公开(公告)号：US20160130136A1

公开(公告)日：2016-05-12

申请号：US14537529

申请日：2014-11-10

Applicant: Freescale Semiconductor, Inc.

Inventor： AKHILESH K. SINGH ,  DWIGHT L. DANIELS ,  DARREL R. FREAR ,  STEPHEN R. HOOPER

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81C1/00309 ,  B81B2201/0264 ,  B81B2207/012 ,  H01L23/26 ,  H01L23/29 ,  H01L23/3135 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49109 ,  H01L2924/00014

Abstract: A device in which an electronic circuit positioned within a cavity of a package housing is encased by a bubble restrictor material, with a media resistant material overlaying the bubble restrictor material. The bubble restrictor material functions to inhibit the formation and growth of moisture-related bubbles within the material, including at the interfaces of the material and surfaces within the package housing. The media resistant material is resistant to physical and chemical alterations by media within an external environment to which the device is exposed. The media resistant material and bubble resistant material function to transfer a sensed characteristic of the media to the electronic circuit.

Abstract translation: 一种装置，其中位于封装壳体的空腔内的电子电路由气泡限制器材料封装，覆盖着气泡限制器材料的耐介质材料。 气泡限制器材料用于抑制材料内的水分相关气泡的形成和生长，包括材料和包装壳体内表面的界面。 介质耐受材料在设备暴露于外部环境中的介质抵抗物理和化学变化。 耐介质材料和耐气泡材料的功能是将感测到的介质特性传递到电子电路。