公开(公告)号：US06168854A

公开(公告)日：2001-01-02

申请号：US09331621

申请日：1999-06-23

Applicant: Frank Robert Gibbs

Inventor： Frank Robert Gibbs

IPC: B32B700

CPC classification number: H05K3/062 ,  H05K1/0271 ,  H05K1/112 ,  H05K3/3473 ,  H05K2201/0305 ,  H05K2201/09781 ,  H05K2201/10636 ,  H05K2203/043 ,  H05K2203/0455 ,  Y02P70/611 ,  Y10S428/901 ,  Y10T428/24917

Abstract: A method of manufacturing a printed circuit board comprising a high density conductive pattern comprising at least one pad suitable for forming a solder connection with at least one surface mounted component. The method comprises the steps of forming the pattern; and forming a protective coating on the pattern suitable for soldering without solder resist adjacent the pad. The pad can adjoin land surrounding via hole, thereby increasing density of the circuit board layout. A further process for manufacturing printed circuits applies an etch resist to a conductive pattern, etches the pattern and uses the etch resist to form a protective coating on the pattern. The etch resist may be heated to cause the etch resist to form an alloy.

Abstract translation: 一种制造印刷电路板的方法，包括高密度导电图案，其包括至少一个适于与至少一个表面安装部件形成焊料连接的焊盘。 该方法包括形成图案的步骤; 以及在适合焊接的图案上形成保护涂层，而不需要邻近焊盘的阻焊剂。 垫可以邻接通孔周围的陆地，从而增加电路板布局的密度。 用于制造印刷电路的另一种方法是对导电图案施加蚀刻抗蚀剂，蚀刻图案并使用蚀刻抗蚀剂在图案上形成保护涂层。 可以加热蚀刻抗蚀剂以使蚀刻抗蚀剂形成合金。