Cooling device capable of reducing thickness of electronic apparatus
    1.
    发明申请
    Cooling device capable of reducing thickness of electronic apparatus 有权
    能减少电子设备厚度的冷却装置

    公开(公告)号:US20040095725A1

    公开(公告)日:2004-05-20

    申请号:US10664933

    申请日:2003-09-22

    Abstract: A fan housing of a fan unit includes a housing wall standing from the surface of a printed circuit board. The printed circuit board serves to establish the fan housing in cooperation with the housing wall. The fan housing further includes a ceiling wall connected to the housing wall. The ceiling wall extends along a datum plane parallel to the surface of the printed circuit board. A high speed airflow can be generated within the fan housing. The airflow promotes the heat radiation from the printed circuit board. An electrically conductive wiring pattern extending over the surface of the printed circuit board may further promote the heat radiation from the printed circuit board.

    Abstract translation: 风扇单元的风扇壳体包括从印刷电路板的表面竖立的壳体壁。 印刷电路板用于与壳体壁一起建立风扇壳体。 风扇壳体还包括连接到壳体壁的顶壁。 顶壁沿平行于印刷电路板表面的基准平面延伸。 风扇外壳内可能产生高速气流。 气流促进印刷电路板的热辐射。 在印刷电路板的表面上延伸的导电布线图形可以进一步促进来自印刷电路板的热辐射。

    Cooling device capable of reducing thickness of electronic apparatus
    2.
    发明申请
    Cooling device capable of reducing thickness of electronic apparatus 有权
    能减少电子设备厚度的冷却装置

    公开(公告)号:US20030053296A1

    公开(公告)日:2003-03-20

    申请号:US10096509

    申请日:2002-03-13

    Abstract: A fan housing of a fan unit includes a housing wall standing from the surface of a printed circuit board. The printed circuit board serves to establish the fan housing in cooperation with the housing wall. The fan housing further includes a ceiling wall connected to the housing wall. The ceiling wall extends along a datum plane parallel to the surface of the printed circuit board. A high speed airflow can be generated within the fan housing. The airflow promotes the heat radiation from the printed circuit board. An electrically conductive wiring pattern extending over the surface of the printed circuit board may further promote the heat radiation from the printed circuit board.

    Abstract translation: 风扇单元的风扇壳体包括从印刷电路板的表面竖立的壳体壁。 印刷电路板用于与壳体壁一起建立风扇壳体。 风扇壳体还包括连接到壳体壁的顶壁。 顶壁沿平行于印刷电路板表面的基准平面延伸。 风扇外壳内可能产生高速气流。 气流促进印刷电路板的热辐射。 在印刷电路板的表面上延伸的导电布线图形可以进一步促进来自印刷电路板的热辐射。

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