FINGERPRINT SENSOR MODULE AND METHOD FOR MANUFACTURING A FINGERPRINT SENSOR MODULE

    公开(公告)号:US20240161534A1

    公开(公告)日:2024-05-16

    申请号:US18549660

    申请日:2022-03-10

    Inventor: Zhimin Mo

    CPC classification number: G06V40/1306 G06K19/07354 G06V40/1329

    Abstract: A fingerprint sensor module comprising: a carrier comprising a first recessed portion on a first side of the carrier; a fingerprint sensing device arranged in the first recessed portion of the carrier, the fingerprint sensing device comprising a fingerprint sensing surface; a second recessed portion on a second side of the carrier, opposite the first side, and at an edge of the carrier and a connection pad arranged in the second recessed portion; and an electrical connection through the carrier connecting the fingerprint sensing device to the connection pad.

    BIOMETRIC IMAGING MODULE AND METHOD FOR MANUFACTURING A BIOMETRIC IMAGING MODULE

    公开(公告)号:US20230206017A1

    公开(公告)日:2023-06-29

    申请号:US17928341

    申请日:2021-06-23

    CPC classification number: G06K19/0718 G06V40/1318 G06K19/07722

    Abstract: Method for manufacturing a biometric imaging module, the method comprising: providing a carrier tape; forming a sensor opening and at least one contact pad opening in the carrier tape, wherein the sensor opening is adjacent to the contact pad opening; and from a top side of the carrier tape, arranging a biometric sensor on the carrier tape such that a body of the biometric sensor is arranged in the sensor opening and a conductive contact pad of the biometric sensor is aligned with and accessible through the contact pad opening from a backside of the carrier tape, and such that a sensing surface of the biometric sensor is facing in the same direction as the top side of the carrier tape.

    Biometric sensor module for card integration

    公开(公告)号:US11915079B2

    公开(公告)日:2024-02-27

    申请号:US17783063

    申请日:2020-12-02

    CPC classification number: G06K19/0718 G06K19/07728 G06V40/1306 G06V40/1329

    Abstract: A biometric sensor module for detecting a biometric feature of a user comprises: a biometric sensor comprising an array of sensing elements for acquiring sensing signals indicative of a biometric feature of a user, the array of sensing elements arranged facing towards a front side of the biometric sensor. Further, the biometric sensor module comprises a bottom flexible film attached to a back side, opposite the front side, of the biometric sensor. The bottom flexible film can carry at least one electrically conductive line electrically connectable to the biometric sensor and electrically connectable to an external electrical circuit. The biometric sensor module further comprises a top film attached to the biometric sensor closer to the front side of the biometric sensor than the bottom flexible film. The flexible film includes a bent portion such that the flexible film is bent towards the top film.

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