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公开(公告)号：US20170014929A1
公开(公告)日：2017-01-19
申请号：US15196632
申请日：2016-06-29
Applicant: FUJITSU LIMITED
Inventor： Tsuyoshi So , Hideo Kubo , Yoshinori Uzuka , Nobumitsu Aoki
CPC classification number: B23K1/0016 , B23K1/0012 , B23K35/00 , B23K35/025 , B23K35/3006 , B23K2101/14 , B23K2101/40 , H01L21/4882 , H01L23/4006 , H01L23/427 , H01L23/473 , H01L2224/16225 , H01L2224/73253 , H05K1/0204 , H05K1/0209 , H05K2201/066 , H05K2201/10409
Abstract: A disclosed method of joining a cooling component includes joining an electronic component and a spherical shaped bottom plate of a cooling component to each other by pressing the bottom plate against the electronic component, while providing a thermal bonding material between the bottom plate and the electronic component.
Abstract translation: 公开的连接冷却部件的方法包括通过将底板压靠电子部件将电子部件和冷却部件的球形底板彼此接合，同时在底板和电子部件之间提供热粘合材料 。
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2.发明申请COOLING DEVICE, ELECTRONIC APPARATUS AND METHOD OF ATTACHING COOLING DEVICE 审中-公开冷却装置，电子装置和连接冷却装置的方法公开(公告)号：US20150092347A1
公开(公告)日：2015-04-02
申请号：US14484859
申请日：2014-09-12
Applicant: FUJITSU LIMITED
Inventor： Tsuyoshi So , Keita Hirai , Yoshinori Uzuka
IPC: H05K7/20
CPC classification number: H05K7/20 , H01L23/4006 , H01L23/473 , H01L2023/4081 , H01L2924/0002 , Y10T29/49826 , H01L2924/00
Abstract: A cooling device includes a cooling member connected with a cooling pipe through which a cooling medium flows, a first fastening mechanism part provided at a first position on the cooling member and configured to fasten the cooling member and a substrate in a state where an electronic part to be cooled is sandwiched between the cooling member and the substrate, and a second fastening mechanism part provided at a second position on the cooling member that is different from the first position, the second position being located at a position where a first load exerted on the cooling member and a second load exerted on the cooling member maintain a balance in the electronic part, the first load being applied by the cooling pipe and the first fastening mechanism part, the second load being applied by the second fastening mechanism part.
Abstract translation: 冷却装置包括与冷却介质流过的冷却管连接的冷却部件，设置在冷却部件的第一位置的第一紧固机构部，其构造为在电子部件的状态下固定冷却部件和基板 待冷却被夹在冷却部件和基板之间，第二紧固机构部分设置在冷却部件上与第一位置不同的第二位置，第二位置位于施加在第一位置上的第一位置 冷却构件和作用在冷却构件上的第二负载保持电子部件的平衡，第一负载由冷却管和第一紧固机构部施加，第二负载由第二紧固机构部施加。
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3.发明申请DEW CONDENSATION DETECTING DEVICE, COOLING SYSTEM AND COOLING MEDIUM FLOW RATE CONTROLLING METHOD 审中-公开DEW冷凝检测装置，冷却系统和冷却介质流量控制方法公开(公告)号：US20150068702A1
公开(公告)日：2015-03-12
申请号：US14546013
申请日：2014-11-18
Applicant: FUJITSU LIMITED
Inventor： Tsuyoshi SO , Norihisa TAKAHASHI , Yoshinori Uzuka , Junichi Ogo , Susumu Takahashi
CPC classification number: F25D21/02 , F25D21/04 , G01N25/66 , H05K7/20272 , H05K7/20736
Abstract: A dew condensation detecting device includes a dew condensation detector and a heat transfer part. The dew condensation detector is provided to a supply pipe, which supplies a cooling medium from a cooling medium supply apparatus to a device to be cooled. The dew condensation detector detects a dew condensation by detecting a water droplet due to the dew condensation. The heat transfer part transfers heat from the cooling medium flowing in a return pipe, which returns the cooling medium from the device to be cooled to the cooling medium supply apparatus, to the cooling medium flowing in the supply pipe between the dew condensation detector and the device to be cooled.
