公开(公告)号：US20040144562A1

公开(公告)日：2004-07-29

申请号：US10740459

申请日：2003-12-22

Applicant: Fujitsu Limited

Inventor： Kiyoshi Ishikawa

IPC: H05K007/06

CPC classification number: H05K1/025 ,  H05K1/0237 ,  H05K1/0253 ,  H05K1/0298 ,  H05K1/117 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/094 ,  H05K2201/0969 ,  H05K2201/09845

Abstract: To provide a printed wiring board where the impedance between pads through which differential signals pass has been set to a predetermined standard value. The printed wiring board includes a first conductor layer extending over an area excluding a hole formed for each pad group and filled with a dielectric, and a second conductor layer extending over an area containing areas facing the hole. The hole encompasses a plurality of areas facing predetermined respective pads which are adjacent to each other and which form the pad group from among the plurality of pads.

Abstract translation: 为了提供印刷电路板，其中差分信号通过的焊盘之间的阻抗已经被设置为预定的标准值。 印刷布线板包括在除了为每个焊盘组形成并填充有电介质的孔之外的区域上延伸的第一导体层，以及在包含面向孔的区域的区域上延伸的第二导体层。 该孔包围面对预定相应焊盘的多个区域，这些区域彼此相邻并且从多个焊盘中形成焊盘组。