公开(公告)号：US20200286874A1

公开(公告)日：2020-09-10

申请号：US16806256

申请日：2020-03-02

Applicant: FUJITSU OPTICAL COMPONENTS LIMITED

Inventor： Kento TAKAHASHI ,  Teruhiro KUBO ,  Hiroshi KOBAYASHI

IPC: H01L25/16 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/66 ,  H01P3/00 ,  H01P11/00 ,  H01L21/48 ,  H01L21/56

Abstract: An optical module includes an optical semiconductor chip including a first electrode pad, a second electrode pad, and a third electrode pad arranged between the first electrode pad and the second electrode pad, a wiring substrate on which the optical semiconductor chip is flip-chip mounted, including a fourth electrode pad, a fifth electrode pad, and a sixth electrode pad arranged between the fourth electrode pad and the fifth electrode pad, a first conductive material connecting the first electrode pad with the fourth electrode pad, a second conductive material connecting the second electrode pad with the fifth electrode pad, a third conductive material arranged between the first conductive material and the second conductive material, connecting the third electrode pad with the sixth electrode pad, and a resin provided in an area on the second conductive material side of the third conductive material between the optical semiconductor chip and the wiring substrate.

公开(公告)号：US20200174205A1

公开(公告)日：2020-06-04

申请号：US16695720

申请日：2019-11-26

Applicant: FUJITSU LIMITED ,  Fujitsu Optical Components Limited

Inventor： Teruhiro KUBO ,  Kohei SHIBATA ,  Hiroshi KOBAYASHI ,  Naoki ISHIKAWA

IPC: G02B6/42 ,  H01L23/13 ,  H01L23/498 ,  H01L23/367 ,  H01L23/00 ,  H05K1/18 ,  H05K1/11 ,  H05K5/06 ,  H05K5/02 ,  H05K5/00

Abstract: An optical component configured to be mounted on a circuit board has a casing made of a ceramic electrical insulator and having a cavity, a photonic circuit device provided in the cavity, a lid configured to cover the cavity, and protruding electrodes provided along an outer periphery of the cavity of the casing, wherein a first linear expansion coefficient of the casing is smaller than a second linear expansion coefficient of the circuit board, and a third linear expansion coefficient of the lid is greater than the second linear expansion coefficient of the circuit board.