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公开(公告)号：US20230319450A1
公开(公告)日：2023-10-05
申请号：US17933208
申请日：2022-09-19
Applicant: Fortemedia, Inc.
Inventor： Chih-Yuan CHEN , Feng-Chia HSU , Chun-Kai MAO , Jien-Ming CHEN , Wen-Shan LIN , Nai-Hao KUO
CPC classification number: H04R1/08 , H04R7/04 , H04R2201/003
Abstract: A MEMS structure is provided. The MEMS structure includes a substrate having an opening portion and a backplate disposed on one side of the substrate and having acoustic holes. The MEMS structure also includes a diaphragm disposed between the substrate and the backplate and extending across the opening portion of the substrate. The diaphragm includes a ventilation hole, and an air gap is formed between the diaphragm and the backplate. The MEMS structure further includes a protrusion extending into the air gap.
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公开(公告)号：US20200339411A1
公开(公告)日：2020-10-29
申请号：US16835805
申请日：2020-03-31
Applicant: Fortemedia, Inc.
Inventor： Jien-Ming CHEN , Feng-Chia HSU , Wen-Shan LIN , Hsin-Li LEE , Nai-Hao KUO
Abstract: A micro-electro-mechanical system (MEMS) microphone is provided. The MEMS microphone includes a substrate, a backplate disposed on a side of the substrate, a diaphragm movably disposed between the substrate and the backplate, and a plurality of slots formed on the diaphragm. The slots are spaced apart from each other and have a non-constant width to relieve the residual stress on the diaphragm.
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公开(公告)号：US20190210866A1
公开(公告)日：2019-07-11
申请号：US16025074
申请日：2018-07-02
Applicant: Fortemedia, Inc.
Inventor： Jien-Ming CHEN , Nai-Hao KUO , Wen-Shan LIN , Hsin-Li LEE
Abstract: A micro-electro-mechanical system (MEMS) microphone is provided. The MEMS microphone includes a substrate, a backplate, a diaphragm, a first insulating protrusion and a plurality of second insulating protrusions. The backplate is disposed on a side of the substrate. The diaphragm is disposed between the substrate and the backplate and is movable relative to the backplate. The first insulating protrusion and the second insulating protrusions are formed on the side of the backplate facing the diaphragm. The first insulating protrusion is connected to and affixed to the diaphragm permanently, and an air gap is formed between the diaphragm and each of the second insulating protrusions.
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公开(公告)号：US20240340598A1
公开(公告)日：2024-10-10
申请号：US18528924
申请日：2023-12-05
Applicant: Fortemedia, Inc.
Inventor： Chun-Kai MAO , Jien-Ming CHEN , Wen-Shan LIN , Nai-Hao KUO
CPC classification number: H04R19/04 , H04R1/08 , H04R7/02 , H04R2201/003
Abstract: A MEMS structure is provided. The MEMS structure includes a substrate having an opening portion and a backplate disposed on one side of the substrate. The backplate comprises a backplate conductive layer and a backplate insulating layer stacked with each other. The MEMS structure also includes a diaphragm disposed between the substrate and the backplate and extending across the opening portion of the substrate. The MEMS structure further includes a pillar structure connected with the backplate. The pillar structure comprises a pillar conductive layer and a pillar insulating layer stacked with each other.
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公开(公告)号：US20230319486A1
公开(公告)日：2023-10-05
申请号：US17937477
申请日：2022-10-03
Applicant: Fortemedia, Inc.
Inventor： Chun-Kai MAO , Chih-Yuan CHEN , Feng-Chia HSU , Jien-Ming CHEN , Wen-Shan LIN , Nai-Hao KUO
CPC classification number: H04R19/04 , H04R7/04 , H04R7/18 , B81B3/0072 , H04R2201/003 , B81B2201/0257 , B81B2203/0127
Abstract: A MEMS structure is provided. The MEMS structure includes a substrate having an opening portion and a backplate disposed on one side of the substrate. The MEMS structure also includes a diaphragm disposed between the substrate and the backplate. The opening portion of the substrate is under the diaphragm, and an air gap is formed between the diaphragm and the backplate. The MEMS structure further includes a pillar structure connected with the backplate and the diaphragm and a protection post structure extending from the backplate into the air gap. From a top view of the backplate, the protection post structure surrounds the pillar structure.
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Patent Agency Ranking
公开(公告)号：US20240015446A1
公开(公告)日：2024-01-11
申请号：US18050606
申请日：2022-10-28
Applicant: Fortemedia, Inc.
