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公开(公告)号:US11633908B2
公开(公告)日:2023-04-25
申请号:US16289737
申请日:2019-03-01
Applicant: Formlabs, Inc.
Inventor: Maximilian Zieringer , Alpay Kimyonok
Abstract: The present disclosure relates generally to curable resins, in particular latent cure resins, and related methods for use in an additive fabrication (e.g., 3-dimensional printing) device.
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公开(公告)号:US20180312705A1
公开(公告)日:2018-11-01
申请号:US15962219
申请日:2018-04-25
Applicant: Formlabs, Inc.
Inventor: Dmitri Megretski , Maximilian Zieringer , Benjamin FrantzDale , Maxim Lobovsky
IPC: C09D11/101 , C09D11/037 , B33Y70/00
Abstract: The present application relates generally to photopolymer blends and related methods for use in an additive fabrication (e.g., 3-dimensional printing) device. According to some aspects, compositions are provided for the modification of a base photopolymer resin. The compositions may comprise colorant agent and/or cure-modifying composition. The compositions may be selected to cause, when combined with the base photopolymer resin to form a photo-curable composition, at least one property (e.g., color, depth of the cure) of the photo-curable composition to fall within a pre-determined range. Related kits and methods are also generally described.
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公开(公告)号:US11149156B2
公开(公告)日:2021-10-19
申请号:US15962219
申请日:2018-04-25
Applicant: Formlabs, Inc.
Inventor: Dmitri Megretski , Maximilian Zieringer , Benjamin FrantzDale , Maxim Lobovsky
IPC: C09D11/101 , C09D11/037 , B33Y70/00 , C08K5/00 , C08K3/013
Abstract: The present application relates generally to photopolymer blends and related methods for use in an additive fabrication (e.g., 3-dimensional printing) device. According to some aspects, compositions are provided for the modification of a base photopolymer resin. The compositions may comprise colorant agent and/or cure-modifying composition. The compositions may be selected to cause, when combined with the base photopolymer resin to form a photo-curable composition, at least one property (e.g., color, depth of the cure) of the photo-curable composition to fall within a pre-determined range. Related kits and methods are also generally described.
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公开(公告)号:US20190270244A1
公开(公告)日:2019-09-05
申请号:US16289737
申请日:2019-03-01
Applicant: Formlabs, Inc.
Inventor: Maximilian Zieringer , Alpay Kimyonok
IPC: B29C64/129 , B29C35/08
Abstract: The present disclosure relates generally to curable resins, in particular latent cure resins, and related methods for use in an additive fabrication (e.g., 3-dimensional printing) device.
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