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公开(公告)号：US20230139978A1
公开(公告)日：2023-05-04
申请号：US17452816
申请日：2021-10-29
Applicant: Ferric Inc.
Inventor： Francesco Carobolante , James T. Doyle , Noah Andrew Sturcken
Abstract: An assembly includes a three-level voltage converter and a second voltage converter. The three-level voltage converter is electrically coupled to a battery to convert a battery supply voltage to an intermediate voltage. The second voltage converter is electrically coupled to the three-level voltage converter to convert the intermediate voltage to a processor-supply voltage to operate a processor. At least the second voltage converter and the processor are mounted on a processor-package substrate. The three-level voltage converter can be mounted on the processor-package substrate or on a circuit board on which the processor-package substrate is mounted.
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公开(公告)号：US20160211317A1
公开(公告)日：2016-07-21
申请号：US15082260
申请日：2016-03-28
Applicant: Ferric Inc.
Inventor： Noah Andrew Sturcken , Ryan Davies
IPC: H01L49/02 , H01L21/3205
CPC classification number: H01L28/10 , H01L21/32051 , H01L23/5223 , H01L23/5227 , H01L23/645 , H01L2924/0002 , H01L2924/00
Abstract: Integrated multi-layer magnetic films for use in passive devices in microelectronic applications and methods of manufacture thereof. Soft ferromagnetic materials exhibiting high permeability and low coercivity are laminated together with insulating layers interposed. Electrical conductors coupled to interconnects are magnetically coupled to magnetic film layers to engender an inductor (self and mutual). Soft ferromagnetic materials are provided in an alternating array of parallel plate capacitors. Each alternating magnetic film is electrically coupled to either a primary or secondary electrical conductor interconnects and separated by an electrically insulating dielectric material. Alternatively, each alternating magnetic layer comprises an induced anisotropy material, which can also be combined with coiled conductor giving rise to a hybrid inductive/capacitive device. Also, soft ferromagnetic material are also selected and tuned to provide for FMR notch filtering.
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公开(公告)号：US11929673B2
公开(公告)日：2024-03-12
申请号：US17452816
申请日：2021-10-29
Applicant: Ferric Inc.
Inventor： Francesco Carobolante , James T. Doyle , Noah Andrew Sturcken
Abstract: An assembly includes a three-level voltage converter and a second voltage converter. The three-level voltage converter is electrically coupled to a battery to convert a battery supply voltage to an intermediate voltage. The second voltage converter is electrically coupled to the three-level voltage converter to convert the intermediate voltage to a processor-supply voltage to operate a processor. At least the second voltage converter and the processor are mounted on a processor-package substrate. The three-level voltage converter can be mounted on the processor-package substrate or on a circuit board on which the processor-package substrate is mounted.
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公开(公告)号：US10028385B2
公开(公告)日：2018-07-17
申请号：US14991111
申请日：2016-01-08
Applicant: Ferric Inc.
Inventor： Noah Andrew Sturcken
IPC: H01F7/06 , H05K1/18 , H05K1/16 , H05K1/11 , H01F27/24 , H01F27/28 , H01F41/02 , H01F41/04 , H05K1/02
Abstract: An inductor is integrated into a multilevel wiring network of a semiconductor integrated circuit. The inductor includes a planar magnetic core and a conductive winding. The conductive winding turns around in generally spiral manner on the outside of the planar magnetic core. The conductive winding is piecewise constructed of wire segments and of VIAs. The wire segments pertain to at least two wiring planes and the VIAs are interconnecting the at least two wiring planes. Methods for such integration, and for fabricating laminated planar magnetic cores are also presented.
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Patent Agency Ranking
公开(公告)号：US20150171157A1
公开(公告)日：2015-06-18
申请号：US14571649
申请日：2014-12-16
Applicant: Ferric Inc.
Inventor： Noah Andrew Sturcken , Ryan Davies
CPC classification number: H01L28/10 , H01L21/32051 , H01L23/5223 , H01L23/5227 , H01L23/645 , H01L2924/0002 , H01L2924/00
Abstract: Integrated multi-layer magnetic films for use in passive devices in microelectronic applications and methods of manufacture thereof. Soft ferromagnetic materials exhibiting high permeability and low coercivity are laminated together with insulating layers interposed. Electrical conductors coupled to interconnects are magnetically coupled to magnetic film layers to engender an inductor (self and mutual). Soft ferromagnetic materials are provided in an alternating array of parallel plate capacitors. Each alternating magnetic film is electrically coupled to either a primary or secondary electrical conductor interconnects and separated by an electrically insulating dielectric material. Alternatively, each alternating magnetic layer comprises an induced anisotropy material, which can also be combined with coiled conductor giving rise to a hybrid inductive/capacitive device. Also, soft ferromagnetic material are also selected and tuned to provide for FMR notch filtering.
