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公开(公告)号:US09229065B2
公开(公告)日:2016-01-05
申请号:US13836181
申请日:2013-03-15
Applicant: GENESIS PHOTONICS INC
Inventor: Tai-Wei Wu , Tai-Cheng Tsai , Hsin-Hung Lin , Ping-Tsung Tsai , Pei-Yi Huang , Gwo-Jiun Sheu , Shou-Wen Hsu , Yun-Li Li
CPC classification number: G01R31/44 , G01J2001/4252 , G01R31/2635
Abstract: A detection apparatus for light-emitting diode chip comprising a substrate with the function of photoelectric conversion and a probing device is disclosed. The substrate is designed to bear at least one light-emitting diode chip. The probing device comprises a power supply and at least two conductive elements. The two ends of the conductive elements are respectively electrically connected to the light-emitting diode chip and the power supply to enable the light-emitting diode chip to emit light beams. Some of the light beams are emitted from the light-emitting diode chip toward the substrate such that the light beams emitted by the light-emitting diode chip are converted into an electric signal by the substrate.
Abstract translation: 公开了一种包括具有光电转换功能的基板和探测装置的发光二极管芯片的检测装置。 基板被设计成承载至少一个发光二极管芯片。 探测装置包括电源和至少两个导电元件。 导电元件的两端分别电连接到发光二极管芯片和电源,以使得发光二极管芯片能够发射光束。 一些光束从发光二极管芯片朝向基板发射,使得由发光二极管芯片发射的光束被基板转换成电信号。
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公开(公告)号:US20140159732A1
公开(公告)日:2014-06-12
申请号:US13836181
申请日:2013-03-15
Applicant: GENESIS PHOTONICS INC
Inventor: TAI-WEI WU , TAI-CHENG TSAI , Hsin-Hung Lin , Ping-Tsung Tsai , Pei-Yi Huang , Gwo-Jiun Sheu , Shou-Wen Hsu , YUN-LI LI
IPC: G01R31/44
CPC classification number: G01R31/44 , G01J2001/4252 , G01R31/2635
Abstract: A detection apparatus for light-emitting diode chip comprising a substrate with the function of photoelectric conversion and a probing device is disclosed. The substrate is designed to bear at least one light-emitting diode chip. The probing device comprises a power supply and at least two conductive elements. The two ends of the conductive elements are respectively electrically connected to the light-emitting diode chip and the power supply to enable the light-emitting diode chip to emit light beams. Some of the light beams are emitted from the light-emitting diode chip toward the substrate such that the light beams emitted by the light-emitting diode chip are converted into an electric signal by the substrate.
Abstract translation: 公开了一种包括具有光电转换功能的基板和探测装置的发光二极管芯片的检测装置。 基板被设计成承载至少一个发光二极管芯片。 探测装置包括电源和至少两个导电元件。 导电元件的两端分别电连接到发光二极管芯片和电源,以使得发光二极管芯片能够发射光束。 一些光束从发光二极管芯片朝向基板发射,使得由发光二极管芯片发射的光束被基板转换成电信号。
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