公开(公告)号：US20220151060A1

公开(公告)日：2022-05-12

申请号：US17445738

申请日：2021-08-24

Applicant: NGK Electronics Devices, Inc. ,  NGK Insulators, Ltd. ,  Fujitsu Optical Components Limited

Inventor： Noboru KUBO ,  Masato ISHIZAKI ,  Kento TAKAHASHI

IPC: H05K1/02 ,  H05K1/14 ,  H05K1/11 ,  G02B6/42

Abstract: A terminal substrate includes a signal terminal disposed on a terminal surface of an insulation ceramic layer. An insulation resin layer of a flexible substrate includes a first surface facing the terminal surface, and a second surface on an opposite side of the first surface. A first signal pad disposed on the first surface is joined to the signal terminal. A first penetration conductive part penetrates the insulation resin layer from the first signal pad. A first signal line is disposed on the second surface. A second penetration conductive part penetrates the insulation resin layer from the first signal line. A second signal line is disposed on the first surface. A third penetration conductive part penetrates the insulation resin layer from the second signal line. A second signal pad is disposed on the second surface.

公开(公告)号：US20200286874A1

公开(公告)日：2020-09-10

申请号：US16806256

申请日：2020-03-02

Applicant: FUJITSU OPTICAL COMPONENTS LIMITED

Inventor： Kento TAKAHASHI ,  Teruhiro KUBO ,  Hiroshi KOBAYASHI

IPC: H01L25/16 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/66 ,  H01P3/00 ,  H01P11/00 ,  H01L21/48 ,  H01L21/56

Abstract: An optical module includes an optical semiconductor chip including a first electrode pad, a second electrode pad, and a third electrode pad arranged between the first electrode pad and the second electrode pad, a wiring substrate on which the optical semiconductor chip is flip-chip mounted, including a fourth electrode pad, a fifth electrode pad, and a sixth electrode pad arranged between the fourth electrode pad and the fifth electrode pad, a first conductive material connecting the first electrode pad with the fourth electrode pad, a second conductive material connecting the second electrode pad with the fifth electrode pad, a third conductive material arranged between the first conductive material and the second conductive material, connecting the third electrode pad with the sixth electrode pad, and a resin provided in an area on the second conductive material side of the third conductive material between the optical semiconductor chip and the wiring substrate.