Abstract translation: 结露检测装置包括结露检测器和传热部件。 露水冷凝检测器设置在供给管上，该供给管将冷却介质从冷却介质供给装置供给到待冷却装置。 露水冷凝检测器通过检测由于结露而产生的水滴来检测结露。 传热部件从在冷却介质从待冷却装置返回到冷却介质供给装置的返回管中流动的冷却介质的热量传递到在冷凝水检测器和冷凝器之间的供给管中流动的冷却介质 待冷却装置
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4.发明授权公开(公告)号：US10342164B2
公开(公告)日：2019-07-02
申请号：US15725319
申请日：2017-10-05
Applicant: FUJITSU LIMITED
Inventor： Tsuyoshi So , Osamu Aizawa , Keita Hirai , Koji Nakagawa , Yoshinori Uzuka , Nobumitsu Aoki , Naofumi Kosugi
IPC: H05K7/20
Abstract: A rack mount-type information processing apparatus includes: a plurality of slots, into each of which an electronic device is inserted, a liquid-cooled element provided in a cooling target included in the electronic device, a liquid to cool the cooling target being circulated in the liquid-cooled element; a manifold pipe extending in a direction where the slots are arranged; and a plurality of connection pipes configured to interconnect the liquid-cooled element and the manifold pipe, and coupled in parallel to the manifold pipe at a portion of the manifold pipe which corresponds to at least one slot among the plurality of slots.
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5.发明申请公开(公告)号：US20160021748A1
公开(公告)日：2016-01-21
申请号：US14740642
申请日：2015-06-16
Applicant: Fujitsu Limited
Inventor： HIRONOBU KAGEYAMA , Susumu Takahashi , Yoshinori Uzuka
CPC classification number: H05K1/181 , H01L23/3675 , H01L23/4006 , H01L23/50 , H01L23/552 , H01L2023/4062 , H01L2224/16225 , H01L2224/73253 , H01L2924/0002 , H01L2924/15311 , H01L2924/16152 , H05K1/0215 , H05K2201/10272 , H05K2201/10734 , Y02P70/611 , H01L2924/00
Abstract: A wiring board structure includes: a first wiring board includes a first interconnection and a second interconnection constituting a power supply route; a second wiring board mounted over the first wiring board and includes a third interconnection electrically coupled to the first interconnection; a semiconductor chip mounted over the second wiring board and electrically coupled to the third interconnection; a lid mounted over the second wiring board and electrically coupled to the semiconductor chip; and a coupler electrically couples the lid and the second interconnection to each other.
Abstract translation: 布线板结构包括：第一布线板，包括构成电源布线的第一布线和第二布线; 安装在所述第一布线板上并且包括电耦合到所述第一互连的第三互连的第二布线板; 半导体芯片，其安装在所述第二布线板上并电耦合到所述第三互连; 安装在所述第二布线板上并电耦合到所述半导体芯片的盖; 并且耦合器将盖和第二互连件彼此电耦合。
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Patent Agency Ranking
6.发明申请公开(公告)号：US20180132387A1
公开(公告)日：2018-05-10
申请号：US15725319
申请日：2017-10-05
Applicant: FUJITSU LIMITED
Inventor： Tsuyoshi So , Osamu Aizawa , Keita Hirai , Koji NAKAGAWA , Yoshinori Uzuka , Nobumitsu Aoki , NAOFUMI KOSUGI
IPC: H05K7/20
CPC classification number: H05K7/20772 , H05K7/20781
Abstract: A rack mount-type information processing apparatus includes: a plurality of slots, into each of which an electronic device is inserted, a liquid-cooled element provided in a cooling target included in the electronic device, a liquid to cool the cooling target being circulated in the liquid-cooled element; a manifold pipe extending in a direction where the slots are arranged; and a plurality of connection pipes configured to interconnect the liquid-cooled element and the manifold pipe, and coupled in parallel to the manifold pipe at a portion of the manifold pipe which corresponds to at least one slot among the plurality of slots.