Inventor： Wen-Shan LIN , Chun-Kai MAO , Chih-Yuan CHEN , Jien-Ming CHEN , Feng-Chia HSU , Nai-Hao KUO
CPC classification number: H04R19/04 , B81B3/007 , H04R2201/003 , B81B2201/0257 , B81B2203/0127 , B81B2203/019
Abstract: A MEMS structure is provided. The MEMS structure includes a substrate and a backplate, the substrate has an opening portion, and the backplate is disposed on one side of the substrate and has acoustic holes. The MEMS structure also includes a diaphragm disposed between the substrate and the backplate, and the diaphragm extends across the opening portion of the substrate and includes outer ventilation holes and inner ventilation holes arranged in a concentric manner. The outer ventilation holes and the inner ventilation holes are relatively arranged in a ring shape and surround the center of the diaphragm. The MEMS structure further includes a pillar disposed between the backplate and the diaphragm. The pillar prevents the diaphragm from being electrically connected to the backplate.
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公开(公告)号：US20230063234A1
公开(公告)日：2023-03-02
申请号：US17715278
申请日：2022-04-07
Applicant: Fortemedia, Inc.
Inventor： Chih-Yuan CHEN , Jien-Ming CHEN , Feng-Chia HSU , Wen-Shan LIN , Nai-Hao KUO
Abstract: A micro-electro-mechanical system (MEMS) microphone is provided. The MEMS microphone includes a substrate, a diaphragm, a backplate and a first protrusion. The substrate has an opening portion. The diaphragm is disposed on one side of the substrate and extends across the opening portion of the substrate. The backplate includes a plurality of acoustic holes. The backplate is disposed on one side of the diaphragm. An air gap is formed between the backplate and the diaphragm. The first protrusion extends from the backplate towards the air gap.
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公开(公告)号：US20210037320A1
公开(公告)日：2021-02-04
申请号：US16934234
申请日：2020-07-21
Applicant: Fortemedia, Inc.
Inventor： Jien-Ming CHEN , Feng-Chia HSU , Wen-Shan LIN , Hsin-Li LEE , Nai-Hao KUO
Abstract: A micro-electro-mechanical system (MEMS) microphone is provided. The MEMS microphone includes a substrate, a backplate disposed on a side of the substrate, and a diaphragm movably disposed between the substrate and the backplate. The diaphragm includes a plurality of implantation portions, and the implantation portions have different concentration-depth profiles.
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公开(公告)号：US20230339742A1
公开(公告)日：2023-10-26
申请号：US17817151
申请日：2022-08-03
Applicant: Fortemedia, Inc.
Inventor： Jien-Ming CHEN , Wen-Shan LIN , Chun-Kai MAO , Feng-Chia HSU , Chih-Yuan CHEN , Nai-Hao KUO
IPC: B81B3/00
CPC classification number: B81B3/0021 , B81B2201/0257 , B81B2203/0127 , B81B2203/0353 , B81B2203/04 , B81B2203/051
Abstract: A MEMS structure is provided. The MEMS structure includes a substrate having an opening portion and a backplate disposed on one side of the substrate and having acoustic holes. The MEMS structure also includes a diaphragm disposed between the substrate and the backplate and extending across the opening portion of the substrate. The diaphragm includes ventilation holes, and an air gap is formed between the diaphragm and the backplate. The MEMS structure further includes a coverage structure disposed on the sidewall of at least one ventilation hole.
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公开(公告)号：US20230308809A1
公开(公告)日：2023-09-28
申请号：US17820618
申请日：2022-08-18
Applicant: Fortemedia, Inc.
Inventor： Chih-Yuan CHEN , Feng-Chia HSU , Chun-Kai MAO , Jien-Ming CHEN , Wen-Shan LIN , Nai-Hao KUO
CPC classification number: H04R19/04 , B81B3/007 , B81B2201/0257 , B81B2203/0127 , B81B2203/0307 , H04R2201/003
Abstract: A MEMS structure is provided. The MEMS structure includes a substrate having an opening portion and a backplate disposed on one side of the substrate and having acoustic holes. The MEMS structure also includes a diaphragm disposed between the substrate and the backplate and extending across the opening portion of the substrate. The diaphragm includes a ventilation hole, and an air gap is formed between the diaphragm and the backplate. The MEMS structure further includes a filler structure disposed on the diaphragm, and a portion of the filler structure is disposed in the ventilation hole.
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