Mobile electronic device
    2.
    发明授权

    公开(公告)号:US11099610B1

    公开(公告)日:2021-08-24

    申请号:US16890993

    申请日:2020-06-02

    Inventor: Chia-Lung Chung

    Abstract: The present invention provides a mobile electronic device including a metal framework, a back cover and a frame. A motherboard is provided on an inner side of the metal framework, and a periphery of the metal framework forms an installation wall provided with a first wire connection opening. The back cover is superimposed on the metal framework and covers one side of the metal framework. The frame includes a functional frame bar disposed at the installation wall.

    Electronic device, external electronic component and assembly method thereof

    公开(公告)号:US12210382B2

    公开(公告)日:2025-01-28

    申请号:US17588163

    申请日:2022-01-28

    Inventor: Chia-Lung Chung

    Abstract: The invention relates to an external assembly component including a body, a housing and a buffer sleeve. The body is provided with a connector. The housing is provided with a notch, and a surrounding wall encircling the notch is erected on an outer side of the housing. The body is accommodated in the housing. The connector passes through the notch toward the outside, the surrounding wall encircles the connector, and the buffer sleeve covers the surrounding wall. Thus, a plug of the connector can be effectively protected from impact and damage, and waterproof and dustproof effects are provided.

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