公开(公告)号：US11633908B2

公开(公告)日：2023-04-25

申请号：US16289737

申请日：2019-03-01

Applicant: Formlabs, Inc.

Inventor： Maximilian Zieringer ,  Alpay Kimyonok

IPC: B29C64/129 ,  B29C35/08 ,  B33Y70/10 ,  B33Y80/00 ,  B29K75/00 ,  B33Y10/00 ,  B29K33/00

Abstract: The present disclosure relates generally to curable resins, in particular latent cure resins, and related methods for use in an additive fabrication (e.g., 3-dimensional printing) device.

公开(公告)号：US20190270244A1

公开(公告)日：2019-09-05

申请号：US16289737

申请日：2019-03-01

Applicant: Formlabs, Inc.

Inventor： Maximilian Zieringer ,  Alpay Kimyonok

IPC: B29C64/129 ,  B29C35/08

Abstract: The present disclosure relates generally to curable resins, in particular latent cure resins, and related methods for use in an additive fabrication (e.g., 3-dimensional printing) device.