公开(公告)号：US08866270B2

公开(公告)日：2014-10-21

申请号：US14203912

申请日：2014-03-11

Applicant: Fujitsu Limited

Inventor： Manabu Watanabe ,  Masateru Koide ,  Kenji Fukuzono ,  Takashi Kanda

IPC: H01L21/00 ,  H01L21/50

CPC classification number: H01L21/50 ,  H01L21/82 ,  H01L29/06 ,  H01L2924/15311 ,  H01L2924/19106 ,  H05K1/141 ,  H05K3/323 ,  H05K3/368 ,  H05K2201/2018

Abstract: A semiconductor device mounting structure includes: a substrate with an opening provided therein; a frame member with a frame body and a protruding portion that protrudes from the frame body, the frame body being formed and accommodated in a groove around the opening; a coreless substrate provided above the substrate and supported by the protruding portion of the frame member; and semiconductor elements provided on the coreless substrate.

Abstract translation: 半导体器件安装结构包括：其中设置有开口的基板; 框架构件，其具有框架体和从框架体突出的突出部分，框体形成并容纳在围绕开口的凹槽中; 无芯基板，设置在所述基板的上方并由所述框架部件的突出部支撑; 以及设置在无芯基板上的半导体元件。

公开(公告)号：US08716839B2

公开(公告)日：2014-05-06

申请号：US13896739

申请日：2013-05-17

Applicant: Fujitsu Limited

Inventor： Manabu Watanabe ,  Masateru Koide ,  Kenji Fukuzono ,  Takashi Kanda

IPC: H01L23/544 ,  H01L29/40 ,  H01L29/06

CPC classification number: H01L21/50 ,  H01L21/82 ,  H01L29/06 ,  H01L2924/15311 ,  H01L2924/19106 ,  H05K1/141 ,  H05K3/323 ,  H05K3/368 ,  H05K2201/2018

Abstract: A semiconductor device mounting structure includes: a substrate with an opening provided therein; a frame member with a frame body and a protruding portion that protrudes from the frame body, the frame body being formed and accommodated in a groove around the opening; a coreless substrate provided above the substrate and supported by the protruding portion of the frame member; and semiconductor elements provided on the coreless substrate.

Abstract translation: 半导体器件安装结构包括：其中设置有开口的基板; 框架构件，其具有框架体和从框架体突出的突出部分，框体形成并容纳在围绕开口的凹槽中; 无芯基板，设置在所述基板的上方并由所述框架部件的突出部支撑; 以及设置在无芯基板上的半导体元件。

公开(公告)号：US10396020B2

公开(公告)日：2019-08-27

申请号：US15956829

申请日：2018-04-19

Applicant: FUJITSU LIMITED

Inventor： Kei Fukui ,  Youichi Hoshikawa ,  Hiromitsu Kobayashi ,  Hidehiko Fujisaki ,  Seigo Yamawaki ,  Masateru Koide ,  Manabu Watanabe ,  Daisuke Mizutani ,  Tomoyuki Akahoshi

IPC: H05K3/46 ,  H01L23/498 ,  H01L49/02 ,  H05K1/16

Abstract: A board includes a plate-shaped member having a first wiring pattern, a first resin layer formed on a first surface of the plate-shaped member, the first surface having the first wiring pattern, a second resin layer stacked on the first resin layer, and a component fixed to the second resin layer in which a second wiring pattern formed on a second surface of the component is buried.

公开(公告)号：US09515005B2

公开(公告)日：2016-12-06

申请号：US14269524

申请日：2014-05-05

Applicant: FUJITSU LIMITED

Inventor： Shunji Baba ,  Masateru Koide ,  Manabu Watanabe ,  Takashi Kanda ,  Kenji Fukuzono ,  Yuki Hoshino ,  Makoto Suwada

IPC: H01L23/473 ,  H05K1/02 ,  H05K1/18

CPC classification number: H01L23/473 ,  H01L2924/0002 ,  H05K1/021 ,  H05K1/181 ,  H01L2924/00

Abstract: A package mounting structure includes: a first substrate having wiring; a second substrate having wiring; at least one cooling unit having a first face and a second face different from the first face; at least one power supply unit that is mounted on the first substrate and is joined to the first face of the cooling unit; and at least one electronic component that is mounted on the second substrate and is joined to the second face of the cooling unit, wherein the power supply unit supplies power to the electronic component through the wiring of the first substrate, the cooling unit, and the wiring of the second substrate.

Abstract translation: 封装安装结构包括：具有布线的第一基板; 具有布线的第二基板; 至少一个冷却单元具有第一面和与第一面不同的第二面; 至少一个电源单元，其安装在所述第一基板上并且接合到所述冷却单元的所述第一面; 以及安装在第二基板上并与冷却单元的第二面接合的至少一个电子部件，其中，电源单元通过第一基板，冷却单元和第二基板的布线向电子部件供电 第二基板的布线。

公开(公告)号：US09006876B2

公开(公告)日：2015-04-14

申请号：US14225721

申请日：2014-03-26

Applicant: Fujitsu Limited

Inventor： Manabu Watanabe ,  Kenji Fukuzono ,  Shunji Baba

IPC: H01L23/02 ,  H01L23/34 ,  H01L23/00 ,  H01L23/13

CPC classification number: H01L24/90 ,  H01L23/13 ,  H01L23/32 ,  H01L23/562 ,  H01L24/81 ,  H01L2924/0002 ,  H05K3/303 ,  H05K3/3436 ,  H05K2201/10121 ,  H05K2201/2036 ,  H05K2203/167 ,  Y02P70/613 ,  H01L2924/0001

Abstract: A semiconductor apparatus includes: a package substrate on which a semiconductor device is disposed; a mounting board over which the package substrate is mounted; a first restraint that penetrates through the mounting board and the package substrate, and restrains deformation of the mounting board and the package substrate in a direction in which the mounting board and the package substrate are separated from each other; and a second restraint that is disposed between the mounting board and the package substrate, and restrains deformation of the mounting board and the package substrate in a direction in which the mounting board and the package substrate are closer to each other.

