公开(公告)号：US09689915B2

公开(公告)日：2017-06-27

申请号：US14274889

申请日：2014-05-12

Applicant: FormFactor, Inc.

Inventor： Toshihiro Kasai ,  Masanori Watanabe ,  Yoichi Urakawa

IPC: G01R31/00 ,  G01R31/28

CPC classification number: G01R31/2887 ,  Y10T29/49117

Abstract: A probe card apparatus can comprise a tester interface to a test controller, probes for contacting terminals of electronic devices to be tested, and electrical connections there between. The probe card apparatus can comprise a primary sub-assembly, which can include the tester interface. The probe card apparatus can also comprise an interchangeable probe head, which can include the probes. The interchangeable probe head can be attached to and detached from the primary sub-assembly while the primary sub-assembly is secured to or in a housing of a test system. Different probe heads each having probes disposed in different patterns to test different types of electronic devices can thus be interchanged while the primary sub-assembly is secured to or in a housing of the test system.

公开(公告)号：US20140340103A1

公开(公告)日：2014-11-20

申请号：US14274889

申请日：2014-05-12

Applicant: FormFactor, Inc.

Inventor： Toshihiro Kasai ,  Masanori Watanabe

IPC: G01R1/067

CPC classification number: G01R31/2887 ,  Y10T29/49117

Abstract: A probe card apparatus can comprise a tester interface to a test controller, probes for contacting terminals of electronic devices to be tested, and electrical connections there between. The probe card apparatus can comprise a primary sub-assembly, which can include the tester interface. The probe card apparatus can also comprise an interchangeable probe head, which can include the probes. The interchangeable probe head can be attached to and detached from the primary sub-assembly while the primary sub-assembly is secured to or in a housing of a test system. Different probe heads each having probes disposed in different patterns to test different types of electronic devices can thus be interchanged while the primary sub-assembly is secured to or in a housing of the test system.

Abstract translation: 探针卡装置可以包括到测试控制器的测试器接口，用于接触要测试的电子设备的端子的探针以及其间的电连接。 探针卡装置可以包括主要子组件，其可以包括测试器接口。 探针卡装置还可以包括可互换探针头，其可以包括探针。 可互换探针头可以连接到主子组件并从主子组件拆卸，同时将主子组件固定到测试系统的壳体或壳体中。 因此，可以将主要子组件固定到测试系统的壳体中或其中的每个具有以不同图案设置的探针以测试不同类型的电子设备的不同探针头。

公开(公告)号：US20180164223A1

公开(公告)日：2018-06-14

申请号：US15835380

申请日：2017-12-07

Applicant: FormFactor, Inc.

Inventor： Nobuhiro Kawamata ,  Toshihiro Kasai ,  Hiromitsu Sasanami ,  Shigeki Mori

IPC: G01N21/88 ,  G02B27/09 ,  H04N1/028 ,  G01R31/28

CPC classification number: G01N21/8806 ,  G01J1/0418 ,  G01J1/08 ,  G01J1/32 ,  G01J1/42 ,  G01J2001/4252 ,  G01R31/2831 ,  G01R31/2889 ,  G01R31/311 ,  G02B27/0955 ,  H04N1/028 ,  H04N1/0288 ,  H04N1/02885

Abstract: Improved wafer-scale testing of optoelectronic devices, such as CMOS image scan devices, is provided. A probe card includes an LED light source corresponding to each device under test in the wafer. The LED light sources provide light from a phosphor illuminated by the LED. A pinhole and lens arrangement is used to collimate the light provided to the devices under test. Uniformity of illumination can be provided by closed loop control of the LED light sources using internal optical signals as feedback signals, in combination with calibration data relating the optical signal values to emitted optical intensity. Uniformity of illumination can be further improved by providing a neutral density filter for each LED light source to improve uniformity from one source to another and/or to improve uniformity of the radiation pattern from each LED light source.

公开(公告)号：US10352870B2

公开(公告)日：2019-07-16

申请号：US15835380

申请日：2017-12-07

Applicant: FormFactor, Inc.

Inventor： Nobuhiro Kawamata ,  Toshihiro Kasai ,  Hiromitsu Sasanami ,  Shigeki Mori

IPC: G01N21/88 ,  G01J1/42 ,  G02B27/09 ,  G01R31/28 ,  H04N1/028 ,  G01J1/08 ,  G01J1/32 ,  G01J1/04

Abstract: Improved wafer-scale testing of optoelectronic devices, such as CMOS image scan devices, is provided. A probe card includes an LED light source corresponding to each device under test in the wafer. The LED light sources provide light from a phosphor illuminated by the LED. A pinhole and lens arrangement is used to collimate the light provided to the devices under test. Uniformity of illumination can be provided by closed loop control of the LED light sources using internal optical signals as feedback signals, in combination with calibration data relating the optical signal values to emitted optical intensity. Uniformity of illumination can be further improved by providing a neutral density filter for each LED light source to improve uniformity from one source to another and/or to improve uniformity of the radiation pattern from each LED light source.