 5.0 or less, and regarding the two crosslinking functional groups among the plurality of crosslinking functional groups, the number of atoms, which constitute a shortest atom chain mutually linking crosslinking points in the respective crosslinking functional groups, is 7 or more; a laminate including a layer formed of the composition for forming an underlayer film; and a method for manufacturing a semiconductor element, in which a semiconductor element is manufactured using a pattern obtained by a pattern producing method.
Abstract:
There are provided a composition having excellent adhesiveness and wettability, an adhesive film, a laminate, a method for producing a cured product pattern, and a method for manufacturing a circuit substrate. A composition for forming an adhesive film for imprinting, includes a compound 1 or a compound group 2; and a solvent, in which the compound 1 and the like is a compound decomposable into two or more compounds in a case where a polarity conversion group is treated, and at least one compound has a molecular weight of 30 to 400, and at least one compound has a molecular weight of 1,000 or more, the compound 1: a compound is a resin having a polymerizable group and a polarity conversion group, in which the resin has the polarity conversion group in at least a main chain or a side chain, the polarity conversion group is bonded to the main chain of the resin via a linking group in a case where the polarity conversion group is provided in the side chain, and the number of atoms constituting a chain of the linking group is 8 or more; and the compound group 2: a compound that has a polymerizable group and does not have a polarity conversion group, and a compound that does not have a polymerizable group and has a polarity conversion group.
Abstract:
A polarizing plate of the present invention includes polarizing plate protective film(s) on one or both sides of a polarizer, wherein the polarizing plate protective film contains a compound represented by general formula (I) or (II) described below, the polarizer contains iodine, and the content of the iodine within the polarizer is 4.0 wt % or greater.
Abstract:
Provided is a polarizer durable against high-temperature and high-humidity conditions, small in changes in the single plate transmittance, and a liquid crystal display device. A polarizer comprising a polyvinyl alcohol-based resin, a dichroic colorant, and a compound, etc. represented by the formula (1) below, the content of the compound represented by the formula (1) being 0.01 to 30 parts by mass relative to 100 parts by mass of the polyvinyl alcohol based resin. In the formula (1), each of Ri and R3 independently represents a hydrogen atom, C1-20 straight-chain alkyl group, C3-20 branched alkyl group, C3-20 cycloalkyl group, 02-20 alkenyl group or C6-20 aromatic group, and R5 represents a substituent.
Abstract:
The present invention provides a composition for a semiconductor device, where the composition is such that the removability of residues is excellent and the dissolution of tungsten is further suppressed. The composition for a semiconductor device contains a resin having a repeating unit A derived from a polymerizable compound containing a nitrogen atom and water, where a ClogP of the polymerizable compound is 0.5 or more and a solubility of the resin in water at 25° C. is 0.01% by mass or more.
Abstract:
Provided are a curable composition for imprinting, which contains a polymerizable compound and a polymerization initiator, in which one of components contained in the composition is a compound which includes a 5-membered ring structure having two or more heteroatoms as ring members; a cured substance of the curable composition for imprinting; an imprint pattern producing method using the curable composition for imprinting; and a method for manufacturing a device, which includes the imprint pattern producing method.
Abstract:
Provided are: a curable composition for imprinting, which contains a compound C represented by Formula (C1) and a radical polymerization initiator; a kit including the curable composition; a pattern producing method using the curable composition; and a method for manufacturing a semiconductor element, which includes the pattern producing method as a step.
Abstract:
The curable composition for imprinting includes: a compound represented by the following Formula (1); a radically polymerizable compound other than the compound represented by Formula (1); and a photoradical polymerization initiator, in Formula (1), R1 and R2 each independently represent a hydrogen atom or an organic group having 1 to 8 carbon atoms and may be bonded to each other to form a ring, R3 represents a monovalent organic group, and R4 and R5 each independently represent a hydrogen atom or a monovalent organic group.
Abstract:
There are provided a composition for forming an adhesive film for imprinting having excellent adhesiveness and wettability, an adhesive film, a laminate, a method for producing a cured product pattern, and a method for manufacturing a circuit substrate. A composition for forming an adhesive film for imprinting contains a resin having a polymerizable group; and a solvent, in which the resin has at least one kind of a repeating unit derived from a polymerizable compound having a C log P value less than or equal to 0, and solubility of the resin in water at 25° C. is greater than or equal to 1 mass %, provided that the C log P value is a coefficient showing affinity of an organic compound with respect to water and 1-octanol.
Abstract:
Provided are a curable composition used for forming an interlayer existing between a base material and a curable layer, the curable composition including a curable main agent having a polymerizable functional group, a polymerization inhibitor, and a solvent, in which a content of the polymerization inhibitor is 1 part by mass or greater and lower than 1,000 parts by mass with respect to 1,000,000 parts by mass of the curable main agent; a kit including the curable composition; an interlayer formed from the curable composition; a laminate including the interlayer; an imprint pattern producing method using the laminate; and a method for manufacturing a device including the imprint pattern producing method.