Abstract translation: 用于微电子应用中的无源器件的集成多层磁性膜及其制造方法。 表现出高磁导率和低矫顽力的软铁磁材料层压在绝缘层上。 耦合到互连的电导体磁耦合到磁膜层以产生电感器（自相互）。 柔性铁磁材料以平行板电容器的交替阵列提供。 每个交替磁性膜电耦合到主电导体互连件或次电导体互连件，并由电绝缘电介质材料隔开。 或者，每个交变磁性层包括感应各向异性材料，其也可以与产生混合电感/电容器件的线圈导体组合。 此外，软铁磁材料也被选择和调谐以提供FMR陷波滤波。
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公开(公告)号：US09679958B2
公开(公告)日：2017-06-13
申请号：US15082260
申请日：2016-03-28
Applicant: Ferric Inc.
Inventor： Noah Andrew Sturcken , Ryan Davies
IPC: H01L21/32 , H01L49/02 , H01L23/522 , H01L23/64 , H01L21/3205
CPC classification number: H01L28/10 , H01L21/32051 , H01L23/5223 , H01L23/5227 , H01L23/645 , H01L2924/0002 , H01L2924/00
Abstract: Methods of manufacture of integrated multi-layer magnetic films for use in passive devices in microelectronic applications. Soft ferromagnetic materials exhibiting high permeability and low coercivity are laminated together with insulating layers interposed. Electrical conductors coupled to interconnects are magnetically coupled to magnetic film layers to engender an inductor (self and mutual). Soft ferromagnetic materials are provided in an alternating array of parallel plate capacitors. Each alternating magnetic film is electrically coupled to either a primary or secondary electrical conductor interconnects and separated by an electrically insulating dielectric material. Alternatively, each alternating magnetic layer comprises an induced anisotropy material, which can also be combined with coiled conductor giving rise to a hybrid inductive/capacitive device. Also, soft ferromagnetic material are also selected and tuned to provide for FMR notch filtering.
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公开(公告)号：US20160126008A1
公开(公告)日：2016-05-05
申请号：US14991111
申请日：2016-01-08
Applicant: Ferric Inc.
Inventor： Noah Andrew Sturcken
CPC classification number: H05K1/181 , H01F27/24 , H01F27/2804 , H01F41/02 , H01F41/041 , H05K1/0233 , H05K1/0298 , H05K1/0306 , H05K1/115 , H05K1/165 , H05K2201/086 , H05K2201/0929 , H05K2201/1003 , Y02P70/611 , Y10T29/4913
Abstract: An inductor is integrated into a multilevel wiring network of a semiconductor integrated circuit. The inductor includes a planar magnetic core and a conductive winding. The conductive winding turns around in generally spiral manner on the outside of the planar magnetic core. The conductive winding is piecewise constructed of wire segments and of VIAs. The wire segments pertain to at least two wiring planes and the VIAs are interconnecting the at least two wiring planes. Methods for such integration, and for fabricating laminated planar magnetic cores are also presented.
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公开(公告)号：US20180139846A1
公开(公告)日：2018-05-17
申请号：US15848884
申请日：2017-12-20
Applicant: Ferric Inc.
Inventor： Noah Andrew Sturcken
CPC classification number: H05K1/181 , H01F27/24 , H01F27/2804 , H01F41/02 , H01F41/041 , H05K1/0233 , H05K1/0298 , H05K1/0306 , H05K1/115 , H05K1/165 , H05K2201/086 , H05K2201/0929 , H05K2201/1003 , Y02P70/611 , Y10T29/4913
Abstract: An inductor is integrated into a multilevel wiring network of a semiconductor integrated circuit. The inductor includes a planar magnetic core and a conductive winding. The conductive winding turns around in generally spiral manner on the outside of the planar magnetic core. The conductive winding is piecewise constructed of wire segments and of VIAs. The wire segments pertain to at least two wiring planes and the VIAs are interconnecting the at least two wiring planes. Methods for such integration, and for fabricating laminated planar magnetic cores are also presented.
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公开(公告)号：US09647053B2
公开(公告)日：2017-05-09
申请号：US14571649
申请日：2014-12-16
Applicant: Ferric Inc.
Inventor： Noah Andrew Sturcken , Ryan Davies
IPC: H01L49/02 , H01L23/522 , H01L23/64 , H01L21/3205
CPC classification number: H01L28/10 , H01L21/32051 , H01L23/5223 , H01L23/5227 , H01L23/645 , H01L2924/0002 , H01L2924/00
Abstract: Integrated multi-layer magnetic films for use in passive devices in microelectronic applications and methods of manufacture thereof. Soft ferromagnetic materials exhibiting high permeability and low coercivity are laminated together with insulating layers interposed. Electrical conductors coupled to interconnects are magnetically coupled to magnetic film layers to engender an inductor (self and mutual). Soft ferromagnetic materials are provided in an alternating array of parallel plate capacitors. Each alternating magnetic film is electrically coupled to either a primary or secondary electrical conductor interconnects and separated by an electrically insulating dielectric material. Alternatively, each alternating magnetic layer comprises an induced anisotropy material, which can also be combined with coiled conductor giving rise to a hybrid inductive/capacitive device. Also, soft ferromagnetic material are also selected and tuned to provide for FMR notch filtering.
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