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公开(公告)号：US20170127564A1
公开(公告)日：2017-05-04
申请号：US15269182
申请日：2016-09-19
Applicant: FUJITSU LIMITED
Inventor： Tsuyoshi So , Hideo Kubo , Yoshinori Uzuka , Nobumitsu Aoki
IPC: H05K7/20
CPC classification number: H05K7/20309 , H01L23/427 , H05K7/20136 , H05K7/20318 , H05K7/20327 , H05K7/20809
Abstract: A liquid loop cooling apparatus includes: an evaporator thermally coupled to a heating element; a condenser configured to be cooled by an airflow; a pump configured to circulate a refrigerant between the evaporator and the condenser; a first piping configured to couple the evaporator and the condenser; a second piping configured to couple the condenser and the pump; and a third piping configured to couple the pump and the evaporator, wherein the first piping is arranged on a destination side of the airflow, and the second piping is arranged on a source side of the airflow.
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公开(公告)号：US20160327996A1
公开(公告)日：2016-11-10
申请号：US15139846
申请日：2016-04-27
Applicant: FUJITSU LIMITED
Inventor： KENJI SASABE , Hideo Kubo , Tsuyoshi So , Nobumitsu Aoki , Masayuki Watanabe , Fumihiro TAWA , Yoshinori Uzuka
CPC classification number: G06F1/20 , F28D15/0233 , F28D15/0266 , F28D15/0275 , F28F2275/20 , G06F2200/201 , H01L23/4006 , H01L23/473
Abstract: A cooling module includes: a heat exchanger mounted on an electronic part mounted on a board, and that cools the electronic part; a leaf spring including an overhang portion and an extension portion, the overhang portion overhanging outward beyond the heat exchanger from the heat exchanger, and the extension portion extending from the overhang portion in a direction intersecting an overhang direction of the overhang portion when viewed in a thickness direction of the board; and a support member located around the heat exchanger, and fixed to the board, the extension portion bent toward the board being attached to the support member.
Abstract translation: 冷却模块包括：热交换器，其安装在安装在板上的电子部件上并冷却电子部件; 包括悬伸部分和延伸部分的板簧，所述伸出部分从所述热交换器向外突出超出所述热交换器，并且所述延伸部分从所述伸出部分沿与所述突出部分的悬垂方向相交的方向延伸， 板厚方向; 以及支撑构件，其位于所述热交换器的周围，并且固定到所述基板，所述延伸部朝向所述基板弯曲并附接到所述支撑构件。
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公开(公告)号：US20160309620A1
公开(公告)日：2016-10-20
申请号：US15069088
申请日：2016-03-14
Applicant: FUJITSU LIMITED
Inventor： Tsuyoshi So , Hideo Kubo , Nobumitsu Aoki , Yoshinori Uzuka
CPC classification number: F04D29/522 , F04D15/0011 , F04D29/245
Abstract: A pump includes: an impeller including a rotary shaft and a plurality of blades extending radially from the rotary shaft, a cutout or a hole is formed in each of the blades; a casing housing the impeller therein; an inlet provided to the casing, a thermal medium flows in the casing through the inlet; and an outlet provided to the casing, the thermal medium flows out of the casing through the outlet.
Abstract translation: 泵包括：叶轮，其包括旋转轴和从旋转轴径向延伸的多个叶片，在每个叶片中形成切口或孔; 在其中容纳叶轮的壳体; 设置到壳体的入口，热介质通过入口流入壳体; 以及设置到壳体的出口，热介质通过出口流出壳体。
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公开(公告)号：US20150062827A1
公开(公告)日：2015-03-05
申请号：US14326628
申请日：2014-07-09
Applicant: FUJITSU LIMITED
Inventor： Osamu Aizawa , Tsuyoshi So , Eiji Makabe , Yoshinori Uzuka
CPC classification number: H05K7/2049 , H01L21/4882 , H01L23/40 , H01L23/4006 , H05K7/20445
Abstract: A heat sink includes: a fixing unit fixed to a heating element; and a heat dissipation unit including a heat dissipation protruding portion and configured to slide with respect to the fixing unit.
Abstract translation: 散热器包括：固定到加热元件的固定单元; 以及散热单元，其包括散热突出部，并且被配置为相对于所述定影单元滑动。
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