公开(公告)号：US20160192498A1

公开(公告)日：2016-06-30

申请号：US15062480

申请日：2016-03-07

Applicant: FUJITSU LIMITED

Inventor： Teru Nakanishi ,  Nobuyuki Hayashi ,  Masaru Morita ,  Yasuhiro YONEDA

IPC: H05K1/18

CPC classification number: H05K1/0296 ,  H01L23/13 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/4985 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/1379 ,  H01L2224/13839 ,  H01L2224/13847 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15311 ,  H05K1/181 ,  H05K3/3436 ,  H05K2201/10287 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10719 ,  Y02P70/613 ,  H01L2924/00

Abstract: A semiconductor device includes: a wiring board including a first electrode pad on a surface thereof; a circuit board disposed to stand on the wiring board, and including an interconnection connected to the first electrode pad; and a semiconductor package disposed to face the wiring board with the circuit board interposed therebetween, and including a second electrode pad on a surface thereof, the second electrode pad being connected to the interconnection.

Abstract translation: 半导体器件包括：布线板，其表面上包括第一电极焊盘; 电路板，被布置成站立在所述布线板上，并且包括连接到所述第一电极焊盘的互连; 以及半导体封装，其设置成与所述布线板面对所述电路板，并且在其表面上包括第二电极焊盘，所述第二电极焊盘连接到所述互连。

公开(公告)号：US20160192479A1

公开(公告)日：2016-06-30

申请号：US15062477

申请日：2016-03-07

Applicant: FUJITSU LIMITED

Inventor： Teru Nakanishi ,  Nobuyuki Hayashi ,  Masaru Morita ,  Yasuhiro YONEDA

IPC: H05K1/02

CPC classification number: H05K1/0296 ,  H01L23/13 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/4985 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/1379 ,  H01L2224/13839 ,  H01L2224/13847 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15311 ,  H05K1/181 ,  H05K3/3436 ,  H05K2201/10287 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10719 ,  Y02P70/613 ,  H01L2924/00

Abstract: A semiconductor device includes: a wiring board including a first electrode pad on a surface thereof; a circuit board disposed to stand on the wiring board, and including an interconnection connected to the first electrode pad; and a semiconductor package disposed to face the wiring board with the circuit board interposed therebetween, and including a second electrode pad on a surface thereof, the second electrode pad being connected to the interconnection.

公开(公告)号：US20130139998A1

公开(公告)日：2013-06-06

申请号：US13751564

申请日：2013-01-28

Applicant: FUJITSU LIMITED

Inventor： Nobuyuki HAYASHI ,  Yasuhiro YONEDA ,  Teru NAKANISHI ,  Masaru MORITA

IPC: F28F9/00

CPC classification number: F28F9/00 ,  H01L23/473 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/09701 ,  H01L2924/15311 ,  H05K7/20236

Abstract: A cooling system includes a first cooling part to cool a connecting part of a heating element with a first coolant having an electrical insulating property, the connecting part providing electrical connection between the heating element and a board, and a second cooling part to cool another part of the heating element with a second coolant, said other part being different from the connecting part.

Abstract translation: 冷却系统包括第一冷却部分，用于利用具有电绝缘性能的第一冷却剂来冷却加热元件的连接部分，所述连接部分提供加热元件和板之间的电连接，以及第二冷却部件以冷却另一部件 所述加热元件具有第二冷却剂，所述另一部分与所述连接部分不同。