Abstract translation: 一种半导体装置，具备：配置有半导体装置的封装基板; 安装基板，其上安装有封装基板; 穿过安装板和封装基板的第一限制，并且使安装基板和封装基板在安装基板和封装基板分离的方向上受到限制; 以及设置在安装板和封装基板之间的第二约束，并且在安装基板和封装基板彼此靠近的方向上抑制安装基板和封装基板的变形。

公开(公告)号：US10181437B2

公开(公告)日：2019-01-15

申请号：US16001980

申请日：2018-06-07

Applicant: FUJITSU LIMITED

Inventor： Manabu Watanabe ,  Kenji Fukuzono ,  Yuki Hoshino ,  Masateru Koide

IPC: H01L23/498 ,  H01L21/48

Abstract: A package substrate includes a substrate, a first connection terminal mounted over the substrate, the first connection terminal including a first land and a second land on the substrate, a first solder resist surrounding the first land and the second land, and a first solder ball formed straddling the first land and the second land; and a second connection terminal which is mounted over the substrate and disposed adjacent to the first connection terminal, the second connection terminal including a third land and a fourth land on the substrate, a second solder resist surrounding the third land and the fourth land, and a second solder ball formed straddling the third land and the fourth land.

公开(公告)号：US09793189B2

公开(公告)日：2017-10-17

申请号：US15238062

申请日：2016-08-16

Applicant: FUJITSU LIMITED

Inventor： Manabu Watanabe

IPC: H05K7/20 ,  H01L23/367 ,  H01L23/31 ,  H01L23/498 ,  H05K3/36 ,  H01L21/48 ,  H05K1/14 ,  H05K1/18 ,  H05K3/34

CPC classification number: H01L23/3675 ,  H01L21/4853 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/3737 ,  H01L23/49811 ,  H01L23/49833 ,  H01L23/49838 ,  H01L2924/15159 ,  H01L2924/15311 ,  H05K1/141 ,  H05K1/181 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/066 ,  H05K2201/09036 ,  H05K2203/041 ,  H05K2203/0415

Abstract: A printed wiring board assembly includes a first board including a first surface; a second board including a second surface and facing the first surface; a plurality of first electrodes formed on a bottom surface of a recess formed in one of the first and the second surfaces; a plurality of second electrodes formed on the one of the first surface and the second surface and positioned outside the recess; a plurality of first solders each coupled to a respective one of the plurality of first electrodes; and a plurality of second solders each coupled to a respective one of the plurality of second electrodes, wherein the plurality of first electrodes are formed at a larger pitch than a pitch at which the plurality of second electrodes are formed, and a size of each the plurality of first solders is larger than a size of the plurality of second solders.

公开(公告)号：US11317520B2

公开(公告)日：2022-04-26

申请号：US16162470

申请日：2018-10-17

Applicant: FUJITSU LIMITED

Inventor： Masaharu Furuyama ,  Daisuke Mizutani ,  Tomoyuki Akahoshi ,  Masateru Koide ,  Manabu Watanabe ,  Seigo Yamawaki ,  Kei Fukui

IPC: H05K3/46 ,  H05K3/42 ,  H05K1/02 ,  H01G4/228 ,  H01G4/33 ,  H01L23/498 ,  H01L49/02 ,  H05K1/16

Abstract: A circuit board includes: an insulating layer; a capacitor which is provided in the insulating layer and which includes a dielectric layer, a first conductor layer provided on a first surface of the dielectric layer and including an opening part, and a second conductor layer provided on a second surface opposite to the first surface of the dielectric layer and including a recess part at a position corresponding to the opening part; and a conductor via provided in the insulating layer, penetrating the dielectric layer, the opening part and the recess part, being in contact with the recess part, and being smaller than the opening part in plan view.

公开(公告)号：US20140376187A1

公开(公告)日：2014-12-25

申请号：US14269524

申请日：2014-05-05

Applicant: FUJITSU LIMITED

Inventor： Shunji Baba ,  Masateru Koide ,  Manabu Watanabe ,  Takashi Kanda ,  Kenji Fukuzono ,  Yuki Hoshino ,  Makoto Suwada

IPC: H05K7/20

CPC classification number: H01L23/473 ,  H01L2924/0002 ,  H05K1/021 ,  H05K1/181 ,  H01L2924/00

Abstract: A package mounting structure includes: a first substrate having wiring; a second substrate having wiring; at least one cooling unit having a first face and a second face different from the first face; at least one power supply unit that is mounted on the first substrate and is joined to the first face of the cooling unit; and at least one electronic component that is mounted on the second substrate and is joined to the second face of the cooling unit, wherein the power supply unit supplies power to the electronic component through the wiring of the first substrate, the cooling unit, and the wiring of the second substrate.

Abstract translation: 封装安装结构包括：具有布线的第一基板; 具有布线的第二基板; 至少一个冷却单元具有第一面和与第一面不同的第二面; 至少一个电源单元，其安装在所述第一基板上并且接合到所述冷却单元的所述第一面; 以及安装在第二基板上并与冷却单元的第二面接合的至少一个电子部件，其中，电源单元通过第一基板，冷却单元和第二基板的布线向电子部件供电 第二基板